At a glance
| Booth | I2129 |
| Country | TW |
| Website | www.malvernpanalytical.com/tw |
Company profile
Malvern Panalytical provides analytical technologies for semiconductor development spanning structural, elemental, and surface characterization, linking its measurement portfolio to materials optimization, process control, and research and development. With more than 92,000 instruments installed worldwide, the company states that its solutions support semiconductor companies through precise measurements, trusted data, and application expertise. Its integrated portfolio is positioned to support decision-making and sustainable progress in advanced electronics and next-generation manufacturing.
Exhibits
The analytical offering includes a particle-size-analyzer series intended to improve throughput efficiency and accelerate development of higher-quality products, X-ray fluorescence analyzers and related products for elemental analysis and thick-film material inspection, and XRD solutions applicable from universities and research institutions to industrial process laboratories. For semiconductor metrology, Malvern Panalytical offers advanced X-ray metrology solutions, tools, and technologies designed for non-destructive measurements across semiconductor-manufacturing stages, from material characterization to wafer inspection. The company describes metrology as supporting essential material characterization, measurements, and analyses, with structural and chemical-property information becoming increasingly important for process optimization, process control, yield enhancement, innovation, and development as feature sizes continue to decrease. Its metrology tools are described as continuously monitoring processes and providing fast feedback, helping improve manufacturing processes and yield while enabling early intervention when flaws or deviations from desired properties are identified. Because X-ray metrology is non-destructive, it can be integrated into processes without compromising sample integrity, supporting quality control as semiconductor-device requirements remain strict. For wafer inspection, the portfolio supports structural and chemical checks for defects, irregularities, and inhomogeneities before final-device functional testing, including wafer mapping of film thickness and composition, wafer mapping of crystal quality using rocking curves, and high-accuracy offcut measurements. The company states that controlling these properties is important for fabricating devices within design specifications, and that early detection can enhance yield while saving time and resources over the long term. The XRF 2830 ZT provides thickness and elemental-composition information for a wide range of thin films, including contamination and dopant levels and surface uniformity on wafers up to 300mm, and is identified as an advanced semiconductor thin-film metrology solution. The XRD portfolio includes X'Pert³ MRD and X'Pert³ MRD XL, which provide absolute, calibration-free information on crystal growth covering material composition, film thickness, grading profile, phase, and crystal quality; the MRD is positioned for research and development, while the MRD XL is positioned for research, development, and quality control. The Crystal Orientation Range provides fast and accurate orientation for boule, ingot, puck, and wafer applications, extending the semiconductor metrology portfolio beyond thin-film XRF and XRD measurements.
Capabilities and products
- particle size analyzers
- X-ray fluorescence elemental analysis
- XRF inspection of thick-film materials
- XRD material analysis
- non-destructive X-ray semiconductor metrology
- wafer mapping of film thickness and composition
- wafer mapping of crystal quality
- high-accuracy offcut measurements
- thin-film XRF metrology for wafers up to 300mm
- crystal orientation measurement for boules, ingots, and wafers