At a glance
| Booth | I2500 |
| Country | TW |
| Website | www.kmax-tech.com |
Company profile
K-Max Technology Co., Ltd. traces its establishment to 1965, when the business was rooted in heavy machinery and petrochemical industries, and it later advanced into high technology and precision machining as global industry evolved. Its stated specialties include machinery, standard consumables, and customized services, with ESC repair, design, and manufacturing for etching equipment, high-purity precision ceramic components, high-purity graphite components, high-purity silicon and quartz components, and precision metal components including tungsten, molybdenum, and aluminum. K-Max Technology Co., Ltd. also describes customized solutions for components made from special materials, equipment modification, and surface treatments as part of its precision-component manufacturing capability. In electrostatic chuck systems, the company reports years of joint-development and manufacturing experience focused on resolving electrostatic-adsorption challenges in advanced processes. For customized work, a professional team works with international companies, supports Joint Design, and provides complete One-Stop Solutions. The company also provides product consultation and targeted R&D based on customer needs, with the stated aim of delivering tailor-made products for differing market requirements. Quality management covers the path from raw-material inspection to final product delivery, using testing procedures intended to maintain stable functionality and product reliability. K-Max Technology Co., Ltd. states that its production-management practices follow ISO 9001:2015 international quality-management standards and are paired with ongoing process-efficiency improvement. Regular quality-management and technical-skills training is part of its staff-development approach, while a dedicated service team gathers customer needs and feedback for continued product and service improvement.
Exhibits
Its product families include optoelectronic components, special metals, precision ceramics, high-purity graphite, and silicon materials. Its service portfolio includes ESC repair, equipment-component design and manufacturing, customized services, surface treatment, and quality management. The listed products and services include Electrostatic chuck, Heater, Surface treatment, Anodization coating, Thermal spray coating, Parts Cleaning, and Curing Lamp, alongside consumable parts for IMP, CVD, and ETCH equipment. Electrostatic chucks are presented for semiconductor processes and LCD panel displays, securing wafers during semiconductor manufacturing and holding glass panels in display applications. The ESC design emphasizes particle-free operation by avoiding mechanical clamping, uniform clamping force to support wafer flatness and processing accuracy, and vacuum compatibility for Glass Adhesion, Etching, PVD, and Ion Implantation. Three ESC clamping mechanisms are described: Coulomb Type, which applies high voltage to polarize a dielectric layer; Johnsen-Rahbek Type, which uses a conductive medium in the dielectric layer for stronger clamping at lower voltage; and Gradient Force Type, which uses interleaved electrodes to generate a non-uniform electric field. ESC material options include ceramic for long lifetime and polyimide, or PI, for high-temperature and chemical resistance in extreme environments. Heater offerings include ceramic heaters with heating elements and electrodes embedded in a ceramic substrate for stable temperature control, as well as PI-Type Heaters with flexible construction, uniform heating, and a stated operating range from -200°C to 180°C for equipment with complex shapes. ESC repair levels are listed as Surface polish & Re-patterning, Ceramic plate de-bonding + L1, New ceramic plate + L2, and New Heater + L3 within a continuous-improvement process. Customized component work covers design planning, machining, production, and related testing, with the company linking this full-process participation to higher precision, consistent quality, improved equipment performance, and semiconductor-industry precision-component requirements. Sandblasting uses high-speed airflow to propel abrasive particles onto a surface, where it can improve roughness and adhesion, remove oxidation, contaminants, or old coatings, and create specified surface patterns. Its stated sandblasting applications include surface-pattern creation, cleaning and rust removal on metals, old paint or coating removal, and increasing roughness to improve adhesion of later coatings. Polishing uses mechanical, chemical, or electrochemical methods to smooth material surfaces, reduce roughness, increase gloss, and improve corrosion resistance, with applications spanning metal, plastic, ceramic, quartz, silicon, and silicon carbide. Precision polishing is also presented for products requiring high gloss, including semiconductor etching components, electronic-device housings, and decorative parts, with equipment and techniques adapted to different materials for surface gloss and flatness. Anodizing is described as an electrochemical oxidation process that creates a protective oxide layer on metal surfaces to improve corrosion resistance, wear resistance, hardness, and appearance, especially for aluminum and its alloys. Anodizing applications include insulating components for semiconductor equipment and aluminum parts for aerospace, automotive, and electronic products, and the available processes include sulfuric-acid and oxalic-acid anodizing plus insulation sealing. Ceramic coating is presented as a thermal-spray process in which ceramic materials such as Al₂O₃ and Y₂O₃ are melted at high temperature and sprayed at high velocity onto a substrate to create a hard, wear-resistant, and heat-resistant coating. Ceramic-coating applications include insulating and plasma-resistant parts inside semiconductor equipment, turbine blades, automotive parts, and components that require wear resistance, high-temperature resistance, or electrical insulation. For optoelectronic components, K-Max Technology Co., Ltd. describes precision metal parts made through high-precision machining from Stainless Steel 304/316, aluminum alloy, and copper alloy, selected respectively for strength and corrosion resistance, low weight and thermal conductivity, or electrical conductivity and oxidation resistance. The optoelectronic offering also includes an IJP Liquid Crystal Dispensing System that can be customized to customer requirements, including CIP modifications. Jig-design services cover customized designs for production needs, durable wear-resistant materials, micron-level precision measurement for quality control, and modular structures intended to simplify maintenance and replacement on production lines. High-purity graphite products are designed for semiconductor applications and for components inside ion-process equipment, with stated properties including high purity, electrical conductivity, hardness, cleanliness, and high-temperature resistance. The graphite range supports high-temperature applications, harsh operating conditions, complex shapes, and high-precision components, and is identified for ion implanters, CVD, and other core semiconductor equipment. Graphite processing includes CNC high-precision machining, surface treatment intended to improve durability and smoothness while controlling particle generation, and customized design and machining for differing shapes and sizes. In semiconductor applications, graphite components are described for ion implanters as well as CVD and PECVD process equipment, where chemical stability under high-temperature conditions is a stated requirement. Customer-support work for graphite components includes CIP-process optimization and yield improvement, selection of durable materials or specialized surface coatings to extend component life and reduce maintenance frequency, and surface-treatment methods intended to lower particle generation and improve process stability. Special-metal machining covers tungsten, molybdenum, tantalum, titanium, and molybdenum alloys for semiconductor, aerospace, energy, metallurgy, chemical, and other demanding applications where temperature, corrosion, strength, or precision requirements are important. Tungsten is described with a melting point of 3422°C, oxidation and corrosion resistance, and semiconductor use as target materials and electrodes in ion-implantation equipment, with precision machining intended to preserve stability under extreme working conditions. Molybdenum is described with a melting point of 2623°C, thermal conductivity, high-temperature and corrosion resistance, and uses in semiconductor accelerator components and high-temperature reaction chambers, as well as aerospace engine parts and high-temperature furnaces. Tantalum is described with a melting point of 3017°C and corrosion resistance for extreme environments, including semiconductor high-temperature reaction chambers, target materials, and accelerator components, aerospace high-temperature components, and chemical reactors. Titanium is positioned as a lightweight, high-strength material for semiconductor precision brackets and lightweight structural components and for aircraft and spacecraft structures, with precision machining applied to miniature structures. TZM molybdenum alloy is described as a titanium, zirconium, and molybdenum composition with a melting point over 3000°C, high elastic modulus, strength, and resistance to deformation, supporting semiconductor accelerator components, target materials, sintering molds, aerospace engine and gas-turbine parts, and high-temperature furnaces. Across the special-metal range, the company states that it has years of processing experience and provides customized engineering solutions intended to maintain component precision, stability, and reliability under high-temperature or otherwise extreme operating conditions.
Capabilities and products
- consumable parts for IMP/CVD/ETCH equipment
- ESC repair, design, and manufacturing for etching equipment
- high-purity precision ceramic components
- high-purity graphite component machining and manufacturing
- high-purity silicon and quartz component machining and manufacturing
- customized special-material components
- equipment modification
- Joint Design for customized components
- custom component design, machining, production, and testing
- Ceramic Heater
- PI-Type Heater
- sandblasting surface treatment
- precision polishing
- sulfuric/oxalic acid anodizing and insulation sealing
- Al₂O₃/Y₂O₃ ceramic thermal-spray coating
- Parts Cleaning
- Curing Lamp
- Stainless Steel 304/316 precision metal components
- aluminum-alloy precision metal components
- copper-alloy precision metal components
- custom IJP liquid crystal dispensing systems with CIP modifications
- micron-level precision jig design
- graphite CNC high-precision machining
- graphite component surface treatment
- high-purity graphite components for ion implanters
- high-purity graphite components for CVD/PECVD equipment
- CIP process optimization and yield improvement
- precision tungsten machining
- precision molybdenum machining
- precision tantalum machining
- precision titanium machining
- precision machining of TZM molybdenum alloy