At a glance
| Booth | N0868 |
| Country | TW |
| Website | www.kingyoup.com |
Company profile
Kingyoup Enterprises Co., Ltd. was founded in Taipei in 1974 and distributes precision tools, measuring equipment, optical instruments, non-destructive testing systems, semiconductor inspection equipment, LCD manufacturing and inspection equipment, and environmental-protection equipment imported from Europe, America, Japan and other countries. The company states that its aim is to meet customer requirements through a diverse product range and comprehensive service. In response to market trends and customer needs, Kingyoup Enterprises Co., Ltd. invested in its subsidiary Kingyoup Optronics in 2013. Kingyoup Optronics includes an optronics R&D team and a Tainan plant that had previously belonged to Kingyoup, and it established a newer plant with a clean room in Taoyuan. Its main products include in-line continuous sputtering systems, roll-to-roll sputtering equipment, temporary wafer-bonding systems and laser de-bonding equipment, with the temporary bonding and laser de-bonding equipment described as jointly developed with IBM. Kingyoup Optronics received the Outstanding Photonics Product Award in both 2014 and 2015. Kingyoup Enterprises Co., Ltd. focuses on industrial-inspection applications, has developed metrology know-how, and serves photoelectric, plastics and chemicals, automotive, aerospace, communications, military and education fields. The company links its competitiveness to learning advanced technology, strengthening personnel training and developing new products to meet varied customer needs. It also describes long-term relationships with suppliers and customers as part of its operating history and seeks to help customers address problems quickly in demanding industrial environments. In addition to its Taipei headquarters, Kingyoup Enterprises Co., Ltd. operates service centers in Hsinchu, Taichung, Tainan and Kaohsiung in Taiwan, and in Suzhou, Taicang and Kunshan in China.
Exhibits
The semiconductor and LED inspection portfolio includes imaging ellipsometers, spot ellipsometers, glass-substrate and through-via stress inspection, thin-film stress measurement, multilayer-wafer thickness measurement, 3D AOI, 3D solder-paste inspection, metal-layer resistance and thickness measurement, Micro LED inspection and Raman microscopy. The AXOMETRICS imaging ellipsometer combines a spectroscopic ellipsometer with a microscope to address spectroscopic-ellipsometry measurement limits and reduce the measurement area to 3μm x 3μm. The AXOMETRICS spot ellipsometer uses spot measurement with a 12-inch stage and can perform transmission and reflection measurement modes on one system for polarization-state and phase-difference measurements, with LCOS also listed as an application. AxoStep is a high-resolution stress-analysis solution for glass substrates and through-glass vias developed for advanced packaging and glass-substrate/through-via GCS/TGV processes. FSM 128/500/900 measures thin-film deposition uniformity, thickness and residual stress to help avoid material damage caused when stress is released, while FSM 413 is listed for multilayer-wafer thickness measurement. The listed material-thickness and topography measurement applications span semiconductor, electronics, LED, solar, FPD and MEMS industries. The portfolio also lists HISOL probe and multiple-crystal bonding equipment for semiconductor R&D or electrical-abnormality analysis, and Hitachi Power Solutions scanning acoustic tomography for equipment, inspection-tool, maintenance and inspection services. INSIDIX temperature-deformation systems are described for measuring deformation of electronics and semiconductor products at different temperatures. KOH YOUNG 3D AOI is listed for semiconductor appearance inspection of defects such as particles, wafer-saw-street cracks, die crack, shift, tilt and bump size, while its 3D SPI checks solder-paste volume, thickness and printing accuracy after SMT printing. Other listed tools include a RADIANT laser decapping machine for package-factory quality assurance or laboratory failure analysis, SURAGUS wafer metal-layer resistance/thickness measurement, WEVE Micro LED inspection, a WEVE Raman microscope with a calibration standard lamp and patented automatic-calibration algorithm, and XYZTEC push-pull testing for semiconductor, LED and solar-chip packaging quality tests. Comet Yxlon GmbH X-ray inspection systems are listed for semiconductor and semiconductor packaging, optoelectronics, electronic-component assembly, printed circuit boards, metals, aerospace, automotive, plastics, precision ceramics and medical applications. Kingyoup's semiconductor and optoelectronics process equipment includes laser de-bonding systems for 2.5D/3D IC TSV, fan-out, MEMS, interposer, flexible OLED, thin-glass handling, touch sensors and LED III/IV compound applications, plus sputtering systems customized for high-technology industries such as energy, displays and medical devices. The same process-equipment range lists wafer temporary bonding and laser de-bonding equipment together with vacuum sputtering equipment.
Capabilities and products
- imaging ellipsometer equipment supply
- spot ellipsometer equipment supply
- glass-substrate/through-via stress inspection equipment supply
- thin-film stress measurement equipment supply
- multilayer wafer thickness measurement equipment supply
- 3D automated optical inspection equipment supply
- 3D solder-paste inspection equipment supply
- wafer metal-layer resistance/thickness measurement equipment supply
- Micro LED inspection system supply
- Raman microscope supply
- probe station/multiple-crystal bonding equipment supply
- scanning acoustic tomography equipment supply
- temperature-deformation measurement system supply
- laser decapping machine supply
- push-pull testing machine supply
- industrial X-ray inspection system supply
- ultrasonic non-destructive testing equipment supply
- liquid penetrant/magnetic particle inspection equipment supply
- resonant acoustic inspection equipment supply
- waste-solvent recovery equipment supply
- wafer laser de-bonding systems
- vacuum sputtering systems
- in-line continuous sputtering systems
- roll-to-roll sputtering equipment
- temporary wafer bonding equipment
- visual inspection equipment supply
- automated automotive-parts inspection equipment supply
- grinding-burn and residual-stress inspection equipment supply
- gear-mesh inspection equipment supply
- LCD manufacturing inspection-equipment supply
- Swiss precision-tweezer supply
- air-gauge supply
- precision internal/external diameter gauge supply
- internal/external caliper-gauge supply
- mechanical plug-gauge and bore-gauge supply
- hardness-tester supply
- Leeb hardness-tester supply
- coating-thickness gauge supply
- mobile automatic coordinate-measuring equipment supply
- 2.5D/3D tool-microscope supply
- digital-microscope supply
- 2D/3D vision-measurement and rapid-measurement equipment supply
- optical projector supply
- optical-section depth-measurement instrument supply
- industrial cleaning-equipment supply