At a glance
| Booth | T9034 |
| Country | TW |
| Website | expo.semi.org/taiwan2026/Public/eBooth.aspx?BoothID=661889&PrID=13048 |
Company profile
Jiangsu Rongdaoshe Semiconductor Equipment Technology Co., Ltd. is a China-based semiconductor equipment company established in November 2023 and headquartered in Suzhou Wujiang Fenhu High-tech Zone. The company has more than 5,000 square meters of space, including a yellow-light experimental area and semiconductor-equipment assembly and test workshops. Its broader product scope includes I-line, G-line, and H-line lithography machines, spin coaters, developers, coater-developers, metal lift-off and stripping equipment, wet etching and wet cleaning equipment, and wafer loading, transport, and automation units. Jiangsu Rongdaoshe Semiconductor Equipment Technology Co., Ltd. supplies photolithography, coating and developing, wet-process, and wafer-handling equipment for semiconductor manufacturing, with semiconductor yellow-light lithography equipment included in its listed scope.
Exhibits
The company's listed semiconductor yellow-light lithography equipment includes Panel Level Packaging PLP R515×510, Mask Aligner RPA-600, and COATER&DEVELOPER R822/R840/R804. The R515×510 Panel Level Packaging (PLP) fully automated equipment is designed for large-format panel packaging, automates production of 515 mm × 510 mm substrates, and also supports customized 310 × 310 mm substrates. Its PLP process flow integrates pre-cleaning, adhesive dispensing, edge removal, curing, cooling, and development, and the equipment supports modular configuration to match specific production-line requirements. RPA-600 is a domestically developed Mask Aligner independently engineered by RDS for 4/5/6-inch wafer processing and for specialized processes including power devices, sensors, and MEMS. Jiangsu Rongdaoshe Semiconductor Equipment Technology Co., Ltd. describes RPA-600 as breaking the overseas monopoly on small-to-medium-sized Mask Aligner equipment while providing high precision, superior production capacity, and an integrated compact design. The RDS COATER & DEVELOPER models R822, R840, and R804 are designed for 6-inch and 8-inch wafers, with model configurations capable of meeting 8-inch processing requirements for front-end semiconductor lithography processes. The STRIPPER models RS12, RS8, and RS6 are dedicated semiconductor stripping systems compatible with wafers up to 12 inches and adaptable to smaller 8-inch and 6-inch sizes for different chip-production requirements. The STRIPPER range supports semiconductor substrates including Si, Glass, Sapphire, GaAs, InP, GaN, and SiC, and its core design is optimized for PAD lift-off stripping processes. The SC-6 program-controlled spin coater is designed for precision spin-coating work in laboratories, processes substrates up to 150 mm in diameter, and covers common sample sizes including 2-inch, 4-inch, and 6-inch wafers. The SC-8 high-precision program-controlled spin coater processes substrates up to 200 mm in diameter and supports 2-inch, 4-inch, 6-inch, and 8-inch samples for multi-specification lithography experiments and small-scale pilot production. Together, the PLP system, RPA-600 Mask Aligner, R822/R840/R804 coating and developing equipment, RS12/RS8/RS6 stripping systems, and SC-6/SC-8 spin coaters cover panel packaging, wafer lithography, coating, developing, stripping, and laboratory spin-coating stages.
Capabilities and products
- 515×510 mm fully automated PLP process equipment
- mask aligners for 4/5/6-inch wafers
- coater and developer equipment for 6-inch and 8-inch wafers
- wafer stripping equipment up to 12 inches
- precision spin coaters for substrates up to 150 mm
- high-precision spin coaters for substrates up to 200 mm