基本資料
| 攤位 | K2360 |
| 國別 | TW |
| 產品分類 | Base Loader Systems · Cleaning; Washing Equipment for Assembly & Packaging · Device Handling; Feeding Systems · Die Sorter; Pick & Place; Flip Chip Placement Systems · Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners · Package Handling; Conveying Equipment · Repair; Rework Equipment · Defect; Particle; Bump; Contamination Detection, Review or Inspection · Flat; Notch Finding System · Package Inspection; Lead Scanners · Deep RIE etching; Dry Etching · Integration and Automation · Modules · Other · Thin Film · Bumping Systems · Cleaning; Washing; Drying Equipment for Substrate, Fab Processing · Coat; Develop; Resist Processing; Track Equipment · Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD · Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment · Etching; Stripping; Ashing - Dry and Wet Equipment · Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment · Transfer Systems for Wafer; Reticles or FPD's · Cleaning Chemicals; Solvents; Strippers · Surface protection material; coatings · Consumables · Magnetic Components; Heads · Motors; Fans; Electric Rotary Spindles · Handling; Transfer; Loading Systems; Lifting devices · Conveying; Material Handling Systems · Robotics; Transfer Systems · Stockers; Storage, AMHS · Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts · Assembly · Automation & Robotics · Circuit Design; Electronic Design Services (EDS); System Level Design (SLD) · Equipment; Hardware; Product Design, Integration and Manufacturing · Factory; Industrial Control; Utilization & Automation · Manufacturing Process Support and Development · Product Development; Software Design; Product Lifecycle Management · Wafer Handling |
| 網站 | www.i-bot.com.tw |
公司簡介
在 I-bot Technology，我們是一家具備先進專業知識與技術的專業公司，提供經設計與製造的自動化設備系統，作為客製化的晶圓搬運機器人（WAFER TRANSFER ROBOT）、檢測系統（INSPECTION SYSTEM）與晶圓分類機（WAFER SORTER）、EFEM。我們也提供既有機器人系統、預對準器（pre-aligner）與控制器的維修。我們對這類機器人系統的主要專注品牌包括 GenMark、PRI、Brooks、JEL 與 YASKAWA。Trymax Semiconductor Equipment BV 在系統與製程設計方面具備專業能力；其製造並支援自有的 NEO 設備系列。它提供多種不同的 NEO 製程腔體，可在所有 NEO 平台上進行配置，為半導體、MEMS、資料儲存及相關產業提供廣泛的電漿蝕刻與光阻去除解決方案。Trymax Semiconductor BV 支援一系列原由 Matrix Integrated Systems、Fusion 與 Axcelis 製造的舊型（legacy）設備。
能力與產品項目
- EFEM 自動化系統
- NEO 電漿蝕刻製程腔體
- pre-aligner 與 controller 維修
- 光阻去除解決方案
- 客製化晶圓搬送機器人
- 晶圓分選機
- 機器人系統維修
- 檢測系統
- 舊款 Matrix、Fusion 與 Axcelis 設備支援