At a glance
| Booth | L0800 |
| Country | TW |
| Website | www.macdermidalpha.com |
Company profile
MACDERMID PERFORMANCE SOLUTIONS TAIWAN LTD. provides materials and specialty-chemical technologies that support electronics interconnection through the Alpha, Compugraphics, Kester, and MacDermid Enthone brands. Its electronics business serves all global regions and addresses every step of device manufacturing within the different segments of the electronics supply chain. The organization brings together Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions, whose specialists collaborate on design, implementation, and technical service for customer programs. This cross-division model links material selection and process implementation with technical service rather than treating the products as standalone consumables. The company states that its solutions are intended to help customers manufacture electronic devices with high productivity and reduced cycle time. Its semiconductor materials and packaging technologies are developed for changing semiconductor-industry requirements, covering both manufacturing materials and package-related process needs. The customer base specifically includes global semiconductor packaging, microelectronic, and medical-device manufacturers that require high-performance materials for electronics production. Across these markets, the company combines specialty chemicals, materials, design support, implementation work, and technical service into a global electronics-manufacturing offering.
Exhibits
The materials portfolio spans electronics manufacturing from wafer fabrication through device assembly, providing an end-to-end set of process materials and solutions for semiconductor and broader electronics production. For printed-circuit-board manufacturing, the company describes itself as the largest provider of Direct Metallization technologies, with the stated objectives of increasing production speed, reducing cost, and improving reliability. For thermal-interface applications, it describes itself as the world's largest supplier of high-purity Indium sTIMs, intended to provide long-lasting reliability and stability in critical electronic systems. Its solder offering includes recycled tin solder, which the company presents as a sustainable, high-performance option for protection, reinforcement, and thermal management in electronics manufacturing. The portfolio also includes sintering solutions for die attach and modular attach, targeting applications that require thermal conductivity, mechanical strength, and efficient processing. These sintering materials are positioned for critical electronic applications where the attach layer must support high-performance operation while handling thermal and mechanical demands. Together, Direct Metallization, high-purity Indium sTIMs, recycled tin solder, and die- and modular-attach sintering solutions cover multiple interconnection and thermal-management points across electronics manufacturing. The semiconductor-related materials complement the company's broader packaging technologies, connecting wafer-fabrication requirements with later assembly and interconnection stages.
Capabilities and products
- high-performance materials for semiconductor packaging
- Direct Metallization technologies for PCB manufacturing
- high-purity Indium sTIMs
- recycled tin solder
- sintering solutions for die and module attach