At a glance
| Booth | I2416 |
| Country | SG |
| Product categories | Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Preforms; Lids · Solder; Solder Balls and other Soldering Materials · Thermal Interface Materials; Heat Sinks · Thin Film; Dielectric Film Materials · Materials, Nanotechnology · Ingots, Wafers · Deposition/Target Materials · Ingots · Plating Materials |
| Website | www.indium.com |
Company profile
Since the company’s founding in 1934, Indium Corporation® has been driven by its curiosity to look at materials from a different perspective – transforming the ordinary into the unexpected. Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. For more information about Indium Corporation, visit www.indium.com or email [email protected].. You can also follow our experts, From One Engineer To Another® (#FOETA), at https://www.linkedin.com/company/indium-corporation/.
Capabilities and products
- NanoFoil materials
- brazes
- die attach compounds and underfill materials
- indium, gallium, germanium and tin metals and inorganic compounds
- solders and fluxes
- sputtering targets
- thermal interface materials