At a glance
| Booth | N0962 |
| Country | TW |
| Website | www.intelume.com.tw |
Company profile
Intelume LASER SYSTEMS CO., LTD. specializes in advanced laser-processing technology and manufactures professional laser equipment for applications that require coordinated process, optics and automation engineering. The company states that it is among the few companies worldwide able to fully integrate optics, mechanical systems, electronic control, software, vision, detection, artificial intelligence, automation and process technology within professional laser equipment. To meet customer requirements, Intelume LASER SYSTEMS CO., LTD. optimizes solutions across different laser pulse widths, wavelengths, power levels and optical-path architectures, and it also provides localized service close to customers. The company develops with international laser companies and research organizations and applies advanced laser process technology to drilling, welding, cutting and grooving applications.
Exhibits
Intelume LASER SYSTEMS CO., LTD. provides laser process equipment that can be taken from sample testing and parameter adjustment through optimization, custom machine specifications, modular design, manufacturing and assembly, testing, verification, delivery commissioning and technology transfer to the customer. The company can also provide custom production fixtures matched to a customer's process conditions and production-flow requirements, extending the laser-machine project from process development into production support. Its laser applications include drilling, welding, cutting and grooving, and the company describes the offered equipment as laser process equipment that can be prepared for volume production as market demand and technology evolve. For drilling, model SCM-A322 is specified with an upper-to-lower opening diameter difference controlled below 30μm, compound thickness capability up to 1000μm, working accuracy below ±10μm and process capability greater than 1.67. For glass drilling in semiconductor packaging and silicon-photonics applications, the listed process is TGV, or through glass via, with precise and accuracy below 1microns, speed above 6000 holes/sec and stability identified as a process characteristic. The drilling application set also includes PI, or polyimide, for the medical industry with 30 microns and 40 microns listed, and PC, or polycarbonate, for the EMS electronic manufacturing-services industry. For compound material in semiconductor packaging, the drilling page lists 2.5D precise removal, linking the equipment to material-removal requirements in semiconductor-package processing. Across these offerings, the company combines laser parameter testing and optimization, custom machine specifications, modular equipment design, manufacture and assembly, test and verification, commissioning, technology transfer and custom fixtures with its integrated laser-equipment manufacturing capability.
Capabilities and products
- integrated professional laser equipment manufacturing
- laser drilling
- laser welding
- laser cutting
- laser grooving
- laser drilling of glass TGV for semiconductor packaging
- 2.5D precision removal of compound for semiconductor packaging
- custom laser process equipment and fixtures