At a glance
| Booth | L0516 |
| Country | KR |
| Product categories | Dicing; Sawing; Scribing; Separation Equipment · Die Bonding; Attach Equipment · Die Sorter; Pick & Place; Flip Chip Placement Systems · Marking; Imprinting; Labeling Equipment · Package Handling; Conveying Equipment · Wafer Level Bonders · Wafer Mount; Taping Equipment · Cutting; Drilling; Laser ablation; Beveling Equipment · Lamination; Sheet Laminating Equipment · Package Inspection; Lead Scanners · Wafer Identification; Marking Equipment |
| Website | www.hanmisemi.com |
Company profile
Founded in 1980, HANMI Semiconductor is a global semiconductor equipment company serving approximately 340 customers worldwide. We currently hold the No.1 global market share in the TC BONDER market for HBM, a core component of AI semiconductor, and have also maintained the No.1 global position for 23 consecutive years in micro SAW & VISION PLACEMENT (mSVP), which are essential back-end semiconductor equipment. Headquartered in Incheon, South Korea, and operating a total of seven manufacturing plants, HANMI Semiconductor sustains its competitive edge through a fully vertically integrated manufacturing system that connects the entire value chain-from iron casting production, design, parts processing, software, assembly and inspection, through to distribution and sales. The product and service offering is as follows: 1. HBM TC BONDER 2. 2.5D TC BONDER 120 3. 2.5D TC BONDER 40 C2S 4. 2.5D TC BONDER 40 C2W 5. FC BONDER 75 6. VISION PLACEMENT 7. micro SAW 8. EMI SHIELD 9. META GRINDER 10. LASER
Capabilities and products
- 2.5D TC BONDER 120 equipment
- 2.5D TC BONDER 40 C2S equipment
- 2.5D TC BONDER 40 C2W equipment
- EMI SHIELD equipment
- FC BONDER 75 equipment
- HBM TC BONDER equipment
- META GRINDER equipment
- VISION PLACEMENT back-end semiconductor equipment
- laser semiconductor equipment
- micro SAW back-end semiconductor equipment