At a glance
| Booth | M0248 |
| Country | US |
| Website | www.kla.com |
Company profile
KLA Corporation develops equipment and services for the electronics industry and provides advanced process-control and process-enabling solutions used in manufacturing wafers and reticles, integrated circuits, semiconductor packaging and printed circuit boards. The company works with leading customers around the world through teams that include physicists, engineers, data scientists and problem-solvers who design solutions for electronics manufacturing and technology development. KLA Corporation describes its technology position as being at the intersection of electron and photon optics, sensor technology and artificial intelligence, spanning the path from raw wafers to next-generation chips. It develops and manufactures process-control and process-enabling solutions intended to accelerate the development of future electronic devices. KLA Corporation says its global team generates new ideas, solutions and insights for bringing future technologies to life and advancing technology development across the markets it serves. The company identifies artificial intelligence, advanced packaging, automotive electronics and the Internet of Things as technology areas in which its solutions support electronics manufacturing and quality control. Its Ann Arbor campus is described as a growth center for the company's next generation of products and talent. KLA Corporation also states that it is included in the Fortune America's Most Innovative Companies 2026 list.
Exhibits
KLA Corporation's process-control and process-enabling solutions are designed to increase the pace of innovation in the electronics industry and help customers achieve leading-edge performance. For artificial intelligence, KLA Corporation says its solutions use AI to interpret big data and accelerate production of the integrated circuits that will power the next generation of AI innovation. In advanced packaging, the company states that its solutions help advance connectivity within high-performance chips. For automotive electronics, its quality-control solutions are described for integrated circuits used in navigation, infotainment, driver assistance, autonomous driving and flying-car applications. For the Internet of Things, KLA Corporation says its solutions support increased production to match growth in connected and smart devices. For 5G devices, the company links ultra-reliable low-latency communication, higher data speeds and bandwidth with the need for high quality and reliability, and states that its solutions support those quality and reliability requirements. At the portfolio level, KLA Corporation lists chip manufacturing, wafer manufacturing, reticle qualification, packaging manufacturing, printed circuit board and IC substrate manufacturing, software solutions, original-equipment manufacturers and other industries as major product families or markets. Within chip manufacturing, the listed product families include defect inspection and review, metrology, in situ process management, deposition, etch, chemistry process control and semiconductor software solutions. The product information identifies Axion® T2000 as an X-ray metrology system for measuring complex vertical structures in advanced memory devices. It also identifies Orbotech Corus™ 8M as a direct-imaging system providing double-sided imaging for high-density interconnect printed circuit boards and IC substrates, and ICOS™ F260 as a die-sorting product associated with strict semiconductor quality-assurance requirements. KLA Corporation's chip-manufacturing solutions support advanced logic and memory devices including 3D NAND, DRAM and MRAM, as well as power devices, RF communications devices, LEDs, photonics and MEMS. For these chip-manufacturing applications, the company offers defect inspection, defect review, metrology, in situ process monitoring, chemistry process control, software, etch and deposition solutions used throughout fabrication for both silicon and compound-semiconductor device technologies. Chip manufacturers use these products to accelerate development and product-ramp cycles, increase semiconductor die yield, improve chip quality and improve overall profitability in chip manufacturing. For wafer manufacturing, KLA Corporation's portfolio includes defect inspection and review, metrology, data management and in situ process-monitoring systems that support quality management throughout wafer fabrication. Its wafer-manufacturing systems support process development, production monitoring and final quality checks for substrate types including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3 and epitaxial wafers. Wafer manufacturers use the portfolio to accelerate development and ramp cycles, achieve higher wafer quality and improve profitability in wafer manufacturing. For packaging manufacturing, KLA Corporation serves outsourced semiconductor assembly and test providers, device manufacturers, foundries and IC substrate manufacturers across a wide range of packaging applications. Advanced-packaging applications identified by the company include 2.5D/3D IC integration using through-silicon vias, wafer-level chip-scale packaging, fan-out wafer-level packaging, heterogeneous integration and multiple IC substrate types. The packaging portfolio includes etch and deposition process solutions, packaging inspection, metrology, die sorting, chemistry process control, in situ process management and data analytics focused on quality standards and yield before and after singulation. For IC substrates, KLA Corporation also lists automated optical inspection, automated optical shaping, direct imaging, UV laser drilling, inkjet and additive printing, and software solutions. The packaging product families further include wafer inspection and metrology, wafer processing systems, die sorting and inspection, IC component inspection and metrology, chemistry process control, in situ process management, PCB and IC substrate manufacturing, and semiconductor software solutions.
Capabilities and products
- semiconductor defect inspection and review
- semiconductor process metrology systems
- in situ process management systems
- semiconductor deposition process systems
- semiconductor etch process systems
- chemistry process control systems
- semiconductor software solutions
- wafer inspection and metrology systems
- wafer processing systems
- die sorting and inspection
- IC component inspection and metrology
- PCB and IC substrate manufacturing systems
- automated optical inspection for IC substrates
- automated optical shaping for IC substrates
- direct imaging for IC substrates
- UV laser drilling for IC substrates
- inkjet/additive printing for IC substrates
- X-ray metrology for advanced-memory vertical structures
- reticle qualification systems
- wafer-manufacturing data-management systems