At a glance
| Booth | I2416 |
| Country | SG |
| Website | www.indium.com |
Company profile
Indium Corporation was founded in 1934 and operates as a materials refiner, smelter, manufacturer and supplier serving the global electronics, semiconductor, thin-film and thermal-management markets. Its broad materials portfolio includes solders and fluxes, brazes, thermal interface materials, sputtering targets, indium, gallium, germanium and tin metals and inorganic compounds, and NanoFoil®. The company maintains global technical support and factories or facilities in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom and the United States, supported by international sales and support teams and channel partners. Its scientists, application engineers and technical-support experts work with customers on tailored materials solutions intended to improve yields, reduce defects and support operating and commercial objectives. Indium Corporation attributes its operating approach to product quality, research and development, customer service and a broad product range, while also describing custom-engineered materials solutions for electronics, semiconductor and thermal-management applications. The company also describes social-responsibility activity in ethical conduct, environmental sustainability, community engagement and workforce well-being, including work through the Indium Corporation and Macartney Family Foundation. Its community activities include volunteering, event sponsorships and support for sustainable development, while student outreach includes internships, job shadowing, mentoring, STEM fairs and career-day activities through schools, colleges and community organizations. Indium Corporation states that it promotes eco-friendly manufacturing practices and follows environmental, social and governance standards in support of global sustainability goals. The company’s milestones begin with its 1934 founding and include the first indium-treated aircraft-engine bearing process developed in 1938 and a commercially viable precision solder-preform process in 1952 that enabled mass production of alloy-junction transistors. A 1959 United States patent covered improvements to soldering printed circuit boards, and in the 1960s the company developed indium inorganic compounds including indium oxide, indium-tin oxide, indium chloride and indium hydroxide. Later milestones include beginning solder-paste development in 1977, founding Indium Corporation of Europe in 1990, receiving a 1991 patent for the reinforced gasket material known as InFORMS®, and commissioning its Asia-Pacific operation in Singapore in 1995. The company introduced NC-SMQ92J in 1998, commissioned Chicago manufacturing operations in 2006, completed an Asia-Pacific manufacturing-facility expansion in 2007 and began operations at its Cheongju, South Korea facility in 2008. Additional milestones include a 2009 patent for Heat-Spring® thermal-interface technology, the 2010 introduction of Indium 8.9HF Halogen-Free Solder Paste, the 2014 introduction of Ultra-Low residue No-Clean semiconductor-grade fluxes and the opening of a Penang technology hub in 2014. Its headquarters later relocated to a larger facility in Clinton, New York, alongside expansion in Penang, Chennai, Suzhou, Singapore and Clinton, and the company introduced Durafuse® LT in 2021. In 2024 Indium Corporation marked 90 years and reported more than 1,400 employees globally, adding another scale milestone to a history that spans metals, soldering, compounds, thermal materials and semiconductor assembly.
Exhibits
Durafuse® is Indium Corporation’s mixed-alloy solder technology for electronics assembly, developed to address solder-joint quality and reliability challenges in complex designs and used in mobile, automotive and industrial applications. Introduced in patented form in 2021, Durafuse® is designed for high reliability at lower processing temperatures, helping to reduce carbon footprint or replace Pb-containing materials in high-temperature die-attach work. The Durafuse® family comprises Durafuse® LT, Durafuse® HR and Durafuse® HT, with each line developed for a distinct combination of processing temperature, voiding performance and reliability requirements. Durafuse® LT is a patented low- to mid-temperature mixed solder-alloy system for high-reliability applications that require lower reflow temperatures, and it has been adopted by OEM and EMS users for such applications. Durafuse® HR is a patented mixed solder-paste alloy designed to achieve low voiding without vacuum reflow in high-reliability applications including automotive and aerospace. Durafuse® HT is a Pb-free solder paste intended as a direct replacement for traditional high-Pb die-attach solders in applications requiring re-melting temperatures above standard PCBA reflow levels, up to 260°C. For semiconductor packaging, Indium Corporation offers solder pastes for precision fine-feature printing, dispensing and jetting in SiP and MEMS packages, as well as high-melting-temperature materials for die attach and clip attach in power-semiconductor packaging. Its semiconductor solder-paste portfolio spans no-clean and ultra-low-residue no-clean fluxes, water-wash chemistry and fluxless technology, with alloys covering low, mid and high melting temperatures and solder powders made for round shape, low oxide and controlled distribution. Mycronic has qualified the PicoShot® series for jetting applications, including Type 5 and Type 6 no-clean and water-wash options, while further development and qualification are continuing. SMQ75 is a high-temperature, high-Pb solder paste with more than 20 years of industry history for die attach in lead-frame applications, and more than 5 billion front-end SiP modules have been manufactured using Indium Corporation semiconductor materials. Die-attach options include NC-SMQ75 for high-Pb alloys with printing or dispensing and post-reflow residue below 1% of paste weight, Indium9.72HF for high-Pb and HTLF alloys with low voiding and a wide reflow window, and NC-SMQ51SC for high-Pb, Pb-free and AuSn alloys with wetting and low-voiding performance. FAST Paste uses a fluxless, solvent-based binder for high-Pb and Pb-free alloys and is designed for reflow under formic acid, while Durafuse® HT provides a high-temperature Pb-free option for power-discrete die attach. For jetting and microdispensing, PicoShot® WS-5M supports dot jetting at 300 µm diameter and above, PicoShot® NC-5M supports 230 to 280 µm dot jetting, and Indium12.8HF supports dot jetting down to 80 µm and fine-line dispensing for metal-lid attach. The SiPaste® line includes Type 6 and Type 7 options such as SiPaste® 3.2HF and C201HF for ultrafine-pitch printing, plus SiPaste® C312HF in Type 6, Type 7 and Type 8 formats and SiPaste® SMQ77 as a no-clean, ultra-low-residue option compatible with post-reflow underfill. The Rel-ion® family addresses e-Mobility with high-reliability soldering and thermal-interface materials, supported by worldwide field support and a supply-chain strategy that includes an emergency recovery plan. Indium Corporation states that Rel-ion® products and manufacturing processes meet IATF (PPAP), HKMC MS184-1 and AQC 324 requirements, and that more than 20 million electric vehicles on the road included Rel-ion® products as of 2024. At semiconductor level, the Rel-ion® portfolio includes fluxes and semiconductor-grade solder pastes for SoC, GPUs and CPUs, SiP, DDR and AI accelerators, while PCBA-level offerings include solder pastes and high-reliability alloys such as Durafuse® technology. At power-module level, the portfolio ranges from patented InFORMS® reinforced preforms to silver and copper sintering pastes for die-attach through package-attach applications in e-Mobility power electronics. The Rel-ion® family also connects semiconductor-level, power-module-level and PCBA-level material choices with electrical, mechanical and thermal reliability requirements for e-Mobility systems. Published product-data resources also cover 677-MG-2 Hot Air Leveling Fluid, 1095-NF-2 Water-Soluble Wave Solder Flux, Germanium Tetrachloride, Stand Off Technology for solder paste, 141-74-2 Cu Sinter Paste and InFORCE®29 Cu Sinter Paste. Additional semiconductor-paste details include Indium6.6HF-HD as a water-washable jetting and fine-line dispensing paste, SiPaste® C201HF with wetting and HiP-mitigation characteristics, and SiPaste® C312HF with transfer-efficiency and stencil-life performance. Durafuse® technology is linked with PCB assembly, power-electronics packaging and assembly and high-reliability PCBA applications, and its listed markets include 5G infrastructure, automotive and EV, industrial and mobile. Within the Rel-ion® family, named products and material categories include solder alloys, the Indium8.9HF Series, Durafuse® LT and HR, InFORMS® reinforced preforms, sintering materials, Indalloy®301LT and flux-cored wire. As of 2024, Indium Corporation states that more than 20 million electric vehicles on the road include Rel-ion® products and that the products deliver zero km failures for modules, components and systems. The company also supports the e-Mobility market through collaboration with industry experts, participation in key committees and webinar programs including EVInSIDER Live and InSIDER Series. Indium Corporation supports these materials with technical specialists, product data sheets, safety data and application guidance, and describes its process-support goal as helping customers optimize manufacturing with materials, technology and application expertise.
Capabilities and products
- Solder alloys
- Brazing materials
- Thermal interface materials
- Sputtering targets
- Indium metal
- Gallium metal
- Germanium metal
- Tin metal
- Indium inorganic compounds
- Gallium inorganic compounds
- Germanium inorganic compounds
- Tin inorganic compounds
- Hot air leveling fluid
- Water-soluble wave solder flux
- Germanium tetrachloride
- Ultra-low-residue no-clean fluxes for semiconductor packaging
- Manufacturing of low-oxide spherical solder powder
- High-lead high-temperature die-attach solder paste
- High-temperature lead-free die-attach solder paste
- Fluxless solder paste for formic-acid reflow
- Jetting and microdispensing solder paste with dot diameters down to 80 µm
- Type 6, Type 7 and Type 8 solder pastes for ultrafine-pitch printing
- Water-washable jetting and fine-line dispensing solder paste
- High-reliability low- to mid-temperature mixed-alloy solder paste
- Low-voiding mixed-alloy solder paste without vacuum reflow
- Reinforced solder preforms
- Silver sintering paste
- Copper sintering paste
- No-clean flux-cored solder wire
- Indium tin oxide (ITO)