At a glance
| Booth | M1134 |
| Country | CN |
| Website | www.kohyoung.com |
Company profile
Koh Young Technology Inc. was founded on May 1, 2002 and designs and manufactures 3D measurement and inspection equipment for the global circuit-board assembly and semiconductor markets. The company describes itself as a technology leader in optomechatronics and machine vision and states that its 3D measurement-based inspection solutions are intended to address a wide range of inspection challenges and support true smart-factory development. Its corporate headquarters and manufacturing location are in South Korea, while R&D facilities focused on artificial intelligence and deep learning operate across the globe. A global network of sales and service centers is intended to support rapid response to customer needs and provide service across the markets in which Koh Young Technology Inc. operates. The company's stated business activities include manufacturing and sales of automated inspection and precise measurement systems and equipment, manufacturing and sales of medical equipment, and software development, supply, and consulting. Its key business areas are identified as SPI, AOI, MOI, SEMI, DPI, and Medical Solutions, linking the company's inspection and measurement capabilities with electronics, semiconductor, and medical applications. Koh Young Technology Inc. states that it pioneered True 3D measurement technology 20 years ago and has continued to develop measurement-based inspection technology with the goal of enabling a zero-defect manufacturing future. The company combines industry standards with AI engines and factory connectivity to increase production efficiency and to move beyond isolated machine connections toward broader Smart Factory operation. Its smart-factory portfolio includes KSMART and Koh Young Process Optimizers, or KPO, which use production data and connectivity for process management, analysis, optimization, and automated process control. KSMART uses Artificial Intelligence to automate process control while focusing on data management, analysis, and optimization, and it collects data across the factory line for defect detection, real-time optimization, improved decisions, and traceability. Koh Young Process Optimizer automatically optimizes printing and mounting processes in real time, while the broader KSMART approach is intended to improve productivity and quality and reduce costs by eliminating variance, false calls, and escapes. The company's semiconductor inspection portfolio is presented as a full range of inspection solutions for Advanced Packaging and Mini/Micro-LED applications, including systems for micro solder-paste deposits, high-density substrates, shiny or highly reflective components, wafer-level packaging, and in-line SPI. Koh Young Technology Inc. also states that its expertise in optomechatronics is being applied to innovation in the medical field, extending its technology base beyond industrial inspection. In its corporate values and mission, the company connects industrial and medical innovation with smart-factory solutions, Industry 4.0 for manufacturing customers, creative innovation, teamwork, and professional delivery of value. Koh Young Technology Inc. reports that its SPI and AOI technologies have played important roles across various industries and states that it has held the world's No. 1 inspection market position since 2006. The company also reports receiving the inaugural Ahn Jung-geun Patriotic Entrepreneur Award from Global Seah Group and Maeil Business Newspaper, an honor recommended by organizations including KOTRA and the Korea International Trade Association and associated with international exports.
Exhibits
Koh Young Technology Inc. offers a full range of semiconductor inspection solutions for Advanced Packaging and Mini/Micro-LED applications, with named products including Meister S, Meister D/D+, ZenStar, and Prime. Meister S is a premium in-line 3D inspection system for micro solder-paste deposits and has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies. The system combines innovative vision algorithms with high-resolution optics and extends beyond micro solder-paste inspection to provide a proven solution for Flux inspection. Its listed optical specification is a high-resolution optical system with a high-speed camera providing 0.1 μm Z resolution. Meister S supports thin solder inspection down to 10 μm, with listed conditions of 50 μm diameter @ 3.5 μm and 10 um solder deposits @ 5 μm. Additional Meister S functions include Active Warp Compensation, Transparent Flux Inspection using a Proprietary Optical System, enhanced inspection with proprietary AI & Vision Technology, and diverse substrate and carrier handling options. The system is also linked to zero-defect operation through the AI-Powered Koh Young Process Optimizer (KPO) Printer. Koh Young Technology Inc. positions Meister S for flip chip-based processes used by OSATS, Chip Makers, Display, and Lighting manufacturers for next-generation BGAs, SiPs, FOWLPs (Fan-Out, Wafer-Level Packages), and Mini- and Micro-LEDs. Meister D/D+ is presented for 3D measurement of high-density substrates and shiny or highly reflective components, while ZenStar provides True 3D inspection solutions for wafer-level-packaging applications. Prime is identified as a 3D in-line SPI solution for Advanced Packaging, adding another in-line measurement and inspection option to the semiconductor-product portfolio. The company also describes the Meister series as premium 3D inspection systems for advanced packaging and wafer-level packaging and identifies Neptune C+ as an industry's first True 3D in-line underfill and conformal-coating inspection solution. KSMART Solutions use Artificial Intelligence to automate process control and collect data across the factory line for defect detection, real-time optimization, improved decision-making, and traceability. Koh Young Process Optimizer automatically optimizes printing and mounting processes in real time, connecting 3D inspection data with process-control actions intended to improve productivity and quality while reducing cost. Together, the inspection systems and smart-factory software cover advanced packaging, wafer-level packaging, Mini/Micro-LED, underfill, conformal coating, micro solder paste, Flux, substrate and carrier handling, factory-line defect detection, traceability, and real-time printing and mounting optimization.
Capabilities and products
- design and manufacturing of 3D measurement and inspection equipment
- 3D inspection systems for advanced packaging
- 3D inspection systems for wafer-level packaging
- in-line 3D inspection of micro solder-paste deposits
- 3D inspection of transparent flux
- 3D measurement of high-density substrates and highly reflective components
- True 3D inspection for wafer-level packaging
- 3D in-line SPI for advanced packaging
- in-line True 3D underfill and conformal-coating inspection
- AI-based automated process control and data optimization
- real-time automatic optimization of printing and mounting processes