At a glance
| Booth | H0029 |
| Country | KR |
| Website | www.madde.co.kr |
Company profile
MADDE Inc applies 3D-printing manufacturing capabilities to SiC high-function parts intended to maintain performance in extreme environments, and describes SiC as having high heat resistance, light weight, oxidation resistance, radiation resistance, excellent mechanical strength, and chemical stability. Its 3D-printing-based manufacturing capabilities include Binder Jetting and WAAM, enabling it to make parts for diverse customer requirements quickly and at competitive prices. For RBSC, MADDE Inc applies its independently developed binder-jet 3D-printing technology to manufacture complex shapes precisely and flexibly, with a production system designed to provide design freedom, process efficiency, fast lead times, and stable supply from design through mass production. MADDE Inc directly manufactures high-purity RSiC products and uses 3D-printing-based process technology to combine shape freedom with precision for demanding environments including high-temperature semiconductor process equipment and nuclear components.
Exhibits
MADDE Inc offers an in-house built SiC 3D Printer, and layering Silicon Carbide powder with 3D printing reduces cost compared with conventional methods and increases process speed. RBSC is a ceramic manufacturing process in which high-temperature liquid silicon infiltrates a SiC formed body to induce reaction bonding, enabling high strength, heat resistance, and complex shapes; compared with conventional sintering, it provides better shape stability and dimensional precision and is widely used for parts in high-temperature and high-load environments such as aerospace, semiconductor, and energy applications. For SiC-based RBSC, MADDE Inc combines its independently developed binder-jet 3D-printing technology with the RBSC process to produce complex shapes precisely and flexibly. RSiC is a recrystallized material formed by bonding SiC particles without silicon, and performs well where high-temperature stability, high purity, and corrosion resistance are required; MADDE Inc directly manufactures RSiC products from high-purity SiC and uses 3D-printing-based process technology to achieve both shape freedom and precision. This RSiC technology operates stably in high-temperature and highly corrosive environments such as high-temperature semiconductor process equipment and nuclear components, and MADDE Inc reports rapidly increasing demand across multiple industries. WAAM is a 3D-printing technology that melts and deposits metal wire, substantially reducing cost and production time compared with traditional metal manufacturing while enabling large parts with complex shapes, fast lead times, and high production flexibility. MADDE Inc uses three multi-robot arms to maintain precision and quality while producing large parts quickly and efficiently, and is expanding WAAM applications across aerospace, automotive, ships, and heavy industry while continuing research and development. MADDE Inc also highlights SiC components and wafer carriers for demanding semiconductor manufacturing environments requiring thermal resistance, chemical resistance, and dimensional stability, including high-temperature and corrosive-chemical conditions.
Capabilities and products
- in-house manufacturing of SiC 3D printers
- binder-jet 3D printing of SiC parts
- manufacturing of complex RBSC reaction-bonded silicon carbide parts
- manufacturing of high-purity RSiC recrystallized silicon carbide parts
- WAAM additive manufacturing of large metal parts