At a glance
| Booth | N0886 |
| Country | TW |
| Website | www.kokusai-electric.com |
Company profile
Kokusai Electric Corp. develops and produces semiconductor manufacturing equipment based on film-forming technology and delivers that equipment to leading semiconductor manufacturers around the world. The company positions film forming and thermal processing among the most important processes involved in semiconductor fabrication and uses its film-forming technology as the technical base for supporting increasingly functional and high-performance semiconductor devices. Its stated mission is to apply leading-edge technology grounded in film-forming expertise within the continuously growing semiconductor market and to operate as an industry leader in the field of film forming. A core technology is Kokusai Electric Corp.'s proprietary BCD, or Balance Controlled Deposition, technology for thin-film formation. BCD technology is designed to form high-quality thin films with excellent step coverage and composition-ratio control in structures with high aspect ratios, addressing the geometry and film-control demands described for advanced semiconductor structures. The company also applies oxidation and film-quality-improvement technology that is compatible with high-aspect-ratio structures and uses various energy sources, including light and plasma, for high-added-value treatment.
Exhibits
Kokusai Electric Corp.'s deposition-process equipment forms nanoscale thin films used to create circuits on wafers, making the equipment part of the film-forming stage of semiconductor device fabrication. As semiconductor devices have become three-dimensional and more complex, wafer surfaces have also become more complex, increasing the demand for deposition processes that are described as highly difficult. The deposition and thermal-processing platform supports LP-CVD, oxidation, annealing at both low and high temperatures, diffusion, and ALD technologies. These process capabilities cover thin-film deposition, thermal treatment, oxidation, diffusion, and atomic-layer-deposition requirements within semiconductor manufacturing, while the platform is intended to handle increasingly precise and minute next-generation device structures. Kokusai Electric Corp. states that its deposition equipment has earned high acclaim from semiconductor device manufacturers worldwide and combines the ability to perform difficult deposition with high productivity on next-generation devices. Together with BCD thin-film formation, high-aspect-ratio oxidation and film-quality improvement, and treatment using light and plasma energy, the platform presents a process portfolio centered on film formation and thermal processing for advanced semiconductor structures.
Capabilities and products
- semiconductor thin-film deposition equipment
- BCD thin-film deposition technology
- LP-CVD process equipment
- oxidation process equipment
- low- and high-temperature annealing equipment
- diffusion process equipment
- ALD process equipment