At a glance
| Booth | N0662 |
| Country | TW |
| Product categories | Wafer Identification; Marking Equipment · Package Test Systems |
| Website | www.gmmcorp.com.tw |
Company profile
Founded in 1995, GMM is specialized in the design and manufacture of precision electronic molds, automation machinery, and the precision parts of equipment mold. As the semiconductor industry and market matured gradually and grew steadily, in 2011, we merged with the “IC Business Unit” that has been spun off from GPM to provide customers with complete front-end and back-end packaging and inspection equipment for semiconductor manufacture. Our major product ranges include semiconductor process equipment, semiconductor detecting equipment, laser application equipment, precision machinery, and precision molds. By strengthening division of labor, we hope to share resources, share production, enhance core technology, expand market, and improve localized services in Taiwan, Hong Kong, and China, to enhance the overall corporate operating performance. Major Products: Chip Sorter/ Die Bonder/Tooling & Equipment for IC Packaging / Laser Marking /More models / MOLDING/ Die Set / Toolings
Capabilities and products
- automation machinery for semiconductor manufacturing equipment
- back-end semiconductor packaging and inspection equipment
- chip sorters
- die bonders
- front-end semiconductor packaging equipment
- laser marking equipment for wafer identification and packages
- molding die sets and IC packaging toolings
- precision electronic molds
- tooling and equipment for IC packaging
Related product topics
- Semiconductor Automation Equipment
- Custom Semiconductor Automation Equipment
- Semiconductor Packaging Equipment
- Die Bonders
- Leadframe Marking and Stamping
- IC Packaging Molding Dies and Tooling
- Semiconductor Packaging Inspection Systems
- Wafer Laser Marking & Alignment
- Precision Mold Design and Fabrication
- IC Sorting Systems