At a glance
| Booth | S7652 |
| Country | TW |
| Website | www.lasertek.com.tw |
Company profile
LASERTEK TAIWAN CO.,LTD is a multinational manufacturer of laser equipment, SMT manufacturing and inspection equipment, and SMD Tape and Reel products. The company is presented as a Taiwan manufacturer and supplier focused on core optoelectronic technology, with product and service lines spanning laser equipment, SMD packaging materials, SEMI/PCB measurement and an energy business. Its semiconductor-related laser applications include lead-frame laser marking, TSV silicon wafer drilling, wafer laser trim, wafer laser grooving, single-head laser barcode marking and wafer laser marking. TSV silicon wafer drilling is listed directly as part of the company's semiconductor laser-processing capability. LASERTEK TAIWAN CO.,LTD combines laser-processing equipment with SMT manufacturing and inspection equipment and SMD packaging products, linking precision processing, inspection and packaging-related supply within electronics manufacturing. The company's public product descriptions emphasize precision laser processing for semiconductor, passive-component, PCB/FPC and optoelectronics applications.
Exhibits
ScanCT is metrology software for manual measurements and analysis that lets users define a measurement, select areas of interest in a scan and choose from more than 500 individual analyses for detailed sample evaluation. ScanCT is presented as easy to use while still providing high-accuracy results, and its selection of analyses is intended to give comprehensive insight into samples. LASERTEK TAIWAN CO.,LTD lists TSV Si Wafer Drilling among its semiconductor laser-processing capabilities. For Wafer Laser Grooving, the company states that laser grooving can avoid PI tearing associated with blade dicing and that short-pulse lasers can control thermal energy more effectively to reduce effects on processing quality. The Wafer Laser Grooving specifications list groove width of 35-70um, Groove Depth of >10-15um and HAZ, or Heat Affected Zone, of <±2um. Its kerf check on fly function, described as Real time kerf aliment, is listed as Yes with 0 sec/check. The kerf-offset adjustment criteria are 0-0.5 um for No Action, 0.5-1 um for Automatic Corrective Acti and >1 um for Manual Mode. For Wafer Laser Trimmer, LASERTEK TAIWAN CO.,LTD describes a specialized wafer-trimming process using laser and equipment designed with high-precision XYZ theta stages and effective feedback systems for precise processing on chips. The Wafer Laser Trimmer hardware list includes a Granite Platform, XY Linear Motors, a 1W UV 355nm Laser and Auto Zoom CCD, and the product is positioned as high-precision, high-quality wafer trimming equipment. Beyond grooving and trimming, the company's semiconductor laser application range includes lead-frame laser marking, TSV silicon wafer drilling, single-head laser barcode marking and wafer laser marking. The wider supply range also includes SMT manufacturing and inspection equipment and SMD Tape and Reel products, while ScanCT adds software-based metrology and analysis to the physical equipment portfolio. Together, the portfolio connects laser-based precision processing, semiconductor wafer work, inspection and metrology, SMT manufacturing support and SMD packaging-related supply for electronics and semiconductor production environments.
Capabilities and products
- TSV silicon wafer laser drilling
- 35-70um wafer laser grooving
- wafer laser trimming equipment
- SMT manufacturing equipment manufacturing
- SMT inspection equipment manufacturing
- SMD Tape and Reel manufacturing
- metrology and analysis software supply (ScanCT)