At a glance
| Booth | R7004 |
| Country | TW |
| Website | www.mactech.com.tw |
Company profile
MACTECH CORPORATION was established in 2000 and holds ISO-9001 certification; it began with the design and creation of automation equipment and components including laser marking equipment, PCB routers, UV/Wafer Erase machines, UV lamps, porous ceramic vacuum modules, and ionizers. In 2008, MACTECH CORPORATION expanded its commitment to equipment components and high-technology product applications, including ionizers and room-type ionizers for semiconductor factories, with the stated purpose of improving production rate and quality. For Industry 4.0 applications, the company develops vibration sensors and electrostatic sensors with a data collector for 24-hour monitoring, forming a real-time Intelligent Unmanned Surveillance System.
Exhibits
The supplied equipment range includes Automotive curved surface lamination machine, Coater machine, Glass Edge strengthening and Polishing machine, LCD Mask Cleaner, OCA Lamination Automatic Line, Rubbing machine, G2.5-G8.5 Developer, Battery Pack Assembly, Battery Sorter, Battery Spot Welder, Ultrasonic vacuum cleaner, Automatic Laser Labeling Machine, Wafer Rapid Heating Cooling Module, Ionizer, Safety Light Curtains, Vibration Sensor, Static Sensor, Wafer UV Resist Hardening System, UV OZONE CLEANER, FOPLP wafer UV curing system, Wafer UV ERASE machine, Contact angle measure apparatus, Dry ultrasonic cleaning system, Roll to Roll Ultrasonic cleaning system, Advanced Packaging Dry Ultrasound Clean (DUC), and CPO Module Ultrasonic Non-Contact Dry Cleaning System. The Wafer Rapid Heating Cooling Module integrates heating and cooling on one stage, provides a temperature rise rate of at least 2.0℃/sec and a cooling rate of at least 3.0℃/sec, operates over a 50-250℃ setting range with a maximum hot-plate temperature of 250℃, and specifies temperature uniformity to ±3% at 250℃. This module supports Φ300/200/150mm wafers, has a maximum module diameter of Φ320mm and a 20mm stage thickness, and uses AC 220V 50/60Hz 1 Φ power; its base material is aluminum alloy and the product is positioned for high-throughput operation. Applications listed for the module include rapid wafer heating and cooling to improve throughput and thin-product applications in other industries such as glass, while equipment features include a thermal-shock-deformation-resistant design, wafer vacuum adsorption, high-precision surface processing, and a control box that can be matched with the customer's main system. For PLP and FOPLP semiconductor advanced-packaging panel transport, the Double Arm Robot for FOPLP performs horizontal transport of flat products with dual arms, supports products up to 700x700mm and loads up to 10kg, and uses a customized T-axis design and production approach. The robot specifies 1557mm travel on both R1 and R2 telescopic axes, 460mm Z-axis lift, 330° rotation, R1 and R2 speeds of 1300mm/sec, Z-axis speed of 400mm/sec, rotational speed of 2.62rad/sec, ±0.1mm repeatability on the R1, R2, and Z axes, a 1500mm TAxis, 200kg robot weight, a 10kg maximum payload, maximum moved glass size of W620×L750mm, and ISO Class 3 cleanliness. The FOPLP wafer UV curing system uses high-intensity ultraviolet irradiation to increase throughput, lists a minimum of 300mW/cm² in its feature summary and a minimum irradiance specification of 650mW/cm² over wavelengths from 220 to 450nm, supports wafer sizes of 300/200mm in the summary and Φ300/200/150mm in the specification table, and keeps product temperature below 60°C. The UV curing system specifies radiation distribution within a maximum of +-10% measured at five wafer points in H mode, clean and fast wafer handling, a space-saving and complete safety design, an 180 X 190 X 220 cm machine size, AC 380V/220V 50/60Hz 3 Φ power, wafer robot transfer using RWSE/RWDE, Manual / Auto LOAD PORT operation, PC BASE MMI process-condition setting, and optional SEMI S2 certification. Its stated applications include the FOPLP packaging wafer UV curing process, UV curing of wafer-surface glue or ink, temporary bonding and debonding, and advanced fan-out packaging, and the system can dock into a customer's production line.
Capabilities and products
- laser marking equipment
- PCB routers
- wafer UV erase machines
- porous ceramic vacuum modules
- ionizers for semiconductor factories
- vibration and electrostatic sensor monitoring systems
- wafer rapid heating and cooling modules
- double-arm robots for FOPLP panel transport
- FOPLP wafer UV curing systems
- UV ozone cleaners
- dry ultrasonic cleaning systems
- ultrasonic non-contact dry cleaning for CPO modules