At a glance
| Booth | N1166 |
| Country | TW |
| Website | www.jtektthermos.com/tw |
Company profile
JTEKT THERMO SYSTEMS TAIWAN CO .,LTD provides heat-treatment equipment for φ8 inch SiC wafers, including activation, oxynitriding, and contact annealing, as well as for GaN wafers, IGBT wafers, and MEMS. The company states that its equipment provides very strong temperature-uniformity performance for heat treatment used in FO-PLP packaging technology and for low-temperature wet oxidation of VCSEL. Demonstration testing is available for these heat-treatment applications. Its semiconductor-equipment range includes heat-treatment furnaces for oxidation, diffusion, CVD, annealing, post-baking, and curing. Its broader product categories include FPD and film manufacturing equipment for next-generation displays, rechargeable batteries, and high-functional materials; electronic-component manufacturing equipment; development and prototyping equipment; industrial heat-treatment equipment; and heating elements. The company lists Moldatherm heaters and cartridge heaters for semiconductors with energy-saving, high-efficiency, and easy-assembly features.
Exhibits
Its electronics R&D equipment spans products from large production systems to small electric furnaces and ovens, with excellent heat response, accurate temperature profiles, energy saving, detailed customization, maintenance, and safety considerations incorporated into the products. The company offers manufacturing equipment with a superheated-steam atmosphere; superheated steam is described as colorless transparent high-temperature H2O gas produced by further heating saturated steam that evaporates at 100°C. Because superheated steam has higher specific heat than hot air and produces a radiation effect, it is described as enabling rapid and uniform heating, and the equipment can also process in a low-oxygen atmosphere with residual oxygen concentration of 20 ppm or less. Applications include degreasing and firing electronic and ceramic components such as MLCC, LTCC, and electrostatic chucks, plus drying and degreasing metal components. The AllFit superheated-steam lineup includes heat-treatment equipment, inert-gas ovens, atmosphere box furnaces, mesh-belt continuous furnaces, and small mesh-belt continuous furnaces. Continuous heat-treatment furnaces can operate in air, hydrogen (H2), nitrogen (N2), or other atmospheres, and the lineup includes mesh-belt furnaces and types using ceramic conveyor belts with heat and wear resistance. Listed continuous-furnace applications include firing MLCC, LTCC, and inductors, firing thick substrates, electrode drying, brazing, glass sealing, and ferrite sintering. Listed furnace types include multi-channel intake and exhaust mesh-belt furnaces, standard Muffle-type mesh-belt furnaces, hydrogen-type mesh-belt furnaces, small mesh-belt continuous furnaces, and ceramic-conveyor-belt continuous furnaces. The hot-air circulation ovens provide heat-uniformity performance and support nitrogen-atmosphere processing at residual oxygen concentration of 20 ppm or less; the range includes inert-gas ovens and clean ovens with Class 100 cleanliness. Oven applications include degreasing, drying, curing, annealing, hardening, and tempering of MLCC, LTCC, and inductors, and the lineup includes high-temperature clean ovens, high-temperature inert-gas ovens, and exhaust-gas combustion treatment equipment. Continuous ovens using clean-oven technology are used for FPD production and experiments, including electronic components, magnetic disks, glass-epoxy substrates, and film drying, curing, and annealing, and they can also be used for MLCC degreasing. The product categories also include FPD and film manufacturing heat-treatment furnaces, electronic-component conveyor furnaces and small ovens, experimental and development equipment, industrial furnaces, atmospheric gas generators, washing machines, and semiconductor heating elements.
Capabilities and products
- 8-inch SiC activation/oxynitriding/contact-annealing equipment
- heat-treatment equipment for GaN/IGBT/MEMS
- FO-PLP advanced-packaging heat-treatment equipment
- low-temperature wet-oxidation equipment for VCSEL
- heat-treatment furnaces for oxidation/diffusion/CVD/annealing
- semiconductor Moldatherm and cartridge heaters
- superheated-steam heat-treatment equipment
- mesh-belt continuous heat-treatment furnaces
- Class 100 clean ovens