At a glance
| Booth | R7200 |
| Country | TW |
| Website | www.innolux.com |
Company profile
Innolux Corporation is extending its display-manufacturing capabilities into semiconductor advanced packaging through Fan-Out Panel Level Package technology. Its FOPLP business offers advanced packaging solutions including CSP, LGA, QFN, BGA and SiP using Chip-First or RDL-First approaches. Innolux also supplies redistribution-layer substrates and glass-core substrates, which it identifies as relevant to large AI packages, 2.5D packages and slim package designs. The company provides panel-level final testing service and states that panel-level testing can increase throughput, reduce handling time and lower total operating cost. Its advanced-packaging production line draws on Innolux’s TFT-LCD equipment and manufacturing experience and is being developed with specialists in the advanced-packaging field. Alongside semiconductor packaging, Innolux maintains display and non-display technology businesses and emphasizes quality management and global service within its product-and-technology organization. The FOPLP program uses panel-scale carriers and TFT-LCD-derived equipment to build packaging capacity at a scale different from conventional wafer-based processing. Innolux positions RDL and GCS supply together with packaging and panel-level final testing so customers can source both package-related substrates and downstream test capability from the same semiconductor business.
Exhibits
Innolux’s semiconductor offering includes FOPLP technology, FOPLP panel testing, panel-level final testing services and RDL substrates, connecting panel-scale processing with advanced packaging and final-test operations. Its broader display portfolio emphasizes high image quality, high contrast, ultra-wide viewing angle, low power consumption and environmentally oriented product development across LCD applications. For AM miniLED, each mini-LED element is driven by a TFT, and Innolux combines active-matrix driving with LED chip-on-board, rollable, new splicing and surface-treatment technologies. The listed AM miniLED features include seamless and unlimited splicing, high-quality color and grayscale, flicker-free display, photographs without scanning stripes, an ultra-black fully flat surface, and anti-collision design intended to prevent LED lamp beads from falling off. At the same brightness among short-pitch LED displays, Innolux describes its AM miniLED PID as power-efficient, and a human-eye study conducted with National Cheng Kung University reported less dry-eye tendency after viewing the public display. AM miniLED is positioned for meeting rooms, control rooms and exhibition rooms and can reach 2,500 nits for semi-outdoor and outdoor high-brightness environments. Innolux describes microLED as a self-emissive display technology with high efficiency, brightness, contrast and color gamut, long lifetime, fast response, high reliability, thin and light structure, transparency and flexibility. Because microLED chips occupy only a small part of each pixel, drivers or sensors can be integrated within the pixel to support interactive display functions. Innolux uses its LTPS backplane-driving technology as the core of active-matrix microLED and lists color-conversion, selective mass transfer and mass repair, seamless tiling and direct fine-patterning among its independently developed key technologies. It is developing both color-conversion-based AM microLED architecture and RGB-LED-based AM microLED architecture for different application environments. Applications listed for AM microLED include large displays in corporate headquarters, security control rooms, high-end theaters, museums and other 8K public-display markets, as well as smart TVs, gaming and future classrooms. Additional target fields include smart mobility such as vehicles, aircraft and smart glasses, smart medical uses such as hospitals, precision medicine and telemedicine, and smart retail including convenience stores, mass retailers and department-shopping centers. In non-display technology, Innolux integrates sensing and TFT driving in fingerprint sensors and describes optical, capacitive and thermal approaches based on ridge and valley differences in reflection, capacitance or heat transfer. Its fingerprint-sensor characteristics include active-matrix operation with low power, narrow borders and high signal-to-noise ratio, large-area sensing on G3.5 glass substrates measuring 620 mm by 750 mm, flexible and thin form factors using plastic substrates, and manufacturability across Innolux TFT production lines and supply chain. The fingerprint technology converts physical ridge-and-valley differences into electrical signals and then into fingerprint images, and ultrasonic sensing is also identified as another fingerprint-sensing approach. Across FOPLP, miniLED, microLED and fingerprint sensing, Innolux applies panel-scale manufacturing, TFT driving and large-area processing capabilities to both semiconductor and display or sensing products.
Capabilities and products
- AM-miniLED display technology
- miniLED COB display technology
- rollable miniLED display technology
- miniLED display splicing technology
- miniLED display surface treatment technology
- 2500nits AM miniLED public displays
- AM microLED display technology
- LTPS backplane driving technology
- color conversion technology
- selective mass transfer and mass repair technology
- four-side seamless tiling technology
- direct fine patterning technology
- fingerprint sensor integrating sensing and TFT driving
- Fan-Out Panel Level Package (FOPLP) technology
- CSP advanced packaging
- LGA advanced packaging
- QFN advanced packaging
- BGA advanced packaging
- SiP advanced packaging
- Chip-First advanced packaging
- RDL-First advanced packaging
- RDL substrate (redistribution layer)
- GCS (glass core substrate)
- panel level final testing service