At a glance
| Booth | J3146 |
| Country | TW |
| Website | galaxies.com.tw/en_us |
Company profile
Galaxy Technology Development Company was established in 2011 and focuses on development and integration of the green-energy technology industry chain through materials, processing equipment, system integration, and technical service. The company supplies materials and processing equipment for cutting, fitting, grinding, polishing, and measurement processes used in semiconductor materials including SiC, GaN, and Silicon, as well as LED, precision ceramics, gemstones, and related precision industries. Galaxy works with advanced domestic and international partners to develop new products, technologies, and applications and uses systematic technology integration to provide process technologies for new products. Its customer-service scope and technical-collaboration relationships extend across Taiwan, the United States, Germany, the United Kingdom, France, China, Japan, Korea, Singapore, Malaysia, Vietnam, and other regions. The company's service purpose is to connect internal and external partners around customer requirements, and its brand image is described as a Total Solution Provider for professional technology system integration and technical services. Galaxy states that materials and finished products comply with environmental standards and that its manufacturing direction targets zero-pollution and environmentally friendly production. Its business scope combines process materials, equipment, contract manufacturing, technical integration, and measurement, making the company relevant to wafer, substrate, and hard-material processing rather than electronic-device design.
Exhibits
For wafer bonding and thinning, Galaxy bonds wafers to carrier plates using a medium and then performs grinding, polishing, and other thinning operations to reduce yield loss. Polishing is used to obtain a flat and smooth wafer surface for downstream semiconductor-device reliability and performance, with precise process control used to reach required surface characteristics and quality. Its polishing and CMP approach combines chemical reaction and mechanical friction with polishing pads, slurry, and applied pressure to remove excess material and surface defects and improve wafer flatness and surface quality. CMP consumables include CMP Slurry products such as CMP60 and CMP160, using nanoscale abrasive particles and special substrate preparation with low abrasive content, high purity, fine grain size, and no special cleaning process stated for the product family. CMP Polishing Pad products provide multiple surface options such as flat and lattice patterns and are intended to work with CMP polishing liquid to help machining surface roughness meet demanding requirements. The Mavlipa G3 Nanoparticle Analyzer is a third-generation system for semiconductor CMP slurry metrology and provides real-time, undiluted Particle Size Distribution and Large Particle Count measurements for slurry types including high-concentration opaque Ceria or Silica solutions. The G3 measures slurry without dilution, avoiding dilution-related aggregation errors and allowing sample flow to return to the loop to conserve raw material. Its patented Multi-Sensor Technology, MSOPS, spans a concentration range of 9 orders of magnitude, while background-scattering suppression is designed to handle opaque solutions and detect subtle particle changes despite optical turbidity. Patented Low/High Flow Operation automatically optimizes between flow conditions to capture both the slurry Main Mode and LPC portions of the Particle Size Distribution, and Gen3 detection algorithms provide a real-time data stream without additional mathematical modeling or complex calibration. All wetted parts are made of Teflon, Sapphire, and Kalrez for chemical stability and to avoid metal-ion contamination. Applications for the nanoparticle analyzer include formulation R&D, Incoming Quality Assurance after shipping, storage, or blending, 24/7 in-line Statistical Process Control, slurry-loop monitoring for filter or system anomalies, and Point of Use detection of abnormal large particles before the polishing platen. The analyzer's stated detection-size range is 100 nm with a minimum of 80 nm to above 5 μm, and maximum concentration is up to 3 x 10⁹ particles/ml. For SiC processing, Galaxy offers materials and equipment for cutting, grinding, and polishing together with contract manufacturing, while collaborating with strategic partners on new-material development and systematic technology integration. SiC is described as a wide-bandgap semiconductor material with low conduction losses, high breakdown voltage, and high switching-frequency capability, with applications extending into aerospace exploration, telecommunications base stations, automotive engines, and high-frequency devices. For GaN, the company offers materials and processing equipment for grinding and polishing and provides contract manufacturing while developing new materials with strategic partners for emerging high-technology applications. GaN is described as sharing wide-bandgap, low-conduction-loss, high-breakdown-voltage, and high-switching-frequency characteristics with SiC and as competing with SiC in specialized high-technology fields. For Silicon wafers and GaAs, Galaxy is developing technologies particularly for integration of VCSELs in optical-communication and 3D-sensing applications, and it combines new process technologies and human resources for mass-production grinding and polishing of semiconductor materials. The Sapphire process covers waxing, grinding, polishing, and wafer thinning, and the wafer-backside thinning process is paired with Galaxy machines and consumables to improve customer productivity and reduce production costs. Quartz and glass processing includes cleaning, grinding, fine grinding, polishing, cleaning, and inspection using abrasives, tools, and polishing agents to obtain smooth surfaces, high surface precision, and flatness for optical devices, fiber-optic communication, and semiconductor manufacturing.
Capabilities and products
- semiconductor wafer thinning
- supply of CMP slurry
- supply of CMP polishing pads
- supply of nanoparticle analyzers for CMP
- real-time particle-size and large-particle measurement for CMP slurry
- supply of SiC cutting, grinding and polishing materials and equipment
- supply of GaN grinding and polishing materials and equipment
- sapphire wafer grinding, polishing and thinning
- quartz and glass grinding and polishing
- cutting, grinding, polishing and measurement process equipment integration