At a glance
| Booth | I3200 |
| Country | TW |
| Product categories | CV (capacitance-to-voltage) Probe systems · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Film Thickness; Thickness; Uniformity Measurement; Ellipsometer · Flat; Notch Finding System · Leak Detection Systems - Vacuum or Gas · Stress; Refractive Index; Reflectivity & Conductivity Measurement · Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation · Weight measurement; precision scales · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Crystal Growing & Machining Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Probe Card Maintenance and Analysis Systems · Consumables · Ingots · Compound Semiconductor substrates (GaAs on Silicon; GaN; InP; SiGe, etc.) · Epitaxial; Epi; Gettered; Internal Gettered Wafers · Etch; Strip; Cleaning Service · Parts Cleaning; Micro Contamination · Sawing; Lapping; Grinding; Polishing Service |
| Website | www.latentek.com.tw |
Company profile
Latent Technologies Inc. was founded in 2004 and headquartered in Taoyuan, Taiwan, Latent Technologies Inc. has over two decades of experience in the wide bandgap (WBG) compound semiconductor industry. The company specializes in silicon carbide (SiC) technologies and is dedicated to delivering one-stop solutions spanning materials, equipment, and process integration. With additional operations in Hsinchu and Shanghai, Latent serves a global customer base in semiconductors and high-power electronics. Leveraging its expertise in high-temperature materials and crystal growth processes, Latent’s business scope extends across the semiconductor value chain from upstream materials to equipment solutions. Its portfolio includes crystal growth furnaces, graphite materials, crucibles, wafer inspection systems, automation equipment, and critical components such as sensors and valves. The company also provides graphite purification and gas recycling systems, building strong capabilities in advanced process integration. In 2018, Latent introduced Taiwan’s first PVA graphite purification systems, further strengthening its material processing expertise. In 2020, the company established its wholly owned subsidiary, LEAP Semiconductor Corp., to expand into SiC materials. LEAP focuses on SiC wafers, epitaxial (epi) wafers, and related process services. Through this strategic expansion, the group has built a solid foundation covering materials, crystal growth, wafer processing, and epitaxy within the SiC supply chain. Latent is positioned as a key solution provider in the SiC ecosystem, driven by its strengths in equipment integration and process technology. Meanwhile, LEAP Semiconductor enhances the group's capabilities on the materials and wafer side. Together, they form a vertically integrated model with strong growth potential. Amid the rapidly expanding demand from electric vehicles, high-power electronics, and renewable energy applications, Latent Technologies will continue advancing SiC innovation and collaborating with industry partners to drive next-generation semiconductor technologies.
Capabilities and products
- LEAP SiC wafers and epitaxial (epi) wafers
- SiC crystal growth furnaces
- automation equipment for SiC supply-chain processes
- gas recycling systems
- graphite materials and crucibles for crystal-growth processes
- graphite purification systems
- silicon carbide (SiC) technologies
- wafer inspection systems