At a glance
| Booth | M1134 |
| Country | CN |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Die Inspection; Die Shear · Package Inspection; Lead Scanners · Inspection and Metrology · Measurement; Inspection Service |
| Website | www.kohyoung.com |
Company profile
Koh Young, the industry leader in True 3D measurement-based inspections, is participating in the Semicon Taiwan 2022. We specialize in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Last year at the exhibition, we introduced our Meister series, premium 3D inspection systems for advanced packaging, wafer level packaging, and Neptune C+, industry's first True 3D in-line underfill & conformal coating inspection solution. With much interactions with the visitors last year, we are excited to meet you in person and introduce our industry leading solutions. See you at the show!
Capabilities and products
- 3D measurement and inspection equipment for circuit board assembly
- 3D measurement and inspection equipment for semiconductor markets
- Meister series 3D inspection systems for advanced packaging
- Meister series 3D inspection systems for wafer level packaging
- Neptune C+ True 3D in-line underfill inspection
- Neptune C+ conformal coating inspection solution
- True 3D measurement-based inspection