At a glance
| Booth | I2423 |
| Country | US |
| Website | www.kyzen.com |
Company profile
KYZEN CORPORATION has developed award-winning, environmentally responsible advanced cleaning technologies since 1990. Its approach combines science in cleaning chemistries and research with close attention to the manufacturing cleaning processes that customers need to operate successfully. KYZEN CORPORATION continually improves its cleaning agents and applies problem solving to create cleaning products and solutions suited to specific manufacturing requirements. The company emphasizes detailed process work, describing a practice of addressing manufacturing cleaning problems directly and continuing until the issue is successfully resolved. This combination of cleaning chemistry, application research and process-focused support underpins a portfolio intended for customers that need both a cleaning material and guidance on how to use it effectively in production.
Exhibits
MICRONOX® MX2708 is an Organic Acid Residue Cleaning Agent, while MICRONOX® MX2060 is an Advanced IC Substrate Cleaner. MICRONOX MX2322 is a semiconductor-grade semi-aqueous solvent designed to clean paste fluxes used in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 is described as providing cleaning performance in single-wafer spray-in-air tools as well as in immersion cleaning systems. The product is used as received, rinses quickly and cleanly with DI water, and has a wide process window and long bath life that are presented as supporting low cost of ownership. MICRONOX MX2322 has demonstrated compatibility with exposed sensitive metals including aluminum, copper and nickel, as well as passivation materials. Its listed application is Back End Wafer and Wire Bonding, with a typical immersion process using 100% concentration at 145°F / 63°C, followed by a DI Water Rinse and Hot Air drying. Listed product properties include a flash point of 208°F / 98°C, a boiling point of 343°F / 173°C, partial water solubility and VOC at 100% of 1001 g/L; pH at 10g/L is shown as N/A because the product is solvent-based. KYZEN CORPORATION notes that the process parameters are recommendations based on extensive testing in its application lab and can be optimized for a customer's process parameters. Beyond the chemistry itself, the company's Process Control Center is described as using products and services that monitor, manage and control cleaning processes to improve productivity. Together, MICRONOX® MX2708, MICRONOX® MX2060 and MICRONOX MX2322 cover organic-acid residue removal, IC-substrate cleaning and semiconductor or advanced-packaging flux cleaning within KYZEN CORPORATION's manufacturing-cleaning portfolio.
Capabilities and products
- organic acid residue cleaning agent
- IC substrate cleaner
- semiconductor and advanced-packaging flux cleaning
- cleaning-process monitoring, management and control