At a glance
| Booth | M0734 |
| Country | TW |
| Website | www.lintec.com.tw |
Company profile
LINTEC Advanced Technologies (Taiwan) Inc. is a leading Japanese manufacturer in the field of pressure-sensitive adhesive materials, offering adhesive papers and films for seals and labels, packaging tapes, construction materials, automotive products, tapes for semiconductor manufacture, optically functional films, and health care products. It also develops and manufactures equipment designed for use with label materials and tapes, including label-printing machines, packaging machines, and electronic equipment. Its combined approach to materials and equipment is intended to address diverse customer needs in the adhesives market.
Exhibits
For semiconductor wafer backgrinding, LINTEC Advanced Technologies (Taiwan) Inc. provides the PCBL (Pattern Coating Before Lamination) process to improve thickness variation caused by circuit-etching steps on the wafer front side. The offering includes resin-coating equipment configurable to customer requirements and a fully automatic tape-transfer machine that moves a wafer from one iron ring to another. Its backgrinding protective-tape laminator uses press lamination for advanced thin wafers and high-solder-ball wafers, with fully automatic and semi-automatic models and 3 machine styles for different wafer sizes. A high-performance wafer laminator uses the Precut Tape method, with fully automatic and semi-automatic models and 5 machine styles for different wafer sizes. When used with backside-protection tape, the equipment can achieve good tape lamination on 300mm wafers. LC Tape is a substrate-free special adhesive tape mainly used in WLCSP to protect and reinforce chip backsides while suppressing light and reducing adverse effects on circuit surfaces. Because LC Tape is supplied in tape form, it can simplify processes and improve product-thickness uniformity, and low-temperature lamination can reduce heat-related damage to circuit surfaces. LC Tape has passed reliability testing under high-temperature and high-humidity conditions, has obtained global patent certification, can strengthen chips and reduce breakage when laminated to the wafer backside before dicing, and supports laser marking of manufacturer names and lot numbers on chip surfaces. The LC Tape lineup includes standard, high-reliability, infrared-transmissive, UV-curable, flame-retardant, and thermally conductive types, as well as LC86R Series for ultra-thin wafers and multifunction LC88 Series; RAD-3600 is recommended as the backside-protection-tape laminator to improve production-line reliability and process stability. D Series is a UV Curable Dicing Tape whose adhesion is reduced by UV irradiation to improve chip pickup, while G Series is presented as a long-term stable general-purpose tape. D Series provides adhesion strong enough to hold wafers and small chips during dicing, then lowers adhesion after UV exposure so that large chips can be picked up accurately. The dicing tape is described as avoiding metal-ion and adhesive-migration contamination in wafers and as not adversely affecting ICs during UV irradiation, with a diverse lineup for different customer processes and applications. Adhesive processing is performed in a Class 100 environment under U.S. Federal Standard 209b, and listed tape variants include D Series / G Series for dicing and LED transfer, RoHS2-compliant dicing tape, tape for glass wafers and stealth dicing, and tape for transmissive processes.
Capabilities and products
- pressure-sensitive adhesive material manufacturing
- tapes for semiconductor manufacturing
- PCBL wafer-backgrinding thickness-leveling process
- customizable resin coating equipment
- fully automatic wafer tape-transfer machine
- backgrinding protective-tape laminator for thin and high-solder-ball wafers
- high-performance wafer laminator using Precut Tape
- 300mm wafer backside-protection tape lamination
- WLCSP chip-backside protection and reinforcement tape
- low-temperature chip-backside protective-tape lamination
- UV-curable dicing tape
- long-term-stable general-purpose dicing tape
- LED transfer tape
- dicing tape for glass wafers and stealth dicing
- dicing tape for transmissive processes
- label-printing machine manufacturing
- packaging machine manufacturing
- adhesive papers and films for seals and labels
- packaging tapes
- construction materials
- automotive material products
- optically functional films
- health care products
- electronic equipment manufacturing