At a glance
| Booth | N0662 |
| Country | TW |
| Website | www.gpmcorp.com.tw |
Company profile
Gallant Precision Machining Co., Ltd. was founded in 1978, established its own GPM brand, and was listed on the Taiwan Stock Exchange in 1998 under TWSE: 5443. The company profile lists capital of 1.6 billion and 510 thousand, 8 sites, and an award record of 65 awards. For nearly five decades, the company has been deeply rooted in Taiwan, gathering resources and R&D talent across the Strait, building an engineering R&D team, and developing a full range of core technologies. Its business scope includes Semiconductor Advanced Processing Equipment, AOI & Metrology Equipment, Flat Panel Display Processing Equipment, AI Robotics System, and Consultant service. With process technology, R&D, production, and manufacturing capabilities, Gallant Precision Machining Co., Ltd. states that it has entered core supply chains in LCD, SEMI, PCB, and intelligent automation. Through the G2C Alliance, the company provides a broader combination of products and services, with particular attention to the advanced semiconductor packaging market. Gallant Precision Machining Co., Ltd. works with customers on collaborative development and process-requirement planning and describes its role as providing total solutions for process and technology while improving technology and service quality. The company also describes continued entry into new industries and reinforcement of horizontal cooperation as part of its gradual transformation and its effort to help customers improve corporate competitiveness. Gallant Precision Machining Co., Ltd. is headquartered in Hsinchu Science Park and has innovation and R&D centers and production bases in Central Taiwan Science Park, Tucheng Industrial Park, and Suzhou, China. Its service locations extend across Taiwan, eastern China, central China, southern China, northern China, and Southeast Asia, where the company describes a 24-hour on-call after-service system for helping customers solve production problems. The stated service framework covers quality (Q), delivery (D), technology (T), cost (C), and service (S), with the goal of delivering total solutions and equipment with maximum production efficiency. Through continuing R&D, the company reports acquiring utility and invention patents and receiving awards from the Ministry of Economic Affairs, Hsinchu Science Park Administration, and Central Taiwan Science Park Administration. Gallant Precision Machining Co., Ltd. also reports recognition and support from world-leading enterprises, alongside its work to develop manufacturing-process and equipment technologies and to serve established and emerging industries.
Exhibits
In the semiconductor field, Gallant Precision Machining Co., Ltd. cites 48 years of experience in IC process and inspection equipment and mold development, applies group resources and core technologies to IC pick-and-place and forming functions, and provides one-stop service from design and manufacturing through assembly and testing. Its semiconductor product categories include AOI automatic optical inspection equipment, Grinding planar grinding equipment, Polisher planar polishing equipment, Wet Process wet-etching equipment, and Prober electrical test systems. The AOI platform can be customized for different process inspection requirements and includes artificial-intelligence-based automatic defect detection and classification. The AOI range includes wafer and post-dicing wafer visual optical inspection, Glass Wafer/Bare Wafer surface inspection, fully automatic white-light interferometry measurement, and 3D NIR transmission inspection. Across the AOI range, the listed wafer size is 4"~12" and panel size is ~700mm x700mm, while general inspection items include surface defect, probe mark, RDL, bump, pillar, and metrology. The wafer and post-dicing wafer visual optical inspection system is intended for defect inspection before and after wafer dicing in advanced-packaging processes, and it provides a guided operating interface, real-time simulated inspection, and AI-based automatic defect detection and classification. Its listed visual-inspection items include Particles, Dimples, Pimples, Scratches, Chips, Broken, Crack, Stain, and Residual. The Glass Wafer/Bare Wafer surface-inspection system is intended for Carrier Wafer or Bare Wafer in Prime, Test, or Reclaim uses in advanced packaging and uses Color-One-Scan with an AI architecture for defect-type classification. That system lists Topography repeatability of 0.12nm and measurement items including Roughness, Step height, Film thickness, Surface topography, and CD. The fully automatic white-light interferometry measurement system provides high-speed, non-contact 3D surface-topography measurement for block height, fine-line height, line width, line spacing, thin-film analysis, sub-nanometer surface topography, and front-end or back-end semiconductor metrology. The 3D NIR transmission inspection system covers automatic optical inspection for hidden chipping after wafer dicing and 3D transmission inspection for TGV processes, with non-destructive high-penetration-depth 3D imaging and resolvable three-dimensional structural information. Its 3D NIR functions include penetration through dicing film including DAF without a medium and AI-assisted automatic dimensional measurement and defect identification; listed dicing items include inner crack, side wall crack, topside crack, backside crack, and dicing slant. For TGV measurement, the listed items include Panel Dimension, surface appearance, laser modificaion qulity, TGV etching metrologies, seed layer qulity, and glass dicing qulity. The Strip Grinder supports automatic thickness measurement with full-panel measurement, automatic wheel dressing with automatic thickness compensation, multi-mode water supply using external or circulation-water modes, and a contact plus non-contact thickness-measurement mechanism using TCG+NCG. Its high-output configuration can grind four strips simultaneously as X4L, directly supporting the stated four-strip simultaneous-grinding capability. The In-feed Grinder provides fully automatic panel-level grinding, uses high-precision air-static-pressure spindles on both upper and lower spindles, provides online real-time thickness measurement through an In Process Gauge, and separates rough and fine grinding for flexible production. For the In-feed Grinder, Maximum supported size is 700*700mm and listed Grinding materials include EMC, EMC + Cu, EMC + Die, and EMC + Die + Cu. The Strip planar grinder lists Maximum supported size of 195*300mm, fully automated package-strip grinding with magazine in / magazine out, automatic thickness measurement and compensation using Non Contact Gauge+Touch Contact Gauge, dual cooling-water choices of pure water or cutting fluid, and flexible rough plus fine grinding. The panel Polisher lists Maximum supported size of 700*700mm and Polishing materials including EMC + Cu, EMC + Die, EMC + Die + Cu, Glass + Cu, Glass, PP, and EMC, with staged pressure and rotation-speed control for polishing optimization. Reclaim CMP provides fully automated wafer polishing with dry-in/dry-out (DIDO); each Polish table can operate independently or be closed through Bypass, and process scheduling can run tables independently in parallel or link them in series. Reclaim CMP also provides multi-zone, multi-stage down-force capability with integrated multi-stage cleaning, is mainly applied to wafer reclaim, supports Ø300mm, and lists Silicon (Si) as the polishing material. For Panel Polisher, the upper and lower polishing plates use special steel with high compressive and tensile strength to reduce deformation after use, while automatic pressure compensation maintains stable polishing pressure and an automatic LD/ULD system improves equipment utilization. The Wet Process equipment applies explosion-proof and static-dissipative design to the machine tanks, piping, and mechanisms and can integrate a CO₂ fire-protection system. Its software is developed in-house by GPM and can be modified immediately for process and equipment-department requirements. Adjustable Bench flow, upper and lower Agitation, and wafer rotation can increase reaction rate, improve stripping capability, improve etch-rate uniformity, and optimize development uniformity. The Prober electrical test system is listed for electrical inspection of semiconductor integrated passive components, completing the semiconductor equipment range with an electrical-test function.
Capabilities and products
- semiconductor AOI automatic optical inspection equipment
- wafer visual optical inspection before and after dicing
- Glass Wafer/Bare Wafer surface inspection
- fully automatic white-light interferometry 3D metrology
- 3D NIR transmission inspection
- strip planar grinding equipment
- panel-level In-feed Grinder equipment
- panel polishing equipment
- Reclaim CMP wafer polishing equipment
- wet-process wet etching equipment
- Prober electrical test systems
- AI-based automatic defect detection and classification for AOI
- one-stop semiconductor equipment design, manufacturing, assembly and testing