At a glance
| Booth | M0734 |
| Country | TW |
| Product categories | Backgrind; Slicing; Lapping; Polishing Equipment · Die Bonding; Attach Equipment · Lead Frame Taping Systems · Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment · Wafer Mount; Taping Equipment · Wire Bonding Equipment · Lamination; Sheet Laminating Equipment · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Tape Automated Bonding (TAB) Accessories |
| Website | www.lintec.com.tw |
Company profile
LINTEC is a leading Japanese manufacturer in the field of pressure-sensitive adhesive materials. We offer an extremely diverse range of products that includes adhesive papers and films for seals and labels, packaging tapes, construction materials, automotive products, tapes for use in semiconductor manufacture, optically functional films, and health care products. We also develop and manufacture a variety of equipment optimally designed for use with our label materials and tapes; included are label-printing machines, packaging machines and electronic equipment. Our comprehensive approach to both soft (materials) and hard (equipment) aspects of the business ensures a productive synergy, enabling us to cater to diverse customer needs in the adhesives market.
Capabilities and products
- adhesive papers and films for seals and labels
- backgrind, slicing, lapping and polishing equipment
- equipment designed for label materials and tapes
- label-printing machines
- packaging machines and electronic equipment
- pressure-sensitive adhesive materials
- tapes for semiconductor manufacture
- wafer mount and taping equipment