At a glance
| Booth | I2927 |
| Country | KR |
| Product categories | Chucks for Wafer and other Substrates · Gaskets; Seals; O rings; Elastomers; Resins · Sealants; Adhesives; Finishes · Conveying; Material Handling Systems · Robotics; Transfer Systems · Static; ESD Control · Stockers; Storage, AMHS |
| Website | www.glintmt.com |
Company profile
Glint Materials Co., Ltd. is a semiconductor materials company focused on dry adhesive and high-friction pad technology for precision substrate handling. Its official site presents SurfCon as a high-friction non-slip pad for semiconductor wafer handling, emphasizing high lateral friction, no stickiness, contamination-free performance and ESD-free characteristics. A SEMI exhibitor profile states that the company was established in 2014 and develops and manufactures high-friction dry adhesive pads for the semiconductor industry, where precise substrate handling is required. The same profile explains that Glint's technology controls directional adhesion force, which is relevant to wafer and substrate transfer applications. Based on the available sources, its business is best described as specialty surface materials for semiconductor handling rather than general automation equipment.
Capabilities and products
- ESD-free semiconductor wafer handling pads
- SurfCon high-friction non-slip pads for semiconductor wafer handling
- contamination-free wafer handling pads
- directional adhesion force control for wafer and substrate transfer
- high-friction dry adhesive pads for semiconductor substrate handling