At a glance
| Booth | L0516 |
| Country | KR |
| Website | www.hanmisemi.com |
Company profile
Founded in 1980, HANMI Semiconductor is a global semiconductor equipment company serving approximately 340 customers worldwide. HANMI Semiconductor is headquartered in Incheon, South Korea, and operates a total of seven manufacturing plants. Its manufacturing system is fully vertically integrated across iron casting production, design, parts processing, software, assembly, inspection, distribution and sales. HANMI Semiconductor holds the No.1 global market share in the TC BONDER market for HBM and has maintained the No.1 global position for 23 consecutive years in micro SAW & VISION PLACEMENT, or mSVP, which it identifies as essential back-end semiconductor equipment. Its product and service categories span HBM TC BONDER, 2.5D TC BONDER, FC BONDER, VISION PLACEMENT, micro SAW, EMI SHIELD, META GRINDER and LASER equipment. HBM is described by HANMI Semiconductor as a core component of AI semiconductor, linking the company's TC BONDER business directly to HBM assembly requirements. The vertically integrated value chain begins with iron casting production and continues through design and parts processing before software, assembly and inspection, followed by distribution and sales.
Exhibits
The HBM TC BONDER lineup includes TC BONDER 4.5 GRIFFIN, TC BONDER 4.0 TIGER, TC BONDER 1.0 GRIFFIN, TC BONDER 1.0 TIGER and HBM 6-SIDE INSPECTION 1.0. The 2.5D TC BONDER range includes 2.5D TC BONDER 120, 2.5D TC BONDER 40 C2S, 2.5D TC BONDER 40 C2W and BOC COB BONDER. FC BONDER models include FC BONDER 3.5, FC BONDER 3.0, FC BONDER 5.0 and FC BONDER 75. VISION PLACEMENT equipment includes VISION PLACEMENT 6.0 GRIFFIN, 6.0D, 6.0L, 6.0T FAST, 8.0PS, 8.0UD and 8.0UL. The micro SAW family includes micro SAW W1121α, T2101, T1121, P2101, PL1121, PL1201, PL1241 and GL2101. The EMI SHIELD lineup includes EMI SHIELD VISION ATTACH 2.0 X, VISION DETACH 2.0 X, micro SAW & VISION PLACEMENT 2.0 X, TAPE MOUNTER 2.0 X and TAPE LASER CUTTING 2.0 X. META GRINDER 1.0 is included in the grinding lineup, while the LASER category includes LASER ABLATION 5.0 and LASER MARK 3000S. Additional equipment listed under OTHERS includes PICK & PLACE 2.0, COVERLAY ATTACH 2000 and COVERLAY DETACH 2000. A separate product listing also identifies TC BONDER 4.5, TC BONDER 4.0, TC BONDER 1.0, HBM 6-SIDE INSPECTION 1.0, VISION PLACEMENT 6.0, VISION PLACEMENT 8.0PS, VISION PLACEMENT 8.0UD and multiple micro SAW models as part of the equipment scope. Together, these categories cover HBM and 2.5D bonding, flip-chip bonding, vision placement, micro sawing, EMI shielding, grinding, laser processing and related back-end semiconductor operations. Within the HBM TC BONDER family, the lineup distinguishes GRIFFIN and TIGER versions at the 4.5, 4.0 and 1.0 generations, together with HBM 6-SIDE INSPECTION 1.0. The VISION PLACEMENT family spans 6.0-series variants GRIFFIN, 6.0D, 6.0L and 6.0T FAST and 8.0-series variants 8.0PS, 8.0UD and 8.0UL. The micro SAW family includes W, T, P, PL and GL model branches, represented by W1121α, T2101, T1121, P2101, PL1121, PL1201, PL1241 and GL2101. The EMI SHIELD family covers vision attach and detach, a combined micro SAW & VISION PLACEMENT configuration, tape mounting and tape laser cutting under the 2.0 X generation. The equipment architecture therefore extends from bonding and six-side inspection through placement and micro sawing to EMI-shield handling, grinding, laser ablation, laser marking and coverlay-related operations.
Capabilities and products
- HBM TC bonders
- 2.5D TC bonders
- FC bonders
- VISION PLACEMENT equipment
- micro SAW equipment
- HBM six-side inspection equipment
- EMI SHIELD process equipment
- META GRINDER equipment
- LASER process equipment