At a glance
| Booth | L1128 |
| Country | TW |
| Website | www.lasertec.co.jp/en |
Company profile
Lasertec Taiwan, Inc. is established in Hsinchu, Taiwan. Lasertec Taiwan, Inc. is the Taiwan entity associated with Japan's Lasertec Corporation, and the relationship is supported by company-registration information identifying Lasertec Corporation representatives among the Taiwan entity's directors. Lasertec's business specializes in inspection and measurement solutions based on applied optics for semiconductor, flat-panel-display and other industries. The wider group is described as an R&D-oriented fab-lite company, linking the Taiwan entity to a business centered on semiconductor and display inspection and measurement rather than to an unrelated company with a similar name. Applied optics is identified as the core technology behind Lasertec's inspection and measurement products. Lasertec built proprietary technology by pursuing the use of light for inspection and measurement, beginning with development of a laser microscope using a laser light source to achieve high resolution. Its applied-optics technology set includes confocal optics for all-in-focus three-dimensional sample images, DUV/EUV optics for shorter-wavelength semiconductor lithography and interferometry for measuring very small phase shifts in light. Lasertec combines these core optical technologies with peripheral technologies to build solutions for individual applications and varying customer needs. The Taiwan entity's registered business scope includes precision instruments, computer and machinery-related equipment, optical instruments, electronic components, electronic materials, software services, international trade and repair of electrical and electronic products.
Exhibits
Lasertec's semiconductor-related business includes inspection and measurement systems for mask blanks, photomasks and wafers. The listed semiconductor inspection lineup includes actinic EUV patterned-mask defect inspection system ACTIS A300 series, EUV mask-blanks defect inspection/review system ABICS series E320 and EUV mask backside inspection/cleaning system BASIC series. It also includes TSV backside-grinding process measurement system BGM series, fully automatic wafer measurement system BIM series, high-sensitivity internal defect inspection/review system CIRIUS series and high-sensitivity wafer-edge inspection system CIEL series. Additional named systems are FPD photomask defect inspection system CLIOS G10 series, GaN wafer defect inspection/review system GALOIS211, mask inspection system MATRICS X9ULTRA series and mask-blanks defect inspection/review system MAGICS series M9750/M9751. As semiconductor IC designs continue to scale with EUV lithography in volume production and with new materials and structures, Lasertec describes its inspection and measurement systems as playing a crucial role in semiconductor manufacturing. In photomask inspection, Lasertec states that its EUV mask-blank inspection system has become a de facto standard tool and that its mask-inspection systems have captured a large share of leading-edge lithography applications. For wafers, Lasertec offers solutions for wafer-edge inspection, whole-wafer film-thickness inspection, silicon-thickness measurement and SiC-wafer inspection to address different customer requirements. For flat-panel displays, the company provides FPD photomask inspection systems and states that its high-definition FPD photomask inspection systems have attained de facto standard-tool status in the industry. Lasertec also offers hybrid laser microscopes combining high performance and multiple functions for R&D and quality control involving semiconductor materials, transparent films, coating materials, inorganic and organic materials, biological samples, metal parts and plastic components. Across these systems, the common technical foundation is applied optics combining laser microscopy, confocal optics, DUV/EUV optics and interferometry for inspection and measurement tasks.
Capabilities and products
- applied-optics inspection and measurement solutions
- EUV patterned-mask defect inspection
- EUV mask-blank defect inspection and review
- EUV mask backside inspection and cleaning
- TSV backside-grinding process measurement
- fully automatic wafer measurement
- wafer internal-defect inspection and review
- wafer-edge inspection
- FPD photomask defect inspection
- GaN wafer defect inspection and review
- photomask defect inspection
- mask-blank defect inspection and review
- whole-wafer film-thickness inspection
- silicon thickness measurement
- SiC wafer inspection
- hybrid laser microscopes