At a glance
| Booth | I2024 |
| Country | TW |
| Website | www.gilliontec.com.tw |
Company profile
GILLION APPLICATION TECHNOLOGY CO., LTD was founded in May 2004 in Kaohsiung, Taiwan, by an engineering team drawn from science parks, and it currently operates two production bases, the Renwu Plant and the Gangshan Plant. The company is organized into two professional divisions: a materials division that describes itself as Taiwan's first specialist manufacturer providing integrated R&D, production, and sales for electronic-grade functional tape, and an equipment division focused on the design and manufacture of customized, vision-inspection, and automation equipment. Its products are used in semiconductor, display, optical-communications, LED, passive-component, and flexible printed circuit board industries, and the company states that it has established close cooperation with major manufacturers in Greater China. GILLION APPLICATION TECHNOLOGY CO., LTD states that it holds multiple patents across Taiwan and mainland China and gives priority to continuous R&D, advanced-process development, and high-quality products while expanding into international markets. Its operating model therefore combines an electronic-grade functional-material business with a custom-equipment business whose engineering covers vision, automation, measurement, handling, packaging, and other production tasks for the industries it serves.
Exhibits
001-0801_Face Hot Press Machine: One hot-press system forms striking face panels with upper and lower platens heated by cartridge heaters, each with three temperature-sensing locations; Z-axis pressing uses a servo motor and Load Cell to monitor mold pressure, and press pressure and holding time can be set in 10 segments for different product characteristics. 025-1705_Semi-Automatic Wafer Thickness Measurement Machine: A contact multi-point wafer-thickness measurement system measures polished wafers on a Block; the Block is manually loaded, CCD imaging is used for positioning, wafers are measured in sequence, the design can be customized by Block size, wafer size, and measurement points, and it uses a 2um precision contact LVDT probe. 026-0603_PU Molding Hot Press Machine (Manual Type): A PU-mold heating and pressing system bonds the panel surface with PU adhesive and is designed according to platen flatness, heating temperature and uniformity, and pressure per unit area; PU molds are loaded and unloaded manually, with a light curtain in the work area for operator safety. 026-0524_PU Molding Hot Press Machine (Automatic Type): A related PU-mold heating and pressing system uses a servo-module structure for mold entry and exit and must be paired with the 330_PU automated mold-feeding system to reduce labor for PU-mold handling. 028-0302_Striking Panel Automatic Grinding Machine: A panel surface roughening system uses a rotating scouring-pad wheel; its Table-moving structure and servo rotation help avoid grinding dead zones, while grinding speed, movement speed, and programmable wheel pressure can be set to suitable process parameters to improve grinding quality and output; cassette loading supports batch automated production and gives more flexibility for labor allocation. 030-0201_Mold Feeding Machine: A mold-feeding system is designed to operate in line with a PU dispensing machine, intermittently supplying all PU lower molds at a stable feed speed to the dispenser and then sending them to a pickup area where operators combine them with PU upper molds. 053-0101_Die Flipping Machine: An LED die-flipping system handles cassette-loaded iron frames with blue film and dies, flips the dies onto blue film on another iron frame, returns the flipped product to a cassette, and supports batch production with automatic material switching while operators load and unload cassettes in batches. 071-0401_Cutting Station AOI - Semi-Automatic Measurement Machine: A CCD measurement system accepts products placed directly from trays, uses taught feature points, light color and intensity, CCD imaging analysis, specification judgment, and configured measurement quantity and positions, displays results graphically and by color, and can measure cut products by changing the product stage, so operators can review the displayed results visually. 084-0402_Wafer Transfer Unit: A benchtop wafer-transfer system can merge wafers from two wafer cassettes onto a wafer boat, separate wafers from a boat into two cassettes, or transfer wafers between one cassette and a boat, with customized design according to wafer size, wafer thickness, and boat type. 088-0310_Automatic BIN Sorting Machine (Standalone Version): An automated LED finished-product binning system reads product-label data before shipment, bins products according to configured logic, removes accumulated quantities for loading into antistatic bags, and automates shipping-label printing, attachment, confirmation, vacuuming, sealing, and separated placement, with BIN-cell quantity planned by product size and accumulated quantity, substantially reducing the amount of labor required. 093-0101_Automatic Sorting Machine: A tray-product inspection system scans incoming finished products to identify abnormal orientation, incorrect lot numbers, or defects in marked text, moves abnormal products into an abnormal-product tray according to a placement logic, refills empty positions with normal products, and uses a five-nozzle pick structure with automatic nozzle-spacing adjustment for different product sizes, reducing travel between trays and speeding inspection. 169-0203_Striking Panel Thickness Measurement Machine: A benchtop panel-thickness measurement system uses a 2um precision contact LVDT probe and calculates thickness from the difference between the zero point and measured value, while a four-point reference plane and red cross marking help operators visually confirm the actual measurement position. 253-0101_Automatic Edge-Breaking Machine: A ceramic-substrate system removes waste material from all four edges after laser cutting, inspects edge-breaking quality, separates good and non-good products, and handles ceramic substrates in cassette-stacked batches. 254-0203_Automatic Feeding and Collecting Machine: A ceramic-substrate sintering-furnace feed and collection system expands cassette capacity within limited space and allows cassettes to be loaded and unloaded without stopping, keeping feed and collection work continuous and reducing furnace waiting time. 258-0101_Iron Frame Blue-Film Preparation Machine: An automatic blue-film lamination system for LED square iron frames supports cassette handling without stopping the machine and continuously automates cassette presence checking and feed positioning, iron-frame presence checking and pickup, blue-film roll presence checking, film feeding, cutting and lamination, automatic label printing and application, and iron-frame collection, supporting stable production and improving production-capacity efficiency. 260-0201_Marking Verification System: A product-scanning system compares scan results to identify the coordinates of NG marks, automatically updates the product Map, and uploads it to a server. 264-0107_Automatic Film Removal and Lamination Machine (Counter): Another LED system handles tested products arriving on iron frames by imaging and counting dies, removing blue film to separate the product from the iron frame, then laminating release paper and applying a shipping label to the product, while the separated iron frame receives new blue film for continued process use. 272-0110_Automatic BIN Sorting Machine (Linked Version): A second LED finished-product binning configuration performs label reading, logic-based binning, antistatic-bag loading, shipping-label printing, attachment and confirmation, vacuuming, sealing, and separated placement, and can connect multiple machines into one system when a large number of BIN cells is required, substantially reducing the amount of labor required. 274-0101_Glue Frame Blue-Film Preparation Machine: A glue-frame blue-film system laminates and cuts blue film for incoming glue frames, prints and applies product-specific labels, scans to confirm the data, loads products into cassettes one by one, sends scan-confirmation NG products to a separate NG cassette, and uses batch cassette replacement. 283-0201_Wafer Cassette Backlight Box: A wafer-cassette inspection system checks wafer quantity or cross-slot conditions without opening the cassette by placing it directly on a backlight box, using an LCD light with numeric adjustment of brightness and color temperature. 322-0102_Striking Panel Automatic Drilling and Chamfering Machine: A striking-face panel drilling and chamfering system processes two holes at a time, uses servo control for drill rotation speed and feed speed, handles panels in cassette-stacked batches, and includes a dust-collection unit to reduce work-area contamination, with servo settings allowing operation under selected process parameters. 082-0101_Automatic Screw Fastening Machine: uses manual product loading, moves the product to a fixed position, automatically supplies and fastens screws, and allows the fastening torque value to be configured for the product. 330-0101_PU Automated Mold Feeding System: transfers PU molds by Table conveyance from the entrance into designated automatic PU hot-press machines for heating and pressing, then sends completed molds to a cleaning area for manual mold cleaning before the next production cycle. 330-0101_PU Automated Mold Feeding System: is used with multiple automatic PU hot presses; a mold-distribution unit carries molds between two conveyor lines, while a lower conveyor returns cleaned upper and lower molds from the cleaning area to the front end for preparation of the next batch. 333-0101_Striking Panel Automatic Blue-Film Packaging Machine: laminates protective blue film onto the striking-panel surface before cutting to reduce defects from pre-cut handling; panels enter and leave in cassettes, cassette exchange can occur during machine operation, and roll-fed blue film is pulled, cut, heated, and laminated while the release film is automatically rewound. 336-0101_Striking Panel Back-Surface Grinding Machine: roughens the back of cut striking panels using a 12-inch scouring-pad wheel with a servo motor and a programmable-pneumatic-pressure downforce cylinder; its Table stage can rotate so position, angle, speed, travel speed, and downforce can be adjusted, and irregular panels are carried on stackable trays for batch production. Across the equipment laboratory, the available systems therefore cover thermal pressing, contact measurement, vision inspection, wafer and die transfer, sorting and packaging, ceramic-substrate handling, film preparation, automated fastening, panel drilling and grinding, and linked mold transport, with customization used where product dimensions, wafer dimensions, measurement points, boat type, or process conditions differ.
Capabilities and products
- electronic-grade functional tape R&D and manufacturing
- custom vision-inspection and automation equipment design and manufacturing
- striking-panel hot-press forming equipment
- wafer contact multi-point thickness measurement with 2um LVDT
- PU mold hot-press forming equipment
- automatic striking-panel grinding and roughening equipment
- PU dispensing mold-feeding equipment
- LED die flipping equipment
- CCD cutting-station AOI semi-automatic measurement equipment
- automatic screw fastening equipment
- wafer cassette-to-boat transfer equipment
- automatic LED BIN sorting and vacuum packaging equipment
- automatic tray-product scanning and sorting equipment
- striking-panel thickness measurement with 2um LVDT
- ceramic-substrate automatic edge breaking and quality sorting
- automatic ceramic-substrate sintering-furnace feed/collection equipment
- automatic blue-film lamination for LED square iron frames
- NG-mark scanning and map update system
- LED die counting, film removal and labeling equipment
- glue-frame blue-film lamination, cutting and labeling equipment
- closed-cassette wafer count and cross-slot inspection
- automatic striking-panel drilling and chamfering equipment
- automated PU mold transport system
- automatic protective blue-film packaging for striking panels
- striking-panel back-surface grinding equipment