At a glance
| Booth | K2037 |
| Country | TW |
| Website | www.keysight.com |
Company profile
Keysight Technologies Taiwan Ltd. provides electronic design and test solutions for engineers and enterprises developing and deploying next-generation technologies. As an S&P 500 company, Keysight delivers design, emulation, and test solutions intended to help engineers develop and deploy products faster and with less risk across the full product life cycle. Keysight traces its origins to the founding of Hewlett-Packard in 1939 and has operated as a company spun off from Agilent Technologies since 2014, combining decades of measurement experience with continuing research and development. The company is headquartered in Santa Rosa, California, and serves more than 30,000 customers in over 100 countries. Its hardware and software tools span the full product-development cycle from early design and validation through manufacturing and deployment. For semiconductor development, Keysight supports wafer-level and package-level testing, high-speed digital validation, and signal-integrity analysis. Its technologies are used to evaluate power integrity, thermal performance, and electromagnetic compliance for advanced ICs, SoCs, chiplets, and high-bandwidth memory. Electrical structural test tools address interconnect reliability in wirebonded and advanced packaging architectures, while high-speed digital and optical platforms support next-generation data-center and AI-infrastructure development. Supported interconnect work includes 112G, 224G, and emerging 448G links together with PCIe 6.0/7.0, USB4, CXL, and PAM4 SerDes interfaces. Keysight describes close collaboration with industry leaders and continuing R&D investment as part of its approach to measurement science and to connectivity, computation, and intelligent systems.
Exhibits
Its semiconductor workflow covers IC design, validation, wafer test, and photonics, with use cases mapped from design through functional test, compliance test, system validation, manufacturing, and operations. Semiconductor instrument families include parameter analyzers, current-voltage analyzers, parametric test solutions, electrical structural testers, power-device analyzers and curve tracers, femto and picoammeters, electrometers, and low-leakage switch matrices. Parameter analyzers combine precision current-voltage and capacitance-voltage testing, pulsed measurements, and reliability testing in modular systems for devices ranging from advanced materials to high-power components. Current-voltage analyzers provide low-noise sourcing and measurement across a range extending from femtoamp currents to high-voltage sweeps, with multi-channel configurations for device characterization, material research, reliability testing, and process optimization. Parametric test solutions combine measurement instruments with automation for evaluation from early development through high-volume production, providing I-V, C-V, and reliability testing and integration with wafer probers and production environments. Electrical Structural Tester systems are designed for post-mold IC packages and use nanoVTEP capacitive sensing with Part Average Testing to identify wire-bond structural defects through electrical coupling between pins without functional power-up. The EST architecture supports scalable multi-site and parallel testing for high-throughput semiconductor assembly and test flows, targeting consistent high-coverage screening, fewer test escapes, yield improvement, and long-term reliability. Power-device analyzers and curve tracers characterize high-voltage and high-current devices including power transistors, diodes, IGBTs, silicon-carbide devices, and gallium-nitride devices, with scalable voltage and current ranges and integrated safety features. Femto and picoammeters and electrometers measure extremely low currents, high resistances, and low voltages down to 0.01 fA for applications such as leakage-current testing, insulation resistance, and ultra-low-current characterization. Low-leakage switch matrices maintain high isolation for automated semiconductor tests at femtoamp levels and route multiple devices or test nodes without compromising measurement accuracy, supporting parametric testing, reliability studies, and wafer-level characterization. The PD1500A double-pulse tester is presented for wide-bandgap power semiconductors that operate at higher frequencies, voltages, and temperatures, addressing characterization and modeling challenges for SiC and GaN devices. Accessories and integration options include low-leakage cabling, triaxial connectors, shielded switch extenders, wafer-probe interfaces, and application-specific software for semiconductor test systems. Keysight describes semiconductor characterization through complementary I-V, C-V, RF, and reliability measurements, spanning threshold voltage, leakage current, on/off ratio, doping profiles, oxide thickness, junction behavior, gain, noise figure, S-parameters, linearity, efficiency, switching speed, thermal performance, lifetime, breakdown voltage, electromigration, and stress tolerance. The semiconductor workflow includes circuit design and EDA-based simulation and verification, wafer fabrication, electrical wafer probing with I-V and C-V measurements, packaging and assembly, final functional, parametric, and RF test, and reliability testing for stress, lifetime, and thermal behavior. Supported device categories include MOSFETs, IGBTs, diodes and rectifiers, analog, digital and mixed-signal ICs, SoCs, temperature, pressure and optical sensors, and wide-bandgap SiC and GaN devices used in high-voltage, high-frequency, and high-temperature applications. For sensitive low-power devices, low-leakage and high-isolation measurement paths are intended to prevent stray currents, crosstalk, and noise from masking actual behavior during sensor characterization, wide-bandgap testing, and long-term reliability or stress studies. Pulsed measurements are used for high-power or heat-sensitive devices, while reliability methods described by Keysight include high-temperature operating life, thermal cycling, bias temperature instability, transient-response analysis, time-dependent dielectric breakdown, and RF characterization depending on the application. Automation can combine probe stations, robotic handlers, and software-driven test sequencing to increase throughput and measurement repeatability, reduce operator error, enable unattended wafer probing and packaged-device batch testing, and support continuous stress monitoring and data analysis. Modular test platforms can expand switching capacity, add measurement modules, and integrate new test methods as materials, device architectures, standards, data formats, and automation frameworks evolve. For SiC and GaN adoption in electric vehicles and renewable-energy systems, the described requirements include higher voltages, faster switching, and demanding thermal conditions; next-generation communication and computing devices add high-speed transient and RF-test requirements. The semiconductor platform also connects to photonic and optical test, high-speed arbitrary waveform generation, oscilloscopes, BERTs, digital protocol analyzers, signal and spectrum analyzers, RF vector transceivers, vector network analyzers, and RF power meters. For AI data-center validation, Keysight highlights end-to-end 1.6T network reliability from transceivers to interconnects and waveform generation above 200 Gbaud for multi-level digital and optical standards. Its digital-validation offering includes a multicore 12-bit oscilloscope with bandwidth up to 33 GHz, while RF workflows include dual-channel and ultra-wideband signal analysis. Together with the company's 112G, 224G, and emerging 448G interconnect support and PCIe 6.0/7.0, USB4, CXL, and PAM4 SerDes coverage, these measurement workflows address high-speed digital and optical development for advanced computing infrastructure. Keysight also provides support services, calibration intended to keep test systems performing to specification and meeting local and global standards, instructor-led and eLearning education, software downloads and updates, and curated support plans.
Capabilities and products
- wafer-level and package-level semiconductor testing
- high-speed digital validation
- signal integrity analysis
- electrical structural testing for advanced-package interconnects
- 112G/224G/448G interconnect validation
- PCIe 6.0/7.0, USB4, CXL, and PAM4 SerDes validation
- semiconductor parameter analyzers
- low-noise current-voltage analysis
- automated semiconductor parametric testing
- electrical detection of package wire-bond structural defects
- high-voltage high-current power-device characterization
- fA/pA ultra-low-current measurement
- low-leakage high-isolation switch matrix
- SiC/GaN double-pulse testing
- photonic and optical testing
- oscilloscope and BERT high-speed measurement
- LCR and impedance analysis
- signal and spectrum analysis
- vector network analysis
- RF power measurement
- RF vector transceiver measurement
- signal generation
- source measure units (SMU)
- high-speed arbitrary waveform generation