At a glance
| Booth | J3256 |
| Country | TW |
| Product categories | Defect; Particle; Bump; Contamination Detection, Review or Inspection · Plate Inspection Equipment · X-ray; XRF; 3-D X-Ray; LEXES Systems · Optical Test Systems |
| Website | www.dlf.com.tw |
Company profile
Infinity Vision Technology Corp. Ltd. Infinity Vision Technology Corp. Ltd. is a Taiwan-based technology company specializing in advanced non-destructive X-ray inspection solutions for semiconductor, PCB, advanced packaging, and precision manufacturing applications. Established by DLF Co., Ltd., Infinity Vision integrates X-ray imaging hardware, patented 3D reconstruction algorithms, automation control, and AI-based inspection software to support high-accuracy quality assurance in next-generation manufacturing. The company focuses on 2D, 2.5D, and 3D X-ray inspection technologies for critical structures such as PCB back-drill holes, TGV/TSV interconnects, advanced packaging substrates, and flat-panel or board-shaped products. Its AXI solutions are designed to overcome the limitations of conventional CT inspection for high-aspect-ratio and large-area samples, enabling faster, non-destructive, and production-oriented inspection workflows. Infinity Vision provides customizable offline analysis systems and inline fast-screening solutions, supporting manufacturers in defect detection, dimensional measurement, process monitoring, and AI-assisted decision-making. By combining precision mechatronics, X-ray imaging, reconstruction algorithms, and intelligent inspection software, Infinity Vision aims to deliver reliable, efficient, and scalable inspection solutions for semiconductor and electronics manufacturing. Key Products and Solutions 3D AXI Inspection Equipment; X-ray Inspection Systems; PCB Back-Drill Inspection; TGV/TSV Inspection; Advanced Packaging Inspection; AI-Based Defect Detection; 3D Reconstruction Software; Automation and Handling Systems; Factory Monitoring and Control Integration. Keywords 3D X-Ray, AXI, Non-Destructive Testing, Semiconductor Inspection, Advanced Packaging, TGV, TSV, PCB, AI Inspection, 3D Reconstruction
Capabilities and products
- 2D, 2.5D and 3D X-ray inspection technologies
- 3D AXI inspection equipment
- AI-based inspection software
- PCB back-drill hole inspection
- TGV/TSV interconnect inspection
- X-ray imaging hardware
- advanced packaging substrate inspection
- inline fast-screening solutions
- non-destructive X-ray inspection solutions
- patented 3D reconstruction algorithms