At a glance
| Booth | T9517 |
| Country | CN |
| Website | expo.semi.org/taiwan2026/Public/eBooth.aspx?BoothID=662046 |
Company profile
JIANGSU XINTIANYU TECHNOLOGY CO., LTD. / 江苏芯天煜科技有限公司 lists 4–12-inch debugging-grade silicon wafers, test-grade silicon wafers, Dummy Wafer, and Oxide Wafer among its products. Its Dummy Wafer is a blank polished silicon wafer matching the size and thermal expansion of production wafers and is used for chamber conditioning, equipment calibration, and production-wafer protection in etching, deposition, and oxidation processes. The company supports custom surface treatment and packaging for fabs, labs, and semiconductor equipment manufacturers, while its Oxide Wafer is used as a substrate and test wafer by semiconductor fabs and research institutes.
Exhibits
Dummy Wafer is available in 6/8/12 inch with ultra-low TTV/BOW warpage ≤25μm, with custom surface treatment and packaging supported. Oxide Wafer consists of a silicon substrate with a thermally grown uniform SiO₂ layer, with custom oxide thickness from 1000Å to 1.5μm for MEMS, CMOS, thin film, and lithography R&D. The oxide-wafer silicon base has warpage ≤25μm and is described for stable insulation and high-precision process performance. The listed silicon-wafer products also include 4–12-inch debugging-grade silicon wafers and test-grade silicon wafers.
Capabilities and products
- 6/8/12-inch Dummy Wafers with TTV/BOW ≤25μm
- custom oxide wafers with SiO₂ thickness from 1000Å to 1.5μm