At a glance
| Booth | Q5758 |
| Country | TW |
| Website | www.jcu-tw.com |
Company profile
JCU TAIWAN CORPORATION is part of a group established in 1968 that has pursued the role of a general manufacturer in the metal-finishing industry while continuing research and development to respond to changing market and societal needs. JCU TAIWAN CORPORATION describes the JCU Group's guiding idea as helping people achieve richer lives through surface-treatment technology centered on plating. The business began by providing plating technologies, including chemicals and equipment, for automotive and motorcycle parts and later expanded into plating technologies required for manufacturing circuit boards used in advanced electronic equipment. JCU TAIWAN CORPORATION describes the group as one of the relatively few industry suppliers able to sell both chemicals and equipment in an integrated manner, combining that scope with approximately half a century of accumulated on-site experience to optimize customer processes. As an R&D-oriented organization, the group states that about 40% of its Japan-based employees are research-institute personnel and that its follow-up system integrates sales and technology to address customer problems. The group also states that it has research-and-development and sales channels in countries around the world, enabling rapid responses to customer needs on a global basis.
Exhibits
JCU TAIWAN CORPORATION combines wet processes using surface-treatment agents with dry processes using PLASMA equipment and describes this as the industry's only technology of this kind applicable to manufacturing high-density substrates, or printed circuit boards. Its chemical business includes products developed, manufactured, and sold for decorative and anti-corrosion uses in automotive parts, faucet hardware, and building materials; for automotive parts, plating is described as giving plastic a metallic appearance while supporting vehicle weight reduction. The electronic-field chemical business develops, manufactures, and sells process chemicals required for printed circuit boards, electronic components, and semiconductors, serving applications that extend from mobile phones and smart devices to IoT and automotive autonomous-driving functions. The equipment business includes PLASMA treatment equipment for etching and cleaning printed circuit boards with dry-process technology, with roll-to-roll automatic transport, sheet-type automatic transport, and vertical-treatment PLASMA equipment listed as equipment forms. For semiconductor wafer plating, JCU TAIWAN CORPORATION lists tin-silver plating, copper-sulfate plating, tin plating, and nickel plating, including JSOLDER BUHD for bump applications with semi-gloss appearance, stable Ag deposition ratio, uniform electrodeposition, and reflow performance. The semiconductor-wafer range also includes XP-CS for fine-line and bump applications, described as matte, one-liquid and easy to manage, and sulfur-free; BU2HA for redistribution-line and bump applications with a glossy, flat line appearance; EBASOLDER BUⅡ for bump applications with easy bath management; and BNI for barrier-layer use with low stress and favorable plated-film properties. For printed circuit boards, the SAP and MSAP process range includes NBSⅡ and NBSⅢ copper-roughening treatments for inner copper or line-formation pretreatment, NBDⅡ for lamination and solder-resist pretreatment, and HE-500 and HE3-530 for copper thinning and half etching. The printed-circuit-board range further includes NBDL for direct-laser pretreatment, FEED for desmear through electroless copper with low roughness and high adhesion, and TAIKAI plasma treatment for removing DFR residue and for solder-resist residue removal. Copper-plating process products include PB-242D, PB-268, PB-242D PU, PB-242D PUS, and PB-280 as acidic cleaners or degreasers, CU-BRITE VF5, VL, and VH for blind-via filling, CU-BRITE TF4 for through-hole filling, and CU-BRITE 21 for general copper plating. Additional PCB process products include CPOS（BT) for bright copper-sulfate bump plating, RS-81 for DFR stripping, SAC and SACⅡ for selective electroless-copper etching in SAP line formation, FE-830Ⅱ for selective etching in MSAP line formation, and FINELISE for cyanide-free palladium removal. For FPC and special materials, the portfolio lists LIZATRON for residue and oxide-film removal, ELFSEED for electroless nickel seed-layer formation on polyimide, AISL for electroless plating on COP and other special materials, CU-BRITE RF for line plating with a flat line appearance, SI and SH for whole-surface pretreatment, SEEDLON for Ni-Cr seed-layer residue removal, and INVALLOY for iron-nickel alloy plating with emphasis on plated-film properties including thermal expansion coefficient. For electronic components, JCU TAIWAN CORPORATION lists IC-200RM for alkaline non-chelating electrolytic cleaning, CHP-200 XM Ⅱ, IC-320, IC-313N, and CA-40P for etching different copper, copper-alloy, 42-alloy, and copper-nickel-silicon materials, with several products described as halogen-free or low in environmentally hazardous substances. Its electronic-component plating products include HS-220S and RS-26 for semi-gloss tin plating, UT-55Ⅱ and UT-55HDⅡ with whisker-suppression characteristics, SEⅡ and SE-BLⅡ for semi-gloss tin-silver alloy plating, and WB-500(HD) for semi-gloss tin plating with suitable crystal-grain size and low internal stress. The same electronic-component range includes WB-200 and WB-300 pretreatments, WB-900 for discoloration prevention and solder-wettability protection, IC-461, SA-10T, IC-462W, and ST-401NC for stripping tin or tin-alloy systems, SA-421 without fluoride, and S-50 for tin and tin-alloy use with solder-wettability protection.
Capabilities and products
- integrated supply of surface-treatment chemicals and equipment
- combined wet process and PLASMA dry process for high-density PCBs
- PCB PLASMA etching and cleaning equipment
- tin-silver plating chemicals for semiconductor wafers
- copper-sulfate plating chemicals for semiconductor wafers
- tin plating chemicals for semiconductor wafers
- nickel plating chemicals for semiconductor wafers
- copper-sulfate plating chemicals for PCB blind-via filling
- copper-sulfate plating chemicals for PCB through-hole filling
- semi-gloss tin plating chemicals for electronic components
- semi-gloss tin-silver alloy plating chemicals for electronic components