At a glance
| Booth | T9419 |
| Country | KR |
| Website | www.globalzeus.com |
Company profile
GLOBAL ZEUS was established in 1970 and has grown alongside the semiconductor industry for more than 35 years, building its business around equipment, technology, parts, and materials used in semiconductor processing. The company provides wet etching and cleaning equipment and technologies, and since the 1980's it has also supplied chemicals, parts, and equipment used in semiconductor processes. In 2009, GLOBAL ZEUS acquired JET, formerly known as SES, adding the technology and extensive experience required to design and manufacture wet etching, cleaning, and stripping equipment. Its wet station and single spin processor are described as market-leading products that are widely used for photoresist stripping, silicon nitride etching, metal etching, and wafer cleaning. Those wet-processing platforms are presented as providing higher throughput and reliability for the stripping, etching, and cleaning operations in which they are used. GLOBAL ZEUS reports annual turnover of more than $200m, indicating the scale of its semiconductor equipment and technology operations. The company maintains semiconductor equipment manufacturing and R&D facilities in both Japan and South Korea to develop and deliver high quality products worldwide. A branch in China and a sales representative in the United States extend customer support beyond the company's manufacturing and R&D bases in Japan and South Korea. Across these operations, GLOBAL ZEUS emphasizes innovative technology development, quality assurance, and customer value as continuing priorities.
Exhibits
The ATOM Debond Cleaner is a 300mm film-framed wafer cleaner that can be configured with up to 4 chambers to increase performance in debond-cleaning workflows. ATOM has been proven in HVM for advanced semiconductor packaging applications including HBM, 2.5D, and Fan-Out, linking the system directly to high-volume advanced-packaging production. The PIO-3B Temporary Bonder is a 300mm temporary bonding system designed for precise bonding with top and bottom alignment and real-time inspection. PIO-3B combines that alignment and inspection capability with a compact heater and automatic cup cleaning to enhance process efficiency and uptime. The PIO-3D Photonic Debonder is a 400mm photonic debonding system for advanced packaging processes. PIO-3D provides a faster debonding process while significantly reducing thermal stress, addressing applications in which thermal sensitivity is critical. Together, ATOM, PIO-3B, and PIO-3D cover debond cleaning, temporary bonding, and photonic debonding across 300mm and 400mm formats for advanced semiconductor packaging.
Capabilities and products
- wet etching equipment
- wet cleaning equipment
- photoresist stripping equipment
- Wet Station
- Single Spin Processor
- 300mm film-framed wafer debond cleaner
- 300mm temporary bonder
- 400mm photonic debonder