At a glance
| Booth | L0230 |
| Country | TW |
| Website | www.gta.com.tw |
Company profile
GTA MATERIAL CO., LTD. was established in 1993 and evolved from distributing semiconductor equipment and materials into independently developing and producing materials for wafer-processing applications. The company states that its R&D team works directly with customers to co-develop new materials, broaden service flexibility, and address customized material requirements. Its service network includes Taipei, Taoyuan, Zhongli, Longtan, Pingzhen, and Tainan in Taiwan, together with Suzhou and Dongguan in China, supporting localized communication and service. GTA focuses its R&D on semiconductor packaging materials, optical materials, thermal-interface materials, and automotive electronic materials, while its application areas include wafer dicing, wafer back grinding, IC packaging, display direct bonding, camera assembly and waterproofing, PCB corrosion protection, and thermal management. The company describes a modern factory integrating research, manufacturing, and production, using data science and green-manufacturing concepts together with flexible production lines and available capacity for varied customer requirements. For distribution and sales, GTA seeks mature products from international manufacturers, provides localized sales strategies and after-sales service, and works to establish stable long-term supply systems. The company also states that it follows the specifications and designs of international manufacturers while pursuing localized R&D and sales, offering customized options intended to improve product quality and reduce local costs. In 1995 GTA added PCB and SMT departments and began expanding from electronics trading into manufacturing and R&D. In July 1999 the company established overseas offices in Dongguan and Suzhou, and in October of the same year it established a printing steel-plate factory in Tainan. The business expanded into LCD in 2001, added more resources for professional R&D in 2003, created an LED automation-equipment department in 2007, and established an IT business unit in Dongguan in 2009. In 2014 GTA established an optoelectronics business unit in Longtan for touch panels and cover glass, and in 2015 it added an electronic-materials department to develop hydrophobic and waterproof coatings and functional adhesive materials. In 2021 the company purchased a Pingzhen factory in response to increased semiconductor-material demand and recruited R&D personnel for independent development of semiconductor and application materials. In 2023 GTA established a technology center organized around five product-technology fields: liquid materials, thermal-interface materials, composite materials, optical adhesives, and wafer tapes. In 2025 the Pingzhen factory was completed and the five product-technology fields entered mass production, supporting localized R&D and manufacturing of semiconductor, electronic, and automotive materials. GTA lists patents covering a laser-cutting protective-film composition and application, modified polymers, adhesive compositions and packaging tapes, thermal-interface compositions and materials, waterproof adhesives, siloxy-containing (meth)acrylate polymers, pressure-sensitive adhesive compositions, antistatic adhesive cured products, and anti-sulfidation adhesive products containing metal.
Exhibits
Before IC packaging, GTA describes wafer back grinding as the thinning step, and its acrylic PO tape is specified for wafer-dicing applications. Thermal Grease, TCG Series is specified for use between the IC and metal lid in Flip Chip packaging. Laser Grooving Solution is a water-based polymer solution that can be spin-coated on an integrated-circuit wafer to form a temperature-resistant polymer thin film. CleanDice is a water-based polymer solution for blade dicing that rapidly disperses wafer debris and prevents debris accumulation on the wafer surface, reducing corrosion and contamination problems. For plasma dicing, GTA describes removal of wafer-boundary material in a plasma dry-etch environment using reactive gases, typically SF6 or CF4. The liquid-material portfolio for semiconductor and electronic applications includes cleaning liquids, protective liquids, packaging materials, and three-, four-, and five-proof coating materials for wafer manufacturing, IC packaging, and display-panel production. Its laser-grooving protective liquid is a water-based polymer solution intended to improve yield and reduce kerf chipping and dielectric-layer peeling during laser grooving. The diamond-wheel blade-dicing liquid is a water-soluble polymer solution providing both chemical and physical action, while the flux-cleaning liquid uses low-odor solvents and organic components for leadless integrated-circuit cleaning. GTA also lists low-viscosity conformal coating materials for protecting printed circuit boards and electronic components from environmental attack, an acrylic waterproof adhesive for membrane keyboards, a fluorine-free reactive nanocoating that lowers surface tension, and a plasma-dicing protective liquid. The optical-adhesive category uses Optically Clear Adhesive (OCA) for full lamination between Cover Glass, Touch Sensor, and LCD or OLED optical components, affecting optical performance, lamination stress, step filling, and long-term reliability. GTA describes OCA functions in optical reflection and scattering reduction, low-modulus mechanical stress absorption, step filling and air release during processing, and reliability under high temperature, high humidity, thermal shock, and UV exposure. The OpticPB® 17S series is a temperature-resistant low-modulus acrylic automotive OCA, while OpticPB® 285 is a high-adhesion acrylic air-release automotive OCA. For other display applications, OpticPB® 693 provides UV-Cut transparent adhesive for outdoor displays, OpticPB® 17E is a thick temperature-resistant and UV-resistant OCA for large industrial-control displays, and OpticPB® 378 is a secondary-UV low-modulus IPS OCA for consumer electronics. The air-release OCA range includes OpticPB® 28D for electronic paper and OpticPB® 28C as an air-release UV-blocking acrylic OCA for outdoor electronic-paper applications.
Capabilities and products
- high-temperature-resistant low-modulus optical adhesives for automotive use
- UV-Cut optical adhesives for outdoor displays
- thick optical adhesives for industrial control displays
- secondary-UV low-modulus optical adhesives
- outgassing optical adhesives for electronic paper
- wafer laser-grooving protective solutions
- wafer dicing fluids for diamond blades
- flux cleaning fluids for leadless integrated circuits
- protective coatings for PCBs and electronic components
- waterproof adhesives for membrane keyboards
- fluorine-free hydrophobic nanocoating materials
- plasma-dicing protective solutions
- acrylic PO tapes for wafer dicing
- thermal grease for Flip Chip packaging
- custom R&D and manufacturing of wafer-processing materials
- R&D of thermal interface materials
- R&D and manufacturing of composite materials