At a glance
| Booth | N0776 |
| Country | TW |
| Website | www.gudeng.com.tw |
Company profile
Gudeng Precision Industrial Co., Ltd. has evolved from a conventional molding factory into a global semiconductor service provider. The company is described as a Taiwan semiconductor service and critical-material technology business, with an integrated service role around critical-material innovation for semiconductor manufacturing. Its broader carrier portfolio includes 300 mm FOUP products, reticle boxes, TFT-LCD large-size mask boxes, 200 mm wafer PODs, wafer shipping boxes, panel carriers, Diffuser FOUP products, and related carrier products. Wafer and reticle carriers are positioned for advanced semiconductor processes, connecting Gudeng's service role with storage, transport, handling, and contamination-control requirements.
Exhibits
A 6-inch reticle box provides high-performance protection during transport, handling, and storage, with airtightness and gas-filling functions used to maintain temperature and humidity conditions inside the FOUP environment. For 300mm wafers moving between wafer fabs and manufacturing sites, the carrier solution provides high-performance protection with airtightness and shock resistance intended to prevent particle contamination caused by collisions. During transport, handling, and storage, airtightness and gas-filling functions can also maintain a low-humidity clean environment inside the FOUP. The semiconductor handling range explicitly includes a 300mm FOUP designed for 300mm wafer storage and transport, together with EUV POD and Advanced Packaging Handling Solution offerings. The 300mm FOUP uses a precision structure and advanced engineering to provide microenvironment control intended to prevent wafer contamination during storage and transport. Its modular design supports different process requirements with selectable hygroscopic or low-hygroscopic materials, multiple handle colors, and integrated or non-integrated structural configurations. Structural and dimensional features are stated to comply with SEMI standards so the FOUP can be integrated and deployed across semiconductor fabs in different regions. The listed FOUP size is 300mm, or 12 in., with PC or GBM as material options and 13 Piece or 25 Piece configurations. Low-outgassing material is used to reduce outgassing that could contaminate wafers, while ESD static-dissipative material is intended to protect wafers from static-electricity damage. Wear-resistant material is used to reduce particle generation, and the design also includes strong inflation performance and airtightness. The 300mm FOUP supports OHT, RFID, and purge functions, extending the carrier from passive storage into automated fab handling and identification workflows. Selectable items include a customized design for purge-hole configuration and quantity, plus window options with or without a window. Gudeng groups the 300mm FOUP within its Wafer Handling Solution and 300mm Wafer Carrier product structure, linking the detailed carrier specifications to a broader wafer-handling product category.
Capabilities and products
- 6-inch reticle-box transport and storage protection
- 300mm FOUP wafer storage and transport
- EUV POD
- advanced packaging handling solutions