At a glance
| Booth | N0490 |
| Country | KR |
| Website | www.kosteks.com |
Company profile
Kostek Systems, Inc. states that it contributed to Korea's semiconductor industry by localizing the vacuum cluster system required for semiconductor fab equipment, and its continuing R&D for business diversification includes localization of next-generation semiconductor packaging equipment such as wafer-to-wafer bonders and de-bonders for supply to semiconductor companies. Its display-equipment business area includes Chip Transfer System, Thermal Compression Bonder, Laser Compression Bonder, and OLEDoS EFEM for masks and wafers. Its semiconductor-equipment business area includes Temporary Wafer Bonding, Peel-off & De-taper, and a Wafer Transfer System covering Vacuum Cluster System, EFEM, Robot, LPM, and N2 EFEM. The company's product structure spans Semiconductor Equipment, Micro LED Display Equipment, and Micro OLEDoS Display Equipment. Its product pages identify Temporary Wafer Bonding System, Wafer De-Bonding System, Vacuum Cluster System, EFEM, Wafer Transfer Robot, Chip Transfer System, Aligner & Pre-bonder, Thermal Eutectic Bonder, and Laser Eutectic Bonder among the offered equipment. Kostek Systems, Inc. states that it was designated by the Ministry of Trade, Industry and Energy as a third-term '소부장 으뜸기업'. Its ESG management statement emphasizes Environmental management through an eco-friendly workplace, Social responsibility, and Governance through transparent management, with continued growth for employees, the local community, shareholders, and other stakeholders. The company also presents customer-support functions for product inquiries, CS, and online inquiries, while its investor-information functions include disclosures, notices, and Kostek News. Kostek Systems, Inc. was incorporated in April 2000 and developed a 300 mm Vacuum Cluster Tool, EFEM, and LPM in November 2000. In 2001 it registered as a venture company and registered a corporate research institute, and in 2002 it obtained INNO-BIZ status and was selected for a Ministry of Commerce, Industry and Energy components and materials technology-development program. In 2003 the company obtained ISO 9001 certification, was selected as a promising SME in Gyeonggi-do and as a promising export SME, and in 2004 developed and sold a 2G OLED Encapsulation System and an LCD ROBOT/INDEXER. The company completed and relocated to its Pyeongtaek factory in December 2006, and in 2010 it was selected by the Ministry of Knowledge Economy as a developer of a semiconductor-packaging TSV Wafer to Wafer Temporary Bonder and Debonder system. Its history records production of 300 units of the 300 mm Vacuum Cluster Tool in July 2012, development of a TSV Wafer to Wafer Temporary Bonder & De-Bonder system in July 2013, and establishment of a Robot Repair center plus development of an OLED Film Encap system in 2014. The company signed a Robot Business agreement with Nidic Sankyo in 2015, was selected for an ATC project covering Multi-platform/TM and Robot development in 2016, and was selected in 2017 for a Fan-out packaging TB DB equipment-development project. In 2018 it recorded sales and FA completion for FOWLP TBDB mass-production equipment, sales of Temporary Wafer bonder & De-bonder mass-production equipment for fan-out packaging, and supply of a Wafer to Wafer Bonder. In 2019 it participated in an AR/VR Aligner & Laser Eutectic Bonder development task, supplied a Micro-LED transfer Wafer Bonder, and was selected as a standard EFEM supplier; in 2020 it was selected as a standard EFEM supplier for China's CHJS and for a government Micro-LED display bonding-material and process-equipment development project. In 2021 the company supplied a Micro-LED transfer Wafer Bonder, reached cumulative production of 1200 Vacuum Cluster Tools, and supplied an Aligner & Pre-bonder and Thermal Compression Bonder for TV Micro-LED display manufacturing, followed by a KONEX market listing in January 2022.
Exhibits
The semiconductor-equipment lineup includes Wafer Bonding System, Temporary Wafer Bonding System, Wafer De-Bonding System, Collective Die to Wafer Bonding System, Wafer Transfer System, Vacuum Cluster System, and EFEM. Additional listed equipment includes Temporary Wafer Bonding System, Wafer De-Bonding System, Collective Die to Wafer Bonding System, and Pol Lamination & Auto Clave, while Micro LED terminology identifies FP as the Front plane Micro LED RGB Array and BP as the Back plane TFT or CMOS. Within Micro LED Display Equipment, the product lineup includes a Chip Transfer System together with Aligner & Pre-bonder, Thermal Eutectic Bonder, Laser Eutectic Bonder, and AR/VR Laser Eutectic Bonder. The Temporary Wafer Bonding System temporarily bonds a carrier wafer or glass to the back side in Fan-out Wafer or Panel Level Packaging to flatten warpage created during chip rearrangement and molding before fine-chip RDL and bumping wiring processes. For TSV stacking processes, it temporarily bonds a carrier wafer to the front of a device wafer with adhesive coating or lamination so the device wafer can be back-ground ultra-thin and processed for backside RDL and bumping. When glue is used as the temporary adhesive, the process applies spin coating and pre-curing followed by high-precision alignment and thermo-compression bonding in a vacuum chamber, while film adhesive is laminated before temporary bonding. Its listed features include film or glue carrier-wafer temporary bonding for back grinding, photoresist, etching, deposition, electroplating, RDL and bumping, optical or mechanical alignment in vacuum, pressing uniformity, and wafer-damage prevention through uniform pressing. Published specifications include post-bonding warpage of 500 um or less, bonding temperature up to 300 degrees Celsius with uniformity of plus or minus 2%, wafer alignment accuracy of plus or minus 50 um or better, void-free bonding, TTV of 3 um or less, and UPEH of at least 30 wafers per hour depending on material properties. The Wafer De-Bonding System removes the temporarily bonded carrier wafer from the mold wafer or panel after wiring and bumping processes in Fan-out Wafer or Panel Level Packaging. In TSV processes it separates the carrier wafer from the thinned device wafer after back grinding, wiring and bumping, and an ultra-thin device wafer can be mounted on a Ring Frame for the peeling step. The page describes carrier separation by laser, chemical or mechanical methods, and its feature list specifies three available de-bonding methods as Laser, UV, and Mechanical. The system includes de-bonding and de-lamination modules, is described for crack- and chipping-free de-bonding, supports FOWLP, FOPLP and TSV processes, and is composed of modules optimized for the de-bonding process. Its specifications list IR Fiber CW at 1064 nm and 50 W, DPSS UV at 355 nm and 30 W, wafer size up to 12 inches or square 300 mm by 300 mm, warpage handling of 10 mm or less, and UPEH of at least 20 wafers per hour depending on material properties. The Collective Die to Wafer Bonding System is a gang-bonding platform intended to raise Thermal Compression Chip Bonder productivity by pick-and-placing chips across a device wafer and then pressing them collectively for chip stacking and electrical connection. An alternative flow transfers chips onto a carrier wafer, uses an Aligner & Pre-bonder to pre-bond the carrier-wafer chips to chips on another device wafer, and then performs main bonding with a Thermal compression Wafer bonder or Laser Eutectic Bonder. Electrical connection uses low-melting-point electrodes for bump-to-electrode or electrode-to-electrode eutectic bonding, with listed electrode or bump metals including Cu, Au, Sn, CuSn, AuSn, and AgSn. Features include post bonding after alignment and pre-bonding, automatic parallelism adjustment for pressing uniformity, an anti-vibration structure, wafer size up to 12 inches, and Aligner & Pre-bonder operation in vacuum or atmosphere. Specifications include alignment accuracy of plus or minus 2 um or better, Aligner & Pre-bonder throughput of 15 wafers per hour, Thermal compression wafer bonder throughput of 3 wafers per hour, and Laser Eutectic bonder throughput of 20 wafers per hour. The Vacuum Cluster System combines a Transfer Module equipped with a Vacuum Robot and a Load Lock Chamber connected to an EFEM, and it loads and unloads semiconductor wafers to process modules of front-end equipment such as CVD, ALD, Dry Etcher, and Sputter. Kostek Systems, Inc. describes the system with vacuum performance, a space-optimized structure, minimized footprint, particle-suppression functions inside the vacuum chamber, high productivity, and multiple models for customer requirements. Transfer Module configurations include parallel, radial and Tandem types, while Load Lock Chamber options include multi-level structures, reduced pumping and venting time, a photo-ionizer for static removal, a 26-slot Indexer for batch operation, and optional pre-heating or cooling units to increase wafer throughput. Twinstar Series is designed for an optimized twin-wafer process and can attach up to three twin process modules. Maxima Series can attach up to six process modules, while Optima Series is optimized for modules with longer process times. The Vacuum Grip Pre-Aligner centers wafers and performs angle alignment without separate chucking, automatically recognizes wafer size and notch or flat, uses a built-in controller, and applies an analogue photo receiver for its line sensor to support throughput. It handles 200 to 300 mm SEMI-standard silicon wafers, has a processing time of 2.5 seconds or less for a 300 mm wafer, alignment accuracy of XY plus or minus 0.1 mm or better and T plus or minus 0.1 degrees or better, a wafer off-center limit of plus or minus 5 mm, a 55 mm backside vacuum chuck, and an approximate weight of 12 kg. The Edge Grip Pre-Aligner uses mechanical clamping for 300 mm wafers to avoid backside contact and reduce particle contamination, limits contact to the wafer edge, supports configurations for compound-semiconductor and glass wafers, and has a built-in controller. Its listed handling object is 200 and 300 mm SEMI-standard silicon wafer, with processing time of 8 seconds or less for 300 mm, alignment accuracy of plus or minus 0.2 degrees or better, wafer-edge partial gripping, and PEEK as the wafer-contact material. Edge Grip control uses an RS-232C interface, with 24 V DC plus or minus 10% and 3 A power, 6 mm tubing dry air at 0.35 to 0.4 MPa and at least 10 liters per minute, and an approximate weight of 8 kg. The OLEDoS EFEM for masks is designed to load and unload a fine metal mask into and from processes such as evaporation, can adopt multiple atmospheric robot and pre-aligner configurations, uses a grip-type end effector to reduce mask damage and particles, supports automatic wafer alignment, and is designed for integration with process and metrology equipment. Mask-EFEM specifications include customizable MASK size, a 3-to-5-slot carrier, two FOUPs for MASK, an LCD touch monitor, internal-pressure monitoring with differential-pressure display and interlock, Class 1 clean-room operation, particle performance of 2.0 ea or less at 4.0 nm or less, and a PTFE ULPA filter. Its mask configuration lists CDA at 0.5 to 0.6 MPa, vacuum at minus 80 KPa or less, three-phase AC 200 to 230 V plus or minus 10% at 30 A and 50 or 60 Hz, plus a signal tower lamp and buzzer, three EMO positions, and a light curtain for safety. The OLEDoS EFEM for wafers supports multiple atmospheric robots and pre-aligners, uses a passive end effector with GN-PAD to reduce wafer chipping and particles, supports automatic alignment, offers reliable load-port modules and optional N2-purged FOUP, and is designed for integration with process and metrology equipment. Wafer-EFEM specifications include 300 mm silicon wafer handling, a 25-wafer FOUP, a 300 mm LPM with three FOUPs, Class 1 clean-room operation, PTFE ULPA and chemical filtering, 3/8-inch CDA at at least 5 kgf per square centimeter, vacuum of minus 80 KPa or less, 208 VAC at 30 A plus GND, and a dual protection bar. The Thermal Eutectic Bonder heats and presses upper and lower heater chucks to bond electrodes on collective chips and can use a bump or ACF between the electrodes. As Micro LED chips become smaller, the process description calls for direct electrode-to-electrode bonding without a Micro Bump or ACF and therefore places greater importance on chuck parallelism and pressing uniformity. Low-melting-point bonding uses electrode and bump materials including Copper Alloy, SnAg, and AuSn. In the three-step Micro LED Display transfer process, the Thermal Eutectic Bonder performs post bonding after the Aligner & Pre-bonder stage and is described for TV Micro LED substrates from 6 inches to 12.7 inches, with a feature specification of panel size up to 12 inches and maximum 13.4 inches. Other listed features are Pre-bonder & Main bonder operation, automatic parallelism adjustment, atmosphere and vacuum process availability, and an anti-vibration structure, with alignment accuracy of plus or minus 2 um or better, temperature of 350 degrees Celsius plus or minus 2%, and throughput of 3 wafers per hour. The Laser Eutectic Bonder aligns and pre-bonds Micro LED electrodes on the Front Plane to electrodes on the Back Plane, using a pad or Micro Bump where applicable, and then uses a laser source for low-temperature bonding. It is described for Micro LED TV manufacturing with substrates from 6 inches to 12.7 inches, using pad or Micro Bump materials such as Copper Alloy, SnAg, AuSn, Au, and Ag for low-melting-point bonding. A listed feature is laser-based eutectic bonding intended to overcome the CTE difference between the Front Plane and Back Plane, together with automatic pressure control and 6-to-12.7-inch Front Plane and Back Plane substrates. The listed alloy materials for electric pads or bumps include Copper Alloy, Au Alloy, SnAg, and AuSn. Specifications include alignment accuracy of plus or minus 2 um or better, maximum pressing force of 3 kgf, and a heater rated to a maximum of 200 degrees Celsius. The Aligner & Pre-bonder pre-bonds a Micro LED chip-array substrate transferred onto a rectangular carrier-glass substrate to a TFT or CMOS driving back-plane substrate that performs electrical on and off control. Electrical connection can use ACF or bumps, or direct electrode-to-electrode bonding without bumps or conductive balls. Features include substrate size up to a 12.7-inch panel, two-step optical alignment with rough and fine alignment, automatic chuck-parallelism adjustment using four laser displacement sensors and four tilting servo press units with wedge-error compensation, and four isolators for anti-vibration. Atmosphere or vacuum is optional, with vacuum pre-bonding below 0.5 torr, alignment accuracy of plus or minus 2 um or better, and chuck-to-chuck parallelism accuracy of 5 um or better. The Aligner & Pre-bonder lists maximum pressing force of 30 kN and throughput of 12 substrates per hour depending on material properties. Kostek Systems, Inc. offers configurable atmospheric and vacuum Wafer Transfer Platforms and Systems for customer-specific process equipment and states that its experienced field team reviews requirements and develops customized functions when needed for semiconductor-equipment automation. The Wafer Transfer System portfolio includes Vacuum Cluster System, EFEM, Wafer Transfer Robot, Load Port Module, and Pre-Aligner. The platform is presented as supporting a wide variety of substrates and advanced process technology with wafer-handling performance focused on throughput, cleanliness, and reliability. Kostek Systems, Inc. positions the configurable platform as an optimized solution for advanced process applications. Its delivery model is described as configure-to-order with fast setup, lower installation risks, and the shortest delivery from order to operation. When customer requirements or application challenges call for it, the dedicated team can review the product lineup and develop customized functions as part of the wafer-handling solution.
Capabilities and products
- film/glue-based temporary wafer bonding equipment
- laser/UV/mechanical wafer debonding equipment
- wafer delamination modules
- collective die-to-wafer bonding equipment
- vacuum cluster wafer transfer systems
- EFEM loading/unloading equipment for fine metal masks
- wafer EFEM and nitrogen-purged FOUP integration
- wafer transfer robots
- wafer load port modules
- vacuum-grip wafer pre-aligners
- edge-grip wafer pre-aligners
- customized atmospheric and vacuum wafer transfer systems
- Micro LED chip transfer systems
- Micro LED alignment and pre-bonding equipment
- Micro LED thermocompression eutectic bonding equipment
- Micro LED laser eutectic bonding equipment
- OCA/OCR optical bonding systems
- polarizer lamination and autoclave systems