At a glance
| Booth | N0490 |
| Country | KR |
| Product categories | Bumping Systems · Etching; Stripping; Ashing - Dry and Wet Equipment · SOI Bonders; Temporary Bonders; De-Bonders · Transfer Systems for Wafer; Reticles or FPD's · Handling; Transfer; Loading Systems; Lifting devices |
| Website | www.kosteks.com |
Company profile
Kostek Systems, Inc. contributed to the semiconductor industry by localizing the vacuum cluster system required for the semiconductor fab equipment in Korea. As part of our ongoing R&D efforts for business diversification, we are localizing next-generation semiconductor packaging equipment, such as wafer-to-wafer bonders and de-bonders, and supplying them to semiconductor companies. Below is the business area of Kostek Systems, Inc. 1. Display Equipment - Chip Transfer System - Thermal Compression Bonder - Laser Compression Bonder - OLEDoS EFEM (Mask/Wafer) 2. Semiconductor Equipment - Temporary Wafer Bonding - Peel-off & De-taper - Wafer Transfer System (Vacuum Cluster System, EFEM, Robot, LPM, N2 EFEM)
Capabilities and products
- EFEM, Robot, LPM and N2 EFEM wafer-transfer modules
- Laser Compression Bonder
- Peel-off and De-taper equipment
- Temporary Wafer Bonding equipment
- Thermal Compression Bonder
- vacuum cluster systems for semiconductor fab equipment
- wafer transfer systems
- wafer-to-wafer bonders
- wafer-to-wafer de-bonders