At a glance
| Booth | N0376 |
| Country | TW |
| Website | www.great-domain.com.tw/en-us/index |
Company profile
Great Domain Enterprise Co., Ltd. was founded in 1982 and specializes in technical services and product representation for the semiconductor and optoelectronics industries. The company is headquartered in Taipei, with branches in Hsinchu and Kaohsiung, and its service network also includes a Shanghai branch established in 1997 and a Shenzhen service office established in 2002. Its locations in Taiwan and China are intended to keep technical support close to science-park customers and to provide comprehensive, timely technical support and after-sales service across both sides of the Strait. Great Domain represents international brands from the United States, Europe, Japan, Korea, and China, linking global technologies with local manufacturing capabilities. Its represented portfolio spans semiconductor components, LED process equipment, critical materials, and integrated solutions for wafer fabrication, packaging and testing, optoelectronic displays, power devices, and compound semiconductors. Long-term customers and partners named by the company include TSMC, UMC, ASE Group, SPIL, and WIN Semiconductors, together with academic and research institutions. The company also names National Taiwan University, National Tsing Hua University, and the Industrial Technology Research Institute among the academic and research institutions it serves. Its technical and sales teams tailor process solutions to customer requirements, with the stated goals of improving yield, reducing costs, and accelerating time-to-market. Great Domain describes professionalism, innovation, and integrity as core principles, linking professionalism to accumulated industry experience and technical talent, innovation to the introduction of advanced technologies, and integrity to reliable long-term customer relationships. The company states that it will continue introducing advanced process equipment and material technologies, deepen collaboration with global partners, and work with customers, original manufacturers, and employees to connect global expertise with local strength.
Exhibits
Great Domain's semiconductor and LED portfolio explicitly includes ICP Plasma and High Speed Atomic Layer Deposition (ALD) Equipment, within a broader represented range of semiconductor and LED equipment and materials. The company also lists 3D Sintering Equipment, a Surface Tension Analysis System for contact angle, and a Bonder & Debonder System with UV Bake System among its products. The BEATRUM jet dispenser is designed for fast, high-precision micro dispensing, includes a heater as standard equipment, and is described as applying materials consistently across low to high viscosities. The BEATRUM SV91 spray valve is intended for consistent coating of low- to medium-viscosity fluids using low-volume, low-pressure air without overspray or misting, and nozzle selection is used to control spray quality. The BEATRUM SV70 conformal-coating valve applies moisture-proof coating patterns on PCBs at lower flow rates, while its square-cut nozzle is designed for stable, faster, drip-free dispensing without overspray. The Die & Wire Bonder supports 45-degree wedge, 90-degree wedge, and ball bonding, with 14.3 mm Z-axis travel, 25 micrometer Z-axis resolution, adjustable dual-point bonding force from 10 to 250 g, and Au or Al wire from 0.7 to 3.0 mil. That bonder uses a three-axis micromanipulator with linear, mutually orthogonal axes that can be locked during bonding, supports ultrasonic and thermocompression bonding, and stores as many as 30 sets of bonding parameters. Its stated applications include corporate R&D departments and academic laboratories working with microwave components, semiconductors, RF devices, LEDs, and hybrid components. The QualiTau Multi-Site Parallel Wafer-Level Probing System is a probing solution designed to test tens to hundreds of DUTs simultaneously rather than functioning only as a probe card. The multi-site system combines a probe station, anti-vibration table, light-tight enclosure, high-powered optical digital camera, optional vacuum hot chuck, multiple-pin mini-probe cards, and a patented method for placing multiple probe cards across the wafer surface. Its alignment controls include global X, Y, Z, and Theta adjustment at the chuck, X and Y adjustment on the rails, and fine X, Y, and Z adjustment at each positioner head. The 300SA Semi-Auto Prober uses linear shaft motor technology and a heat-resistant granite base, and its front-loading semi-automatic configuration includes a microscope bridge with full auto-alignment and automated X-Y-Z travel. The 300SA also includes a touch-panel display and a thermally sealed, light-tight chamber that supports thermal chucks and shielding functions, while Multi-Pin options can be combined with QualiTau measurement systems for high-capacity WLR testing. The REBO-9W ultrasonic rotary-head bonder uses a Bonder Exchange Kit for large, medium, and small wire and ribbon, offers a dual-frequency transducer that switches between 110 kHz and 40 kHz, and can manage 80, 110, and 120 kHz in one generator. REBO-9W can optionally recognize multiple points at once to reduce PRS time, automatically measures and saves post-bond deformation data, and is described as reducing pattern-recognition errors. The REBO-9T provides the same stated exchange-kit capability for large, medium, and small wire and ribbon, dual-frequency 110 kHz and 40 kHz operation, and one-generator management of 80, 110, and 120 kHz. REBO-9T also lists optional simultaneous multi-point recognition for shorter PRS time, automatic storage of deformation measurements after bonding, and reduced pattern-recognition errors. The REBO-X ultrasonic rotary-head bonder targets low vibration and high speed through a lighter bonding head, linear motors on the X and Y axes, and a mineral-cast frame. REBO-X also uses a Bonder Exchange Kit for large, medium, and small wire and ribbon and a dual-frequency transducer for large-wire bonding heads that can switch between 110 kHz and 40 kHz for the relevant bond point. For package-level pulsed electromigration testing, QualiTau's ACE2 system is presented as a response to the limitations of correcting DC test results for AC conditions and to the need to simulate device degradation under AC operation more directly.
Capabilities and products
- semiconductor and optoelectronics technical services and product representation
- semiconductor component representation
- LED process equipment representation
- critical materials representation
- customized process solution planning
- technical support and after-sales service
- ICP plasma equipment supply
- high-speed atomic layer deposition (ALD) equipment supply
- 3D sintering equipment supply
- surface tension and contact angle analysis system supply
- bonding/debonding and UV bake system supply
- jet dispensing equipment supply
- spray coating valve supply
- conformal coating valve supply
- die and wire bonder supply
- multi-site parallel wafer-level probing system supply
- semi-automatic prober supply
- high-capacity WLR testing system supply
- ultrasonic rotary-head bonder supply
- package-level pulsed electromigration testing system supply