JEM TAIWAN PROBE CORP.

At a glance

Company profile

JEM TAIWAN PROBE CORP. has been a Taiwan subsidiary of Japan Electronic Materials Corp. since 1998, and its main production is probe cards. The company describes itself as a professional probe-card vendor providing advanced technical products and services, with production covering Logic, Memory, and LCD/Dr. applications. In 2010, JEM TAIWAN PROBE CORP. developed NP3 / XP probe materials for Memory and Logic devices with wafer Al pads, describing them as providing good contact at low probe force while reducing probe-cleaning frequency. Its technology range also includes advanced Vertical and MEMS products for Memory DRAM / DDR / NAND-Flash devices where fine-pitch probing is required. JEM TAIWAN PROBE CORP. positions its probe-card business within semiconductor wafer testing and emphasizes a global outlook, technology development, and customer use across logic and memory applications.

Exhibits

JEM TAIWAN PROBE CORP. supplies probe cards used mainly for wafer testing of DRAM and NAND flash memory, including products that use MEMS technology and vertical-contact structures for dense probe arrangements. The MC Series is a MEMS probe card created with MEMS and thin-film multilayer wiring technology, supports full-wafer probing for 300mm wafers, and is suited to DRAM and NAND flash memory devices. JEM describes the MC Series as the product in its range that can mount the largest number of probes, using MEMS in probes and parts of the wiring substrate to realize a high-density probe card. The MT Series is a MEMS-type probe card for logic ICs that uses vertical MEMS probes to support fine-pitch area arrays and is developed for flip-chip measurement with Cu pillar bumps and pads. The VS Series is a vertical-contact probe card using micro spring pins, is used mainly for wafer testing of MPUs and NAND flash memory such as devices used in smartphones, and can support attachment methods including wire transformer, MLO, MLC, and direct attachment. VS Series technology is recommended for flip chip, area array, and wafer-level CSP applications. The VC Series uses a vertical buckling structure, supports 12-inch wafer batch contact, and is intended for high-parallelism testing of memory and logic devices, including wafer tests for NAND flash memory. JEM also states that the VC Series can measure many semiconductor chips simultaneously in wafer-level batch measurement and has accumulated use and know-how beyond memory IC applications. The VT Series is a vertical-contact probe card for logic IC wafer testing such as microcontrollers and SOCs, using a vertical structure to address multi-DUT restrictions associated with cantilever cards and to support fine-pitch peripheral-pad devices. By using MEMS components in part of the wiring substrate, the VT Series is described as providing electrical characteristics together with simultaneous multi-device measurement for logic ICs. The VE Series combines vertical and cantilever probe-card features and is developed for high-parallelism testing of CMOS imaging sensors, with openings for a light source while enabling simultaneous testing of multiple devices. Its image-sensor application covers CMOS and CCD devices for cameras used in smartphones, automotive systems, and other expanding camera markets. The CE Series is a cantilever probe card with cantilever probe wires attached to an epoxy ring and is used for a broad range of logic IC testing, including high-current automotive devices and application processors from transistor devices. Across these MC, MT, VS, VC, VT, VE, and CE product families, the portfolio spans MEMS, vertical-contact, spring-pin, hybrid, and cantilever approaches for memory, logic, flip-chip, wafer-level CSP, and image-sensor wafer testing.

Capabilities and products

• semiconductor probe card manufacturing
• NP3 / XP probe materials for Memory/Logic devices
• 300mm DRAM/NAND MEMS probe cards
• fine-pitch flip-chip vertical MEMS probe cards
• micro-spring-pin vertical probe cards
• high-parallelism probe cards for CMOS image sensors
• cantilever probe cards for Logic IC testing

Related product topics

← Topic index · ← Exhibitor list · ← Exhibitor Finder · Organizers can see who found these exhibitors →