At a glance
| Booth | I2900 |
| Country | JP |
| Product categories | Plating; Electro Chemical Plating for device assembly · Plating; Electro Polishing; Coating; Surface Treatment |
| Website | www.kiyokawa.co.jp |
Company profile
KIYOKAWA was established in 1963 and we have over 35 years' experiences about the plating technology for electronic industry such as surface mount devices, printing wiring boards,and rare-earth magnets. In SEMICON Taiwan–our first exhibition outside Japan–we would introduce our recent plating technologies. We hope these technologies are helpful for you. Electroless UBM Plating Technology: Electroless UBM plating on the electrodes on the semiconductor wafers is available. We have 15 years' experience of the UBM plating. Trough Silicon Via Plating Technology: We have a via-filling technology for the interposer Si wafers with a void-free. Micro Bump Plating Technology: We handle the integrated process for the 20 micrometer-scale micro-bump fabrication from sputtering to reflow process. Powder Plating Technology: Our plating technology for the powder-form materials adds the new functionalities to them. We would accept these plating services from a trial production.
Capabilities and products
- 20 micrometer-scale micro-bump fabrication from sputtering to reflow
- electroless UBM plating on semiconductor wafer electrodes
- integrated micro-bump plating process
- powder plating for powder-form materials
- void-free TSV via-filling plating for interposer Si wafers