At a glance
| Booth | K2360 |
| Country | TW |
| Website | www.i-bot.com.tw |
Company profile
i-Bot Technology Inc. provides customized automation-equipment systems, including wafer transfer robots, inspection systems, wafer sorters, and EFEM. The company also repairs existing robotic systems, pre-aligners, and controllers, with stated focus on GenMark, PRI, Brooks, JEL, and YASKAWA robotic systems. Company history states that 達裕科技股份有限公司 was established in 2006 with Genmark robot repair service as its initial focus, later expanding to Load port, robot controller, and wafer pre-aligner refurbishment and sales of new Yaskawa robots. In 2009, the company established an automation-equipment manufacturing department to provide customized automation equipment for semiconductor factories. From 2010, i-Bot focused on semiconductor-equipment design and development, building automated systems such as resistance and leakage-current measurement equipment, four-point-probe metal-film-thickness measurement equipment, CD/Edge/Overlay measurement systems, Wafer Sorter, EFEM, AOI inspection equipment, thin-wafer transfer and wafer-container conversion equipment, and other customized semiconductor automation. Its history includes agency and service relationships involving NBS wafer auto packing/unpacking equipment, Trymax equipment, YASKAWA robots and pre-aligners, CyberOptics 3D/2D measurement equipment, and advanced-process cleaning agents. The company states that its 2016 fully automatic resistance and leakage-current measurement machine was developed for Bumping application and that the machine received certification from an international major customer in 2018 as designated Bumping equipment. The company developed the first-generation fully automatic Microscope measurement system in 2019 and advanced it to a second generation in 2021. Trymax Semiconductor Equipment BV, represented within i-Bot’s described offering, designs and manufactures NEO equipment and configurable NEO process chambers for plasma etching and resist-removal solutions in semiconductor, MEMS, data-storage, and related industries. The Trymax description also states support for legacy equipment originally manufactured by Matrix Integrated Systems, Fusion, and Axcelis.
Exhibits
For semiconductor customers, i-Bot supplies standard EFEM, Sorter, Packin/unpacking, and Wafer Transfer equipment and develops customized equipment and new equipment. EFEM-related key components include Robot, Prealigner, Load port, OCR, and RFID reader. The company designs and manufactures fully automatic resistance/leakage-current measurement systems, optical inspection and measurement systems, and metal-film-thickness measurement equipment. Its back-end packaging and testing equipment includes Frame Sorter, labeling machines, dispensing machines, and point-measurement equipment for semiconductor packaging and testing customers. For Industry 4.0 smart manufacturing, i-Bot provides RFID reader solutions and real-time data collection and analysis for semiconductor equipment or robotic arms to help identify maintenance or repair timing in advance. The fully automatic electrical measurement system supports Auto RS & Leakage measurement on 200/300 mm wafers, with fully automatic or semi-automatic loading modes, SECS/GEM200 or GEM300, OHT/AGV, auto tip clean, auto tip teaching, multiple meter brands, ultra-thin and high-warpage wafers, and ESD protection. Its stated applications for the resistance and leakage-current system are Bumping, Fan Out, Cu Pillar, and WLCSP processes. The RFID Solution is stated to comply with SEMI standards including SEMI E15.1 and SEMI E99, supports SECS-I / HSMS / ASCII communication formats, is compatible with 134.2KHz low-frequency RFID, and provides Ethernet and RS232 interfaces. The Frame Sorter supports 8” / 12’ metal-frame sizes, up to 4 load ports, metal cassettes, customized robot types, auto mapping, SECS / GEM200 or GEM300, dismantle, merge, random and rearrangement sorter functions, wafer/frame ID reading, barcode/QR Code reading, and metal-cassette stop-lever interlock detection. The fully automatic metal-film-thickness measurement system (4PP) supports 150/200/300 mm wafers, automatic or manual loading with automatic measurement, optional pre-aligner and RFID reader, OHT/AGV, SECS GEM200 or GEM300, KEYSIGHT/HIOKO resistance meters, 2D/3D map display and report upload, ESD protection, and measurement of Ti, Cu, Ag, Au, Tiw, Ni, Al, ZrN, TaN, ITO and other metal films. The wafer-transfer-system EFEM can be integrated with equipment front ends for different wafer sizes and is offered in 300/200/150mm configurations for process equipment or measurement-system integration, with customized design, SECS/GEM200 or GEM300, high cleanliness, high UPH, OHT/AGV compatibility, and antistatic support. The fully automatic wafer packing machine supports 4~6”/6~8”/8~12” wafers for packing, unpacking, and sorting, with pre-aligner functions for wafer notch and flat, wafer ID reading, automatic detection of wafer, interleaf, foam and ring, SEMI-standard carrier compatibility, and ESD protection. Carrier compatibility for the packing machine includes 300 mm 25-slot FOUP / FOSB with manual or auto door and 25-wafer HWS, 200 mm 25-slot Open Cassette and 25-wafer HWS/Jar, 150 mm 25-slot Open Cassette and 25-wafer HWS/Jar, and 100 mm 25-slot Open Cassette / Jar. The company also lists agency sales of CyberOptics 3D measurement equipment, NBS fully automatic wafer packaging conversion equipment, and Trymax plasma cleaning and photoresist-removal equipment, together with robotic-arm, pre-aligner, and controller refurbishment services for semiconductor wafer fabs and electronics manufacturers. Across these product families, the stated capabilities directly cover customized wafer transfer robots, wafer sorters, EFEM, robotic-system repair, pre-aligner and controller repair, packing/unpacking, wafer transfer, EFEM key components, resistance/leakage-current measurement, metal-film-thickness measurement, RFID and Industry 4.0 data functions, and semiconductor automation integration.
Capabilities and products
- custom wafer transfer robots
- Wafer Sorter systems
- EFEM equipment
- wafer packing/unpacking equipment
- Wafer Transfer equipment
- robot/pre-aligner/controller repair
- Load port and wafer pre-aligner refurbishment
- fully automatic resistance/leakage-current measurement systems
- fully automatic 4PP metal-film thickness measurement systems
- fully automatic CD/Edge/Overlay measurement systems
- AOI inspection systems
- thin-wafer transfer and wafer-container conversion systems
- Frame Sorter equipment
- semiconductor labeling machines
- semiconductor dispensing machines
- RFID-based equipment data collection and analysis
- 3D metrology equipment agency (CyberOptics)
- fully automatic wafer packaging conversion equipment agency (NBS)
- plasma cleaning/resist removal equipment agency (Trymax)
- YASKAWA Robot/Pre-aligner agency
- advanced semiconductor process cleaning-agent agency