At a glance
| Booth | N1167 |
| Country | TW |
| Website | www.hinanomms.com |
Company profile
Hi-Nano Optoelectronics Co.,Ltd. specializes in precision laser micromachining and reports more than 20 years of technological expertise and manufacturing capability. Its precision-processing capabilities cover advanced materials including optical glass, silicon carbide (SiC), aluminum nitride (AlN), and Si3N4 ceramics, with solutions spanning R&D through high-volume production. For CPO-related applications, the company integrates advanced TGV (Through Glass Via) processing with ultra-precision fiber array unit (FAU) drilling technology. The integrated TGV and FAU process provides a hole-diameter tolerance of ±0.5 μm across hole sizes from 8 μm to 200+ μm. It supports high-aspect-ratio designs from 1:20 to 1:30 or higher for dense optical-fiber-array integration. Fiber alignment reaches submicron positioning precision of ±0.5 μm and is described as ensuring optical coupling efficiency above 95%. The company also describes chip-free and crack-free edge quality, inner-wall roughness control, near 100% yield in mature high-volume processes, and support for 510×515 mm² glass panels. Hi-Nano Optoelectronics Co.,Ltd. brings together experienced senior engineers and specialists in semiconductors, optoelectronics, lasers, and digital-control software. Its technology-development approach includes early investment in micromachining and the use of picosecond and femtosecond lasers as it follows emerging technology trends. TGV and Glass Core are cited as examples of strategic investments made six years ago, with anticipated applications in IC 3D packaging, micro displays, high-frequency communications, and AR/VR. The company also extends its laser-technology expertise into green-energy-related work in farming, fishing, and animal care. Hi-Nano Optoelectronics Co.,Ltd. has set a goal of establishing a Laser Micromachining Center as a hub for research and application of laser micromachining technologies and precision engineering. The envisioned center is intended to contribute to semiconductors, silicon photonics, optoelectronics, green energy, environmental protection, and communications. Its ESG activities emphasize laser micromachining with reduced environmental impact, lower carbon footprints, material recycling for added value, precision, and economic viability, and the company lists an ISO 9001:2015 Certificate.
Exhibits
Hi-Nano Optoelectronics Co.,Ltd. provides laser-micromachining job-shop services, customized integrated laser systems, and total solutions for micron-level tasks. Its service portfolio covers optical glass, silicon and SiC, ceramics, diamonds, lithium niobate (LN), polymers and PI, thin metals, and other advanced materials. Customized TGV and Glass Core job-shop services create microscopic vias through glass substrates for three-dimensional interconnections, with functions including high-density interconnection, reduced signal loss, and improved thermal management. For TGV, the company lists semiconductor 2.5D and 3D packaging and telecommunications as major markets, with hole diameter greater than 10um, aspect ratio 1:20, straight sidewalls, no chipping or microcracks, and high accuracy. TGV job-shop work can support prototypes as well as large-scale production and is described for uses extending from semiconductor packaging to medical devices. AR/VR/MR lens processing is performed in a Class 1000 cleanroom because nanostructured optical devices on the wafer require a high-cleanliness environment. The AR/VR/MR service supports straight and free-shape cutting, glass from ultra-thin and bendable to ultra-thick, cutting and drilling of optical glass, and coated-lens cutting, with applications including optical gratings, waveguides, MEMS micro-lens arrays, Lidar optics, high-precision optical encoders, reticle-lens micro marking, meta-optical elements, and photomasks. Glass-wafer offerings include glass spacers, carrier wafers, interposers, micro- and nano-structured wafers, capping wafers, and TGV glass substrates for semiconductor and high-frequency telecommunications applications. These glass wafers are used in wafer-level packaging, wafer-level optics, photonic integrated circuits, waveguides and splitters, high-frequency-device substrates, lab-on-a-chip devices, AR/VR/MR, MEMS sensors, and RF filters. General optical-glass processing uses non-contact laser methods for cutting, hole drilling, grooving, selective thinning, inner marking, polishing, and welding across ultra-thin to ultra-thick glass and linear to freeform shapes. Listed optical-glass examples include 25um ultra-thin glass cutting, 10mm thick-glass cutting, spiral glass cutting, a 10 mm thick glass chuck, cutting and grooving, glass joining and polishing, and selective slimming of capping bio-glass. For coated glass, Hi-Nano Optoelectronics Co.,Ltd. describes a process for machining sensitive lenses without damaging lenses or sensors, with applications including band-pass filters, optical sensors, micro-lens arrays, Lidar, anti-reflect lenses, protective windows, dichroic filters, beam splitters, polarizing filters, dielectric mirrors, IR windows, UV filters, GRIN lenses, sapphire lenses, and diamond lenses. Silicon-wafer and SiC job-shop services address work that can be difficult for conventional diamond-saw machining, including wafer downsizing, Low-k wafer dicing, ultra-thin wafer dicing, micro-mirror-array wafer dicing, MEMS wafers with moving parts, nanostructured optical wafers, Taiko ring wafer dicing, multi-project wafer selective dicing, Gpp Round dice power-device dicing, and raised-dots wafer machining. For SiC wafers, laser processing includes ingot slicing, freeform dicing, hole drilling, grooving, and surface texturing. The company also machines thick sintered SiC for semiconductor-equipment parts such as SiC wafer chuck tables, focus rings, and wafer carriers. Its SiC approach uses laser non-contact processes to avoid tool wear and is described as suitable for drilling many small holes in components such as SiC shower heads. The silicon and SiC service is positioned for the specialized requirements of semiconductor and electronics manufacturing. Ceramic laser job-shop services cover Green tape, LTCC, Zirconia, PZT, and advanced composite ceramics for semiconductor and microelectronics, energy, military, medical, and RF-device applications. Ceramic examples include precise perforation and cutting of AlN and Al2O3 substrates, 30 x 40 microns hole drilling on Si3N4 substrates for IC probe cards, freeform Zirconia cutting, and PZT laser cutting. Laser wafer dicing addresses multilayer silicon wafers, 3D structures, water- or particle-sensitive materials, and non-standard chip shapes through techniques including wafer downsizing, MEMS-wafer dicing, Low-k-wafer handling, and glass-passivated-wafer dicing. Laser diamond processing includes slicing, slotting, free-shape cutting, hole drilling, and milling of lab-grown diamond into heat spreaders, IC substrates, and engineering components for high-power and AI devices, including semiconductor and high-frequency communications applications. For lithium niobate, or LiNbO₃/LN, the company provides tailored laser-processing solutions for wafers with different crystal orientations; LN applications listed include electro-optics, acoustic-optics, nonlinear optics, waveguides, and fiber-optic gyroscopes. Polyimide and related flexible materials can be processed for microelectronics, FPCBs, RDL, and IC probe-card isolation layers using free-shape cutting and micro-hole drilling without heat-affected zones; the material description also notes a temperature-resistance range from -256° to 400°C. Thin-metal laser micromachining processes sheets and foil at the micron level without debris, deformation, oxidation, or a Heat Affected Zone (HAZ), with applications including FMM production and repair, screen-printing stencils, IC probing micro probes, micro filters, and medical micro gold mesh. Advanced-material work addresses multilayer composite functional materials emerging with demand in artificial intelligence, the Internet of Things, 5G, 6G, LEO communications, optical applications, communications, and IC 3D packaging, and the company provides end-to-end job-shop services from R&D to mass production. Hi-Nano Optoelectronics Co.,Ltd. also supplies customized laser systems for advanced-material processing across semiconductor, MEMS, optoelectronics, medical, FPD, AR/VR/MR, and micro-LED applications. Its FMM Laser Repair System addresses incomplete etched holes in Fine Metal Masks used for OLED manufacturing, with the stated purpose of improving FMM yield. LMJ-201 processes materials including CBN, PCD, CVD, SiC, AlN, WC, and Si and performs tasks such as free-shape cutting, hole drilling, and grooving. The UV-M6 engraver supports micro structuring, surface texturing, and industrial engraving and includes a marking and barcode generator for text, photos, logos, and 1D/2D codes such as QR codes and data matrix. SLC-150M is a semi-automatic sapphire laser cutter for sapphire blanks, wafers, and windows up to 6″ in diameter and uses a high-power DPSS IR laser that can also cut and drill ceramics, silicon, and metals. SP2 uses a CO2 laser to heat and cool along an existing cutting line so internal thermal stress separates glass, providing a non-contact process for optical-glass wafers in straight lines or curves. FI-300 is an Ultra Short Pulsed Laser System using picosecond or femtosecond lasers for glass, quartz, sapphire, and other transparent brittle materials, with glass-thickness capability from 20 micrometers to 6 millimeters and support for free-form cutting. LDS-12 is a semi-automatic laser machine for high-speed hole drilling in ceramic substrates, producing interconnect holes with virtually no dross or burrs at the entrance and exit. UF-7392 is a picosecond laser glass-cutting system for large-format glass panels and One Glass Solution (OGS) smartphone applications, with an optional load-and-unload robot. MicroVias-1000 is a high-speed laser perforation system for Green Tape (Unfired Ceramic) designed to retain high hole quality at high scan speeds. UF-300S is a fully automated car-mirror cutting system that combines filamentation cutting with ultra-short pulsed lasers and CO2 laser separation, supports panels up to 300 x 300 mm, and is described as producing debris-free edges without post-treatment. AR-200A is an automated laser-singulation system for 8″ AR glass wafers that transfers work from cassettes to trays and is designed to SECS/GEM SEMI Standards because the wafers contain nanostructured optical devices. WS-1 is a femtosecond laser micromachining workstation with four wavelengths from IR to DUV for laboratories and R&D centers, and it supports integrated laser-micromachining processes with submicron resolution.
Capabilities and products
- precision laser micromachining
- precision laser processing of optical glass
- SiC laser machining
- AlN/Si3N4 ceramic laser micromachining
- TGV through-glass-via processing
- ultra-precision FAU drilling
- laser-micromachining job-shop and customized integrated systems
- laser cutting and drilling of AR/VR/MR lenses
- optical-glass cutting/drilling/grooving/selective thinning
- damage-free precision machining of coated glass
- silicon-wafer laser micromachining and dicing
- 30×40μm micro-hole drilling on Si3N4 probe-card substrates
- diamond laser slicing/slotting/free-shape cutting/drilling/milling
- custom laser processing for LiNbO3/LN
- polyimide free-shape cutting and micro-hole drilling
- micron-level laser micromachining of thin metals
- FMM laser repair
- laser microstructuring, surface texturing and industrial engraving
- ultrashort-pulse laser cutting of transparent brittle materials
- high-speed laser perforation of Green Tape
- automated laser singulation of 8-inch AR glass wafers
- SECS/GEM SEMI integration for AR-wafer processing
- femtosecond laser micromachining workstation