At a glance
| Booth | R7312 |
| Country | KR |
| Website | www.imt-c.co.kr/eng |
Company profile
IMT Co., Ltd has been developing and improving dry-cleaning technologies for over 20 years. Its dry-cleaning technology is applied to high-tech products including semiconductors, displays and smart phones, and the company states that its performance has been proven by numerous customers in the global market. The company provides laser and CO₂ solutions that replace water or chemical agents to remove foreign matter and particles generated during high-tech manufacturing processes. Its stated dry-cleaning advantages include cleaning without chemicals or water, fast cleaning for higher productivity, safe cleaning without product damage, a compact design with a small footprint, and economical cleaning with low cost of ownership. Laser cleaning selectively removes contaminants from a surface through laser-contaminant interactions and is described as precise, dry and safe, with no chemical agent. The laser process is remote and non-contact with no mechanical load, and it is designed for fast and simple cleaning without a post-cleaning process; CO₂ jet cleaning is also part of the technology offering. Semiconductor applications include test-socket and probe-card cleaning, semiconductor package mold cleaning to remove EMC residue, semiconductor process-equipment parts cleaning, semiconductor wafers and semiconductor parts. The solution range also covers EUV masks, HBM wafer cleaning, Li-Ion batteries, camera modules, OLED panels, OLED FMM masks, PCBs, metal parts and plastic parts. For secondary batteries, laser applications include removing oxide film and surface dirt before welding, while automotive-parts applications include removal before and after welding. In heavy industry, the listed laser applications include rust, primer and paint removal for shipbuilding and aerospace. MicroJet applications include surface cleaning before LCD/OLED display AOI testing, particle removal in smart-phone display lamination, and particle removal during smart-phone camera assembly. Other listed MicroJet applications include burr removal in precision and injection-molded parts, surface cleaning before coating or painting high-end parts, and residue removal after laser cutting, marking or repair. IMT Co., Ltd continues developing surface-cleaning technology to address varied global-market requirements for high-tech products.
Exhibits
The product and solution offering includes EUV Mask Solutions, LASER Cleaner and CO2 Cleaner for laser and CO₂ dry cleaning. HBM Wafer Cleaning is a named semiconductor solution area and is represented by the HBM(High Bandwidth Memory)Wafer Cleaning System DANDI 3100. DANDI 3100 is designed to remove fine particles generated during the DRAM wafer cutting process. The HBM wafer-cleaning system is described as dramatically improving the defect rate in the memory stacking process while using a simple dry-cleaning process with very fast throughput greater than 40 wph. For semiconductor probe cards, the 400P-A / #400P-S Probe Card Cleaning System uses laser cleaning to remove contaminants from the surface of probe tips used for semiconductor wafers. The probe-card system automatically cleans through a job recipe for each type of probe card. Automatic, semi-automatic and manual versions of the probe-card cleaner are available. Together, the probe-card systems, HBM wafer-cleaning system and EUV Mask Solutions position the offering around dry-cleaning applications used in semiconductor manufacturing and packaging environments.
Capabilities and products
- laser dry cleaning
- CO2 dry cleaning
- EUV Mask cleaning solutions
- HBM wafer cleaning
- semiconductor probe-card laser cleaning
- semiconductor test-socket cleaning
- semiconductor package mold EMC-residue cleaning
- semiconductor process-equipment parts cleaning
- surface cleaning before LCD/OLED AOI inspection
- particle removal in smartphone assembly