At a glance
| Booth | J3256 |
| Country | TW |
| Website | www.dlf.com.tw |
Company profile
Infinity Vision Technology Corp. Ltd is a Taiwan-based technology company specializing in advanced non-destructive X-ray inspection for semiconductor, PCB, advanced-packaging and precision-manufacturing applications. Established by DLF Co., Ltd., the company integrates X-ray imaging hardware, patented 3D reconstruction algorithms, automation control and AI-based inspection software to support high-accuracy quality assurance. The company focuses on 2D, 2.5D and 3D X-ray inspection for structures including PCB back-drill holes, TGV and TSV interconnects, advanced-packaging substrates and flat-panel or board-shaped products. Its AXI approach is designed to address limitations of conventional CT when inspecting high-aspect-ratio or large-area samples, with an emphasis on faster, non-destructive and production-oriented inspection workflows. Infinity Vision Technology Corp. Ltd provides customizable off-line analysis systems and in-line fast-screening systems for defect detection, dimensional measurement, process monitoring and AI-assisted inspection decisions. Its listed product and solution areas include 3D AXI inspection equipment, X-ray inspection systems, PCB back-drill inspection, TGV and TSV inspection, advanced-packaging inspection, AI-based defect detection and 3D reconstruction software. The portfolio also includes automation and handling systems plus factory-monitoring and control integration, extending inspection from imaging and reconstruction into production-line operation. The company combines precision mechatronics, X-ray imaging, reconstruction algorithms and intelligent inspection software to build scalable inspection systems for semiconductor and electronics manufacturing. 築富科技股份有限公司 was established in 2018 by 得力富有限公司 after ten years of self-funded R&D, and the company states that this earlier work produced AXI process invention patents in Taiwan, the United States and Japan. Its Chinese product information names the 3D-AXI model and describes work on PCB back-drill inspection and TGV/TSV inspection, including patent activity for PCB back-drill and semiconductor glass or silicon plate inspection. For board-shaped samples with aspect ratios greater than 8, the company contrasts its AXI method with CT approaches that may require sample slicing and 2 to 4 hours or more for inspection. Its stated AXI advantages include non-destructive imaging of board-shaped objects, inspection times from several minutes to several tens of minutes, patented mechanical design, patented 3D reconstruction algorithms and AI image-inspection development.
Exhibits
Infinity Vision’s 3D X-Ray Metrology & Defect Inspection system provides fast, accurate and non-destructive 2D and 3D X-ray inspection for PCB, panel, wafer, via-hole and advanced-packaging applications. The system supports in-line 2D inspection for production screening and off-line 3D reconstruction for detailed via-hole analysis. Its inspection functions include shape analysis, internal via inspection and hole-geometry measurement, providing dimensional information without destructive sectioning. The system also detects micro-bubbles, analyzes voids and identifies incomplete connections, covering defect types relevant to vias and advanced-packaging interconnects. For PCB back-drill and TGV/TSV applications, the company’s 2D, 2.5D and 3D imaging methods are designed to inspect thin and board-shaped samples directly rather than relying on destructive sample preparation. The patented 3D reconstruction approach is intended to shorten image-acquisition time and can be combined with a fully customized AI judgment system for automated defect classification. Infinity Vision Technology Corp. Ltd develops both off-line analytical models and in-line rapid-screening models so manufacturers can combine detailed reconstruction with higher-throughput production inspection. Automation and handling systems together with factory monitoring and control integration allow X-ray inspection results to be incorporated into broader manufacturing-control workflows.
Capabilities and products
- nondestructive X-ray inspection of PCB back-drill holes
- nondestructive X-ray inspection of TGV/TSV
- custom AXI mechanism design
- AI-based image inspection development
- X-ray 3D reconstruction algorithm design
- nondestructive X-ray imaging of board-shaped objects
- advanced packaging X-ray inspection
- automated handling systems
- factory monitoring and control integration
- 2D/3D X-ray inspection of wafers and panels
- via-hole geometry measurement
- in-line 2D X-ray inspection
- off-line 3D via-hole reconstruction analysis