At a glance
| Booth | N1167 |
| Country | TW |
| Product categories | Device Handling; Feeding Systems · Dicing; Sawing; Scribing; Separation Equipment · Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment · Laser Treatment; Cutting Systems for Panels & Photocells · Cutting; Drilling; Laser ablation; Beveling Equipment · Deep RIE etching; Dry Etching · Thin Film · Wafers · Deposition/Target Materials · Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide; |
| Website | www.hinanomms.com |
Company profile
Hi-Nano is a high-tech enterprise specializing in precision laser micromachining, with over 20 years of technological expertise and industry-leading manufacturing capabilities. Core Competencies: We specialize in precision processing of advanced materials including optical glass, silicon carbide (SiC), aluminum nitride (AlN), and Si3N4 ceramics, delivering comprehensive solutions from R&D through high-volume production. TGV Technology & Optical Communications FAU Drilling Integration As the CPO industry experiences rapid growth, we have achieved deep integration of advanced TGV (Through Glass Via) processing with ultra-precision fiber array unit (FAU) drilling technology. Ultra-Precision Hole Diameter Control – Achieves ±0.5 μm hole diameter tolerance, with hole sizes ranging from 8 μm to 200+ μm High Aspect Ratio Design – Supports 1:20 to 1:30 or higher aspect ratios, meeting dense optical fiber array integration requirements Fiber Alignment Accuracy – Submicron positioning precision (achievable ±0.5 μm), ensuring optical coupling efficiency >95% Superior Edge Quality Assurance – Chip-free, crack-free processing with inner wall roughness High-Volume Production Capability – Mature, stable processes with near 100% yield rates, supporting 510×515 mm² glass panels
Capabilities and products
- 1:20 to 1:30 high-aspect-ratio hole processing
- TGV (Through Glass Via) processing
- high-volume processing of 510×515 mm² glass panels
- optical coupling efficiency above 95%
- precision laser micromachining
- precision processing of Si3N4 ceramics
- precision processing of optical glass, SiC and AlN
- submicron fiber alignment positioning precision
- ultra-precision FAU drilling for CPO integration
- ±0.5 μm hole diameter tolerance for micromachined holes