At a glance
| Booth | L1008 |
| Country | DE |
| Website | www.heraeus-printed-electronics.com |
Company profile
Heraeus Printed Electronics GmbH is a Germany-based Heraeus business focused on digital printed electronics for semiconductor and electronics applications. Its Prexonics technology combines particle-free metal inks, precision inkjet printing equipment, and deep process know-how as a turnkey approach to precision metallization, so the material, printing hardware, and process expertise are supplied as one coordinated solution. The approach is designed for selective, maskless metallic coatings on electronic components and is tailored to modern semiconductor manufacturing. Heraeus Printed Electronics positions this coordinated materials-and-process offering for high-resolution metallization and printed conductive structures in semiconductor packaging and electronics manufacturing, linking digital printing with package-level conductive features. The maskless selective silver-ink process is described as providing design freedom while reducing excess material and wet-chemical processing. Heraeus Printed Electronics GmbH is identified in Hanau, Germany, providing a specific German location for the business.
Exhibits
The Prexonics offering includes specially formulated Prexonics® particle-free silver ink together with the Prexonics® inkjet printing system. The offering is structured as a turnkey system: the specially formulated particle-free silver ink, the inkjet printing system, and the process sequence are designed to operate together for selective semiconductor metallization rather than as unrelated standalone items. Both elements are engineered for effective 2.5D selective coating, supporting metal deposition only where the electronic component requires it. Inkjet printing can create precise pattern layouts without a mask, an approach intended to address miniaturization requirements in electronics packaging. The digital printing technology can manufacture metallization films ranging from 150 nm to 5 μm in thickness. The resulting films are described with conductivity levels of 20-50% of bulk silver. The complete workflow covers pre-treatment, inkjet printing, and sintering to form a metallic silver film, and the sequence is automated. The process is described as fulfilling semiconductor-industry standards while combining advanced particle-free metal inks with precision inkjet printing equipment. For EMI shielding on chip packages, application pages describe custom thin metallization layers, connecting the digital coating approach with package-level electromagnetic shielding. The application range also includes conductive lines, extending the printed-metal approach from surface metallization to patterned conductive structures in electronics manufacturing. A further named application is chip-metal thermal dissipation, placing the same selective metallization capability in a chip-level thermal-management context. Across these uses, the selective maskless silver-ink process provides patterned conductive metallization for semiconductor packaging and electronics manufacturing.
Capabilities and products
- particle-free metal inks
- precision inkjet printing equipment
- selective maskless metal coating of electronic components
- 2.5D selective inkjet metal coating
- metallization film manufacturing from 150 nm to 5 μm
- automated pretreatment, inkjet printing and silver-film sintering