At a glance
| Booth | M0958 |
| Country | HK |
| Website | www.hesse-mechatronics.com |
Company profile
Hesse Asia Limited presents technology from Hesse GmbH, a company founded in 1995 and based in Paderborn, Germany. Hesse GmbH's main expertise is the development, manufacturing, and marketing of fully automated machines for assembly and connection technology, including wire bonders, together with standard and product-specific automation solutions. The company is described as one of the world's leading producers of fully automated wedge-wedge wire bonders and also develops fully automatic ultrasonic bonding and welding machines and laser welding systems. Software for monitoring bonding processes and customized tools and machines complement the equipment portfolio. Worldwide customers include industrial companies in semiconductor manufacturing, HF/RF, automotive, battery systems, medical technology, and other assembly and connection applications. Local customer support in major markets such as Asia and America is provided through subsidiaries in Hong Kong, the USA, and Japan with their own sales and service, supplemented by partner companies and cooperations in more than 30 countries. Core competencies include mechatronic systems, ultrasonic technology, control engineering, and detailed knowledge of the processes and physical effects involved in ultrasonic bonding. Hesse conducts intensive R&D in these areas and maintains international cooperation with universities and research institutes, with development goals that include simple wear-free constructions, highly integrated functions, and intelligent systems for fault-free processes. One example is the patented Process integrated Quality Control (PiQC), which records and evaluates quality-relevant parameters in real time. Hesse Customer Solutions supports individual process requirements through sample bonding, pre-production prototypes, design-validation builds, small-series production, module production, and process optimization, alongside production service, online support, process support, training, consulting, and cost-of-ownership services.
Exhibits
The displayed Hesse equipment range covers Smart Welder systems, fine-wire bonders, heavy-wire bonders, laser welders, and complete automation cells for semiconductor, power-electronics, automotive, and battery applications. Smart Welder SW1085 provides a large welding area, touchdown control, real-time bond-quality monitoring, and precise image recognition (PR) for ultrasonically welded connections, including copper-terminal connection and pin welding in IGBT and power-electronics applications. Thin Wire Bonder Bondjet BJ855 is described for a large working area and high bonding speed, with real-time quality monitoring and both ball-wedge and wedge-wedge bonding capability. Heavy Wire Bonder Bondjet BJ955/959 and BJ931 Dual-head can bond aluminum and copper wires and ribbons for power modules, IGBT, automotive devices, and battery packs. Laser Welder LW1089 and LW2095 provide large working areas, fast welding, different weld geometries and depths, touchdown sensing, precision image recognition, and process monitoring for fully or semi-automatic welding of aluminum and copper leads on DCB substrates, power electronics, battery cells, and modules. The heavy-wire family is available as fully automatic ultrasonic wedge-wedge wire bonders or for manual operation, with large working areas, exchangeable bonding heads for aluminum and copper wire or ribbon, an optional thermosonic function, and automation solutions for automotive and power electronics. Named heavy-wire models include BJ955, BJ959, BJ985, LSB959, BJ931, and BJ653. Bondjet BJ885 is a high-speed fully automatic fine-wire bonder with an extra-large 370 mm x 870 mm working area and both wedge-wedge and ball-wedge bondheads. BJ885 combines optimized pattern recognition with Hesse Bonder Network connectivity, remote PR control, improved MES integration, and Hesse Assist Tools such as a load cell, bondtool detection, and bondtool calibration without a wedge gauge. Smart functions including bondhead memory and chip libraries support porting, while typical applications include HF and RF components, COB, MCM, hybrids, optical electronics, and automotive electronics. Its process functions include high-precision touchdown detection for very thin substrates, digital pattern recognition with flash, automated bondforce calibration, bondtool detection, a loop generator, wear-free Piezo components, maintenance-free solid-state joints, and EEPROM bondhead presets. Depending on application and bondhead, BJ885 can reach up to 7 wires per second, for example with a wedge-wedge bondhead, 25 μm wire, 1 mm loop length, and a metallized wafer. BJ885 continuously monitors wire deformation, transducer current, frequency, and impedance within programmable limits, with optional patented PiQC adding further sensing for 100% real-time quality monitoring. Its fine-wire material range includes Al, Au, Ag, Cu, and Pt from 12.5 µm to 75 µm, while Al and Au ribbon ranges from 35 µm x 6 µm up to 250 µm x 25 µm, depending on bondhead, application, and wire. The BJ885 offers a 31 mm Z stroke, 440° P rotation for the wedge-wedge head, 180° for the ball-wedge head, and a listed footprint of 880 mm x 1780 mm x 1912 mm with an approximate weight of 1800 kg. Bondjet BJ955, BJ959, and BJ985 form a new generation of fully automatic heavy-wire wedge bonders for large substrates, chips, automotive applications such as batteries, and other uses, while also allowing manual operation. A single heavy-wire bondhead handles Al, Cu, and AlCu wire from 50 μm to 600 μm depending on application, and the family offers working areas up to 370 mm x 870 mm. The heavy-wire systems combine optimized pattern recognition, Hesse Bonder Network functions, remote PR control, improved MES integration, load-cell assisted bondforce calibration, bondtool and wire-spool detection, and tool calibration without a wedge gauge. A bondhead change from aluminum to copper can be completed within minutes, and the heavy-wire bondhead includes a non-destructive pull test and a transducer-integrated sensor for 100% real-time quality monitoring. Optional PiQC can detect additional parameters such as friction behavior, while a remote-pull function tied to the PiQC threshold is provided for optimized cycle time. Heavy-wire and ribbon bondheads support Al, Cu, and AlCu, with wire from 50 μm to 600 μm and ribbon from 250 µm x 25 µm up to 2000 µm x 400 µm, subject to the stated application limits. Working areas are listed as 305 mm x 410 mm for BJ955, 370 mm x 560 mm for BJ959, and 370 mm x 870 mm for BJ985, all with a 42 mm Z dimension and 440° P rotation. The three heavy-wire models list footprints and approximate weights of 740 x 1484 x 1912 mm and 1150 kg for BJ955, 805 x 1634 x 1912 mm and 1300 kg for BJ959, and 880 x 1780 x 1912 mm and 1800 kg for BJ985. Smart Welder SW1085 combines the force and ultrasonic power of ultrasonic welding equipment with the flexibility, precision, speed, and advanced process-control functions associated with wire bonding machines. Its image-recognition system locates weld positions and supports an optimal trajectory, while long narrow sonotrodes enable narrow pitch, deep access, compact products, and higher power density. SW1085 adds touchdown sensing, precise dynamic contact-force control, monitoring of ultrasonic characteristics and deformation in reference to DVS 2811, programmable welding maps, parameters for each weld, and standardized interfaces for line integration. The system is described as flexible across many products, with new products generally requiring a program change and, where needed, adapted clamping and automation. The maximum working area is listed as 374 mm x 883 mm, with automation supporting two or more parallel lanes and patented PiQC available for 100% real-time quality monitoring and process-data traceability. With a 400W weldhead, SW1085 lists X 374 mm, Y 857 mm, Z 60 mm and P rotation 380°; with a 1500W weldhead it lists X 374 mm, Y 777 mm, Z 54 mm and P rotation 380° centrally with 2 x 180° at the travel limits. The SW1085 platform supports weldheads up to 400W and 1500W, a rotational p-axis head, longitudinal transducer system, electronically controlled weld-force actuator, precise touchdown control, programmable ultrasonic power, and programmable process profiles. Its listed footprint is 880 mm x 1780 mm x 1912 mm excluding monitor and light tower, with an approximate weight of 1800 kg. Smart Welder SW1089 is a fully automatic ultrasonic welding machine with a large fully accessible working area for terminals, pins, copper rivets, and sleeves, and it uses different sonotrodes and machine setups for these components. Like SW1085, SW1089 combines ultrasonic welding force and power with wire-bonding flexibility, precision, speed, and process control, using image recognition and optimized trajectories for accurate weld positioning. Its working area reaches 392 mm x 870 mm with either a 400W or 1500W weldhead, and it supports an active vertical axis, rotational p-axis, wide ultrasonic-power range, touchdown sensing, dynamic force control, and standardized line-integration interfaces. Patented PiQC is available for 100% real-time quality monitoring and full traceability of relevant process data, while automation can use two or more parallel lanes to raise throughput. Typical copper terminal material specifications include thickness from 0.2 mm to 1.2 mm and area from 1.0² to 3.5² mm2, while copper pin, rivet, and sleeve specifications include collar diameter 1.5 mm to 2.5 mm, thickness 0.1 mm to 0.5 mm, and length 3.0 mm to 18.0 mm. The system also lists aluminum terminal thickness from 0.5 mm to 1.2 mm with area from 1.0² to 4.0² mm2, subject to application-specific clarification. Applications include terminals and leadframes, pins and sleeves, aluminum and copper contacting for batteries and power electronics, high-current low-resistance connections, direct copper-to-copper joining, and room-temperature processing without thermal impact. Additional stated benefits include repair capability, improved thermal conductivity and thermomechanical stability, support after sintering without an additional soldering step, and potential benefits for product lifetime. Example welds include Cu leads on DCB for inverters, power pins, sense pins, Flex PCB to PCB connections, battery-cell and battery-module contacts, BMS voltage-monitoring contacts, Hilumin® and aluminum battery leads, and Cu sleeves on DCB for power modules and IGBT modules. SW1089 lists a footprint of 930 x 1823 x 2040 mm and an approximate weight of 2100 kg, excluding attached parts such as status lamps and control panels. Beyond individual-machine automation, Hesse offers complete manufacturing cells that can be fully customized in scope and configuration, with the stated advantage that no additional integrator is required. The reference production-line concept combines automation components, Hesse machines, and coordinated interfaces and integrates loading, transport and shuttle systems, fully automated bonding, ultrasonic welding, laser welding, cleaning, and unloading. The example cell identifies Bondjet BJ959 as the ultrasonic wire bonder, Smart Welder SW1089 for ultrasonic welding of terminals, pins, and sleeves, and Laser Welder LW1089 as the laser welding system. A multi-magazine loader and unloader use integrated width-adjustable holders for 3 to 5 magazines, pushers for loading and unloading, magazine monitoring or detection and locking, slot monitoring, safety devices, an integrated shuttle, control-system visualization, status lights, optional code-scanning identification, and optional belt drives. The stand-alone shuttle distributes workpiece carriers across processing lanes, with adjustable lane width, safety functions, visualization, optional code-scanning identification, and customer-specific customization. The stand-alone cleaning station adjusts to customer-specific carrier widths and uses rotating nozzles for surface cleaning, with suction, filtration, supply, safety, and control functions plus options for product-specific adaptation, nitrogen cleaning, medium ionization, and cleaning-system monitoring. Hesse Bonder Network HBN 1000 provides machine networking, synchronization, decentralized line management, connectivity, and data synchronization across the cell. The Hesse Production App mirrors machine status to a smartphone so operators can view conditions in real time and receive push notifications when action is required. The Production Cell can connect to a custom MES through a single interface, with standardized protocols including SECS/GEM and OPC UA for base scenarios such as RAM statistics, product traceability, and remote commands.
Capabilities and products
- fully automated wedge-wedge wire bonders
- ultrasonic welding equipment
- fine-wire ball-wedge and wedge-wedge bonding
- aluminum/copper heavy-wire and ribbon bonding
- laser welding of aluminum and copper leads
- PiQC real-time bond quality monitoring
- customized complete manufacturing-cell integration
- SECS/GEM/OPC UA production-line MES integration