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Hesse Asia Limited

Exhibitor at SEMICON Taiwan 2026 · Booth M0958

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At a glance

BoothM0958
CountryHK
Product categoriesWire Bonding Equipment · Welding Equipment · Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools · Power Supplies; RF Generators; Converters; Electrical Conditioning · Conveying; Material Handling Systems
Websitewww.hesse-mechatronics.com

Company profile

Hesse GmbH is one of the worlds leading manufacturers of Automated Wedge-Wedge Wire Bonders and Ultrasonic Welder in the world, founded in 1995 based in Paderborn, Germany. Smart Welder Smart Welder SW1085 is the leading-edge technology in producing ultrasonically welded connections. It provides large welding area, touch down control, real time bond quality monitoring, precise image recognition (PR). It is suitable to connect the copper terminal and Pin welding in IGBT and Power electronics. Thin Wire Bonder Bondjet BJ855 is benchmarked for large working area and high bonding speed, Real time quality monitoring, equipped with both ball-wedge and wedge-wedge bonding capability. Heavy Wire Bonder Bondjet BJ955/ 959 and BJ931 Dual-head are capable of bonding Aluminium/ Copper wires and Ribbons for applications like Power modules, IGBT, Automotive devices and Battery Pack. Laser Welder LW1089 and LW2095 provide large working area, fast welding time, different weld geometries and depths, touch down sensor, precision image recognition (PR) and process monitoring. Allow you to have fully and semi-automatic welding of aluminium and copper lead on DCB substrates, power electronics, battery cell and modules. For detail information of Hesse's bonder, please visit our website: https://www.hesse-mechatronics.com/en/ Welcome to visit us at #M1058 in Hall 1, 4th Floor!

Capabilities and products

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