Highvac Corporation

Exhibitor at SEMICON Taiwan 2026 · Booth S7330

Booth S7330Country US4 product topics
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BoothS7330
CountryUS
Websitehighvacgroup.com
Exhibitor profile

Company profile

Highvac Corporation was established in 1993 and is headquartered in Colorado, USA, where it engineers, develops, and manufactures point-of-use abatement systems for semiconductor processes. Its process-driven technology is developed around the specific chemistries and environmental requirements of each application, and its hydrogen-fueled EcoGuard abatement systems have a specialized position in Epitaxial and MOCVD GaN applications. Highvac Corporation has supported the semiconductor industry for more than 25 years and supplies vacuum and abatement solutions to the North American market with a focus on lower cost of ownership, higher uptime, and making vacuum and abatement systems transparent to operations. After more than 32 years of success supporting semiconductor vacuum pumps, Highvac Corporation continues to supply vacuum and abatement solutions, giving semiconductor vacuum pump support a long-standing place in its business. Highvac Corporation presents semiconductor point-of-use gas abatement as a core offering and describes it as the best choice for semiconductor Point of Use gas abatement. Across its products and services, Highvac Corporation emphasizes quality, safety, reliability, cost containment, cycle time, and responsive support, while also developing custom solutions suited to individual client needs and applications.

Exhibitor profile

Exhibits

The EcoGuard Series E and Series G are compact, single-enclosure Wet/Burn/Wet point-of-use abatement systems that use hydrogen as the combustion fuel. This industry-first platform delivers a highly stable flame profile that eliminates the flameout issues common in methane-fueled competitive systems. The hydrogen-fueled burner and patented wet inlet let EcoGuard handle high flows of silicon precursors including trichlorosilane without clogging while managing hydrogen, ammonia, metal-organic compounds, corrosive byproducts, dopant gases, particulates, and reactive exhaust chemistry. The resulting operating benefits are reduced maintenance requirements, maximized uptime, and higher throughput by minimizing unexpected downtime in high-volume manufacturing environments. The iP Series consists of water-cooled dry screw high-vacuum pumps, with base models available from 100 m3/hr to 800 m3/hr so standard sizes can cover a range of process applications. EcoGuard products are designed to destroy and eliminate hazardous byproducts instead of capturing them for later hazardous-waste disposal, and the product line uses an innovative control program to support lower operating costs for process and abatement savings. For particle abatement, the Taisei Giken TRAPPACK removes particulate byproducts from exhaust effluents generated by semiconductor and TFT LCD manufacturing, ion implantation, etching, CVD, and related processes, with the stated goals of reducing maintenance frequency and increasing productivity. Semiconductor, LCD, and solar-industry support includes an Advance Exchange Program, pump repair and rebuild services, and Mag-Lev turbo pump repair. Custom solutions for semiconductor, LCD, and solar production include epitaxial ECOGUARD point-of-use abatement and screw-pump retrofit work for aging EBARA A70W pumps, together with other application-specific retrofits. Its hydrogen-fueled semiconductor abatement tool is presented for users moving away from carbon-based fuels and is described as not flaming out, clogging, or producing NOx, with suitability for atmospheric and low or reduced-pressure EPI reactor tools. The same hydrogen-fueled approach is presented as a way to decrease scope 1 emissions from the subfab, decrease maintenance and operating costs, and decrease downtime while increasing uptime. In 2014, Highvac Corporation was asked to deliver a safe and reliable point-of-use abatement system for a major 200mm semiconductor manufacturer using a reduced-pressure epitaxy tool after the existing burn/wet device created significant maintenance needs associated mainly with inlet clogging. For corrosive semiconductor processes such as Metal Etch and PECVD, Highvac Corporation addresses the problem that cast-iron dry-pump internals can become etched until the pumps can no longer be effectively rebuilt. After servicing thousands of Edwards iQDP80/QMB dry-pump systems, Highvac Corporation developed a solution intended to significantly reduce booster seal failures that can lead to oil leakage or oil migration into the booster casing and dry pump, and ultimately to dry-pump failure. Beyond process equipment, custom work can extend from equipment retrofits to alternative shipping-crate options, allowing the company to adapt solutions to different operating and logistics requirements. Multi-stage dry vacuum pumps have been commercially available for over 30-35 years; early versions were generally water-cooled, more recent versions include air-cooled designs, and typically 4-6 compression stages are required to approach pressures that oil-sealed pumps can reach in two stages.

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