At a glance
| Booth | N0662 |
| Country | TW |
| Website | www.gmmcorp.com.tw |
Company profile
Gallant Micro. Machining Co., Ltd. specializes in the design and manufacture of precision electronic molds, automation machinery, and precision parts for equipment molds, and it also conducts R&D, manufacturing, and sales of semiconductor production equipment and molds. The company’s semiconductor business traces its origins to the Semiconductor Business Unit of GPM and Suzhou Gallant Precision Machinery Co., Ltd.; those units were formally spun off and integrated into Gallant on March 1, 2011, and the 2011 integration expanded the company’s ability to provide front-end and back-end packaging and inspection equipment for semiconductor manufacturing. Its major business and product ranges cover semiconductor process equipment, semiconductor detecting equipment, laser application equipment, precision machinery, and precision molds. Gallant Micro. Machining Co., Ltd. is headquartered in the Tucheng Industrial Park, operates an innovation R&D center in the Tai Yuen Hi-Tech Industrial Park, and has a manufacturing site in Suzhou. The company provides services across Taiwan, China, Japan, Korea, and Southeast Asia, giving its semiconductor-equipment and precision-mold business a service footprint spanning several Asian manufacturing markets. Its division-of-labor approach is intended to share resources and production, strengthen core technology, expand markets, and improve localized services in Taiwan, Hong Kong, and China. Gallant Micro. Machining Co., Ltd. obtained ISO 9001 international quality certification in June 2017 and was listed on the Taipei Exchange on October 23, 2018 under Stock Code 6640. The company reports holding 100 patents in Taiwan and 72 patents in China, alongside its continuing development of semiconductor molds, packaging equipment, and advanced-packaging technologies. Its technology-development model includes work on equipment for emerging semiconductor processes, continued enhancement of product performance, and product strategies intended to help customers strengthen their competitiveness in securing orders. Gallant Micro. Machining Co., Ltd. collaborates with government research institutes and academic-industrial organizations on key technologies for advanced packaging equipment and combines the strengths of international module suppliers through its system-integration capabilities. The company states that it has maintained ten consecutive years of profitability and continues to strengthen its core product lines while expanding into the Chinese market. Its major clients include TSMC, SPIL, ASE, and other top-tier semiconductor manufacturers, giving the company named customer relationships across major semiconductor production businesses. In recent years, Gallant Micro. Machining Co., Ltd. has expanded into 3DIC and other advanced-packaging technologies and has applied its core competencies to emerging opportunities in electrical testing and 5G.
Exhibits
For advanced semiconductor packaging, Gallant Micro. Machining Co., Ltd. supplies precision pick-and-place equipment, automatic laser-marking machines, automatic punching and forming machines, precision molds, and mechanical equipment. Its wider packaging-equipment range includes high-precision die sorters, die bonders, trim and form machines, automatic molding machines, laser-marking systems integrated with optoelectronic technology, and optical-inspection equipment intended to address advanced-packaging process needs. The listed product family also includes chip sorters, die bonders, laser-marking machines, trim and form equipment, molding machines, cutting and forming equipment, hot presses, and precision molds. The KB-9150 Die Bonder is designed for 3D IC processes and combines its bond-head design with flexible wafer and substrate handling using standard load port, MCLP, and EFEM options, plus data traceability, reporting, and customizable equipment-communication functions. KB-9150 specifications list face-down chip sizes of 0.5x0.5~40x40mm with an optional 40x40mm~70x70mm range, chip thickness of 0.1mm to 1mm, dipping force of 1~20N, bonding force of 1N~300N, and accuracy of < 3um. For KB-9150 wafer and glass-carrier load and unload, the listed interfaces are EFEM, OHT, and Load port, giving the bonder multiple named automation-interface choices for material handling. The KB-9300 Die Bonder is also designed for 3D IC processes and provides flexible wafer and substrate handling, data traceability and reporting, and customizable equipment communication. KB-9300 supports a 12" wafer with frame, specifies bonding accuracy of < 3 um and bonding force of 1N~300N, lists chip thickness of 25um~2000um, and gives chip-size ranges of 1x1mm~29x29mm as an option and 40x40mm~100x100mm. The KB-9X00 Die Bonder is designed for Fan out and 2.5D/ 3D IC processes, with flexible wafer and substrate handling through standard load port, MCLP, and EFEM options, data traceability and reporting, customizable equipment communication, and stated accuracy of < 3um. The KS-812 Chip Sorter supports quick changes among 2, 3, and 4-inch trays, uses a dual feeder for continuous tray operation, and incorporates a high-speed linear Pick & Place module together with a particle-proof tray-transfer design. KS-812 can add real-time chip-backside inspection during the Pick & Place process as an option, provides automatic bin sorting for 3 or 6 bins, and includes wafer-mapping functions with Easy mapping and File mapping. Its listed KS-812 specifications include X, Y accuracy of ±50μm and θ of ± 0.5°, automatic input and output load/unload, cycle time of ≦ 0.6 sec excluding pick-and-place delay time, 2", 3", and 4" chip trays, die thickness of 0.2mm~0.7mm, and 12" standard wafer support with an 8" option. For chip size, KS-812 lists 0.5mm~35mm and states a chip-dimension condition of 10 ≦ chip dimension (L/W) ≦ 55, while its binning capability is a single bin with optional 3 or 6 bins. The KS-856 / 852 Chip Sorter is described as a high-speed 6S inspection solution for chip sorting, with a switchable flip function for face-down or face-up applications and a stated large-die inspection range of 0.5-50mm. KS-856 / 852 offers flexible load and unload options for waffle pack, JEDEC tray, and tape reel, and it also offers die-thickness measurement as an optional function. Its listed accuracy is X, Y = ± 30μm and θ= ± 0.2°, with 2", 3", and 4" tray sizes, automatic input and output load/unload, and cycle time of ≦ 0.3 sec/ chip excluding process time. KS-856 / 852 lists chip size of 0.5mm~20mm with an option of ~2 x 50mm or customized sizing, die thickness of 0.10mm~2mm with a 2mil option, 3-bin capability with a 6-bin option, and 12" standard wafer support with an 8" option. For inspection, KS-856 / 852 lists topside and backside checks for chipping, crack, residue glue, and defect size > 10um, side-wall inspection for chipping, crack, and defect size > 10um, plus a pick-up force of 50~150g. Its mapping functions include Easy mapping, File mapping, and Barcode auto loading, adding automated identification and mapping support to the chip-sorting and inspection workflow.
Capabilities and products
- precision electronic mold design and manufacturing
- automation machinery design and manufacturing
- front-end and back-end semiconductor packaging equipment manufacturing
- high-precision die sorter manufacturing
- 3D IC die bonder manufacturing
- automatic laser-marking machine manufacturing
- trim-and-form equipment manufacturing
- automatic semiconductor molding machine manufacturing
- semiconductor optical inspection equipment manufacturing
- high-speed 6S inspection for chip sorting