At a glance
| Booth | I2927 |
| Country | KR |
| Website | glintmt.com/About |
Company profile
Glint Materials Co. Ltd develops bio-inspired dry adhesives engineered for precise substrate handling in the semiconductor industry, with its technology centered on dry gripping and surface interaction rather than conventional sticky adhesives. The company's history records establishment during 2018-2020, followed by development of a bio-inspired dry adhesive pad for semiconductor wafer handling during 2020-2022. For 2023-2025, Glint Materials Co. Ltd records mass production for major global semiconductor equipment makers and work with more than 150 customers worldwide, linking its materials development to production use by equipment manufacturers and users. The company lists recognition of social contribution and a Medal of Social Contribution from the Red Cross, together with a Technical Achievement certification by Korea Technology Finance Corporation and industry-university R&D collaboration. Its stated core values are harmony, expertise, and continuous improvement, with related principles including no blame, no discrimination, no factions, perspective-taking, deep domain knowledge, professionalism, self-development, process optimization, and work improvement. Glint Materials Co. Ltd invites customers to bring wafer-handling challenges for joint solution development, reflecting a support approach that combines application discussion with customized samples and technical support. Its semiconductor-handling technology is also described as controlling directional adhesion force for wafer and substrate transfer applications, while SurfCon® is positioned as a high-friction non-slip pad with no stickiness and contamination-free performance.
Exhibits
POLMA® is Glint Materials Co. Ltd's own developed raw material for fabricating SurfCon® and is described for semiconductor use as chemically inert and contamination free. CONEPOL® is the company's own developed raw material for applications that require ESD-free behavior and is likewise described as chemically inert and contamination free for semiconductor applications. SurfCon® provides strong shear resistance while remaining completely tack-free, allowing a surface to resist lateral motion without relying on a sticky adhesive feel. Product examples include POLMA® insert-type INSERT FLAT and DOUBLE INSERT FLAT configurations, both offered with customized design options for substrate-handling interfaces. For conductive or ESD-free requirements, the company offers a CONEPOL® insert-type INSERT FLAT configuration with customized design available and ESD Free / Conductive characteristics. CONEPOL® is also used in an adhesive-tape-type DOME with Hole configuration that supports customized design, ESD Free / Conductive use, combination with vacuum suction, and easy attachment. A POLMA® adhesive-tape-type DOME with Hole is offered with customized design, combination with vacuum suction, and easy attachment, providing a non-ESD material option in a similar form factor. Another POLMA® adhesive-tape-type example uses a DONUT shape and is intended for combination with vacuum suction and easy attachment. The POLMA® insert-type O-RING example is specified as AN(AS568) compatible, adding an O-ring form to the available SurfCon®-related geometries. The CONEPOL® adhesive-tape-type SQUARE configuration is described as ESD Free / Conductive and uses conductive adhesive tape with easy attachment. Across these examples, Glint Materials Co. Ltd offers customized samples and technical support, allowing POLMA® and CONEPOL® material choices, insert or adhesive-tape attachment styles, shape, conductivity needs, and vacuum-suction combinations to be matched to the handling application. The product family is aimed at semiconductor wafer and substrate handling where high lateral or shear resistance, low contamination, tack-free contact, ESD-free options, and precise directional gripping can be relevant to transfer and equipment-interface design.
Capabilities and products
- bio-inspired dry adhesives for semiconductor substrate handling
- dry adhesive pads for semiconductor wafer handling
- POLMA® semiconductor-grade chemically inert low-contamination raw material
- CONEPOL® ESD-free conductive material
- SurfCon® tack-free high-shear-resistance non-slip pad
- SurfCon® gripping interface combinable with vacuum suction