At a glance
| Booth | N0984 |
| Country | KR |
| Website | www.hanwhasemitech.com/en |
Company profile
Hanwha Semitech is a subsidiary of the mechatronic division in Hanwha Group, which is identified as No.296 among the Fortune 500 companies in 2023. The company has nearly 40 years of machinery expertise spanning SMT, the foundation of electronics assembly, through semiconductor front-end and back-end process equipment. Its development history includes starting Korea's first SMT chip-mounter business in 1989, acquiring the Machine Tools business in 2019, and expanding into front-end semiconductor manufacturing. Hanwha Semitech operates across SMT, semiconductor and machine-tool fields and combines customer-oriented products with customized smart-factory solutions. Its semiconductor business covers both front-end processing, where circuits are patterned and wafers are created, and back-end processing, where wafers are packaged and tested. The company serves global IDM, or Integrated Device Manufacturer, customers and multiple OSAT, or Outsourced Semiconductor Assembly and Test, customers with deposition and packaging equipment. Hanwha Semitech's broader industrial-equipment portfolio includes chip mounters, screen printers, dispensers, inserting solutions, display equipment, software solutions, Mini LED and Micro LED equipment. Its semiconductor portfolio includes PE-CVD, ALD, DieBonder, FlipChip Bonder, TC Bonder and Hybrid Bonder, alongside the company's SMT and machine-tool businesses. Support categories include SMT after-market services and machine-tool troubleshooting, with machine-tool support areas covering introduction, hardware modification, software upgrades and ACC and other items. The broader machine-tool and industrial-equipment menu also includes CNC Swiss Lathe and Dental Equipment categories.
Exhibits
SMT, or Surface Mounting Technology, is an automated process in which electronic components are placed on circuit boards, and Hanwha Semitech's SMT equipment scope includes screen printers, adhesive dispensers and chip mounters for component placement. Hanwha Semitech also provides in-house software solutions intended to improve customer convenience and maximize use of its equipment. T-SOLUTION is its Smart Factory software solution covering material warehousing, production planning, production preparation, production and maintenance throughout the production process. T-SOLUTION connects production processes with higher-level MES and factory-maintenance functions to support automation and intellectualization across manufacturing. Hanwha's Planning Solution uses target quantity and delivery information from upstream MES, ERP and SCM systems to establish optimized production plans. The Planning Solution manages stocked component quantities and uses simulation to predict production-planning time, helping users plan beyond the level of a single line or individual machine. Its planning functions generate production plans from order information, detect BOM errors early through MES interlocking, and set production order by considering priority and model-change time. Additional functions predict daily and weekly production quantities, simulate production finishing time, check component inventory needed to reach target output, and support integrated Part DB management with advance production verification. For semiconductor bonding, the TC Bonder lineup includes DieBonder, FlipChip Bonder, TC Bonder and Hybrid Bonder categories and identifies SFM5-Expert within the TC Bonder lineup. The Flip Chip Bonder lineup includes SFM5, identified as a Next Generation Smart Flip Chip Machine, and SFM3, identified as a 3rd Generation Smart Flip Chip Machine. The DieBonder lineup includes SDB-1, identified as a Smart Die Bonder. Hybrid Bonder is also part of the semiconductor equipment lineup for front-end and back-end processing. The front-end deposition lineup includes PE-CVD equipment, with I2FIT(PE-CVD) included in the PE-CVD lineup. The deposition lineup also includes ALD equipment, with I2FIT(ALD) included in the ALD lineup. Across these product areas, Hanwha Semitech combines SMT assembly equipment and production software with semiconductor deposition and packaging systems for IDM and OSAT manufacturing environments. Production planning begins with systematic management of the entire manufacturing process rather than limiting planning to a single line or machine. Order-based planning, upstream-system target quantities and delivery dates, model-change time, component stock and simulation are combined so production sequence, timing and material readiness can be considered together. The semiconductor equipment family places deposition technologies such as PE-CVD and ALD alongside die, flip-chip, thermocompression and hybrid bonding equipment for front-end and back-end manufacturing. SFM5 and SFM3 provide two named generations within the smart flip-chip machine line, while SDB-1 provides a named smart die-bonder configuration and SFM5-Expert appears in the TC Bonder range.
Capabilities and products
- SMT screen printers
- SMT adhesive dispensers
- SMT chip mounters
- in-house SMT software solutions
- smart-factory software for production processes
- MES/ERP/SCM-integrated production planning optimization
- PE-CVD deposition equipment
- ALD deposition equipment
- die bonding equipment
- flip-chip bonding equipment
- thermocompression bonding equipment
- hybrid bonding equipment
- Mini LED equipment
- Micro LED equipment
- CNC Swiss lathe