At a glance
| Booth | I2230 |
| Country | TW |
| Website | www.intekplus.com |
Company profile
INTEKPLUS Co., Ltd. is a technology company based in South Korea that provides inspection and metrology solutions for the semiconductor and display industries, with equipment used to detect defects, measure with precision and improve product quality during manufacturing. Its systems support wafer inspection, semiconductor packaging and display-panel production, and the company focuses on high-precision imaging, automation and AI-based analysis to help manufacturers improve yield and production efficiency. INTEKPLUS Co., Ltd. states that its solutions are used by semiconductor and display manufacturers around the world and that continued research and development is directed toward next-generation technologies including advanced packaging, AI chips and high-resolution displays. Its stated solution areas include Semiconductor Back-end Inspection, Semiconductor Mid-end Inspection, Display Inspection, Secondary Battery Inspection, Smart Factory & Vision Module, Handler Automation, Software Technology and High Speed Image Acquisition.
Exhibits
For semiconductor back-end visual inspection, the iPIS Product Family uses Micro Vision Technology for microscopic and complex semiconductor packaging processes, with iPIS-HX, iPIS-XTR and iPIS-IN identified as major series. The iPIS-HX Series uses a HEXA platform for six-side inspection with top and bottom 2D/3D plus four-side inspection, and it lists advanced-package inspection for CIS, SiP and Heterogeneous Integration together with options such as Real Total Height using top 3D, top-side dent inspection, Side LFF Stitching, Multi Picker and Deep Learning. Related iPIS-HX models include iPIS-140HX, iPIS-240HX and iPIS-340HX; the series is specified for Pick & Place handling, up to Max 80K UPH, package types including TSOP, LDP, QFP, BGA, BOC, QFN and usD CARD, and package sizes from 2x2mm to 120x120mm. The iPIS-240 configuration lists up to 70K UPH, top and bottom 2D/3D inspection, LFF Stitching up to 85x85, LTSM Long-term Stability Monitoring, optional four-side 2D, Side LFF Stitching, Direct View Mechanism, Real Total Height through top 3D and Deep Learning. The iPIS-140 configuration lists up to 60K UPH, top and bottom 2D/3D inspection, LFF Stitching up to 80x80, LTSM Long-term Stability Monitoring, four-side 2D and Side LFF Stitching extensions, Direct View Mechanism, Real Total Height through top 3D and Deep Learning. The iPIS-XTR Series integrates a Machine Vision Inspection System with a conventional Tape & Reel Handler as an all-in-one inspection solution, using a three-rail platform for six-side inspection plus Tape & Reel and providing selective inspection for advanced-package and side-inspection needs. iPIS-XTR models iPIS-X140TR, iPIS-X240TR and iPIS-X340TR are listed with up to Max 70K UPH, bottom 2D/3D and top 2D inspection, Tape & Reel, Direct View Mechanism and vision-extension capability, while advanced features include Multi Picker, Deep Learning and Auto Reel Changer. The Auto Reel Changer extends post-reel automation with functions for Reel Taping, Barcode Label Attach, Protection Bander attachment, Label Printer, Dual Reel Changer and Finished Reel Stacker. The iPIS-IN Series performs visual inspection while semiconductor packages remain mounted on trays, and its tray-flipping technology is presented for fast, accurate inspection without package damage, with a five-rail in-tray platform, precise stitching for large packages and options for HX Platform, Tape & Reel and Auto Reel Changer. Related iPIS-IN models iPIS-380, iPIS-560 and iPIS-580 support package types including TSOP, LDP, QFP, BGA, BOC, QFN and usD CARD; the family lists up to Max 100K UPH, package sizes from 3×3mm to 120×120mm, top and bottom inspection, 2D/3D LFF Stitching, tray flipping and automatic sorting. Within the iPIS-IN family, iPIS-560 lists up to 85K UPH and iPIS-380 up to 100K UPH, with in-tray handling, top and bottom 2D/3D inspection, 2D/3D LFF Stitching, damage-free sorting, automatic systems and extension features including four-side 2D, Side LFF Stitching, Deep Learning and Tape & Reel. For Memory Module/SSD AVI, the Memory Module FVI Inspection platform detects visual defects in memory modules and uses real-time 3D inspection through optical triangulation to inspect products of different sizes. The iMAS-2000 is listed for DIMM, SODIMM and FBDIMM with top and bottom 2D&3D inspection, up to 2,000 EA at SODIMM, direct tray in-out, Reject Review Station, Auto Sorting, 3Band Light System, Fast Job Teaching and Anti Dust loader functions. The iSSD-Q1000D is listed for 2.5-inch SATA, mSATA, RAID LIF, Gumstick1 and Gumstick2 with top and bottom 2D&3D plus side 2D inspection, up to 6,000 EA at a 2.5-inch case, and features including 5 Para Picker, tray in-line or manual supply, JIG Auto Conversion, Sorting Picker, 3 Band Light System, Fast Job Teaching and Auto Sorting. Across these systems, INTEKPLUS Co., Ltd. combines high-resolution vision, 2D/3D inspection, precision high-speed Pick & Place handling, stitching, automated handling and Deep Learning options to address semiconductor back-end inspection and related automated inspection workflows.
Capabilities and products
- semiconductor back-end inspection
- semiconductor mid-end inspection
- display inspection
- secondary battery inspection
- handler automation
- high-speed image acquisition
- six-side 2D/3D visual inspection for advanced packages
- integrated Tape & Reel machine-vision inspection
- in-tray semiconductor package visual inspection
- 2D/3D visual defect inspection for memory modules