At a glance
| Booth | N1083 |
| Country | TW |
| Website | www.gcmicro.com.tw |
Company profile
G.C MICRO TECHNOLOGY CO., LTD. was established in Taoyuan City, Taiwan in 2009 as a professional manufacturer of contact probes, rubber tips, bakelite collets, ejecting needles, EFO tools, die-shear tools, wire-pull tools, and metal crucibles for semiconductor IC assembly and LED chip manufacturing and packaging. The company also represents worldwide high-technology suppliers for products including optical diffuser lenses and DOE for ToF 3D imaging, high-thermal-conductivity TCM/TIM materials for thermal dissipation, and sockets for electrical testing of devices. Its service and manufacturing range includes Pd/Ag/Cu and BeCu alloy contact probes, plastic and metal ejecting needles and modules, rubber tips, bakelite collets, other metal parts, and diffuser lenses for ToF 3D imaging applications. G.C Micro develops products in response to customer demand and cites rubber tips with ID < 0.05 mm for mini-LED chip sorting as an example that reached mass production. For local customer service, the company has sales and FAE offices in Suzhou and Xiamen and continues R&D of consumable materials for LED and semiconductor IC testing and assembly. G.C Micro implemented ISO-9001 and obtained certification in 2014, after establishing its Suzhou office in 2012 and before establishing its Xiamen office in 2016. A new 4,000 m2 factory was completed in 2021, following the 2017 to 2020 period in which ID=0.03 mm BAC Vacuum Collets were mass-produced and capacity was expanded to 250K/month for LED alloy bent-pin probes and 250K/month for Vacuum Collets. In 2024 the company developed Vacuum Collets for semiconductor IC packaging and test FT stations, reported adoption by multiple customers, introduced multi-hole porous Vacuum Collets, and recorded Patent M667294 as a Utility Model. In 2025 it put rhenium-tungsten cantilever probes into mass production at a stated capacity above 150K/month, developed large-size dissimilar-material Vacuum Collets for CoWoS bare-die packaging and ultra-low-temperature -90℃ Vacuum Collets, expanded sales into Southeast Asian markets, and listed Patents M674460 and M677059 as Utility Models. In 2026 it put alloy-material cantilever probes into mass production at a stated capacity above 60K/month, introduced Perimeter Wall-type Vacuum Collets into mass production, and listed Patent M682127 as a Utility Model.
Exhibits
G.C Micro's semiconductor and LED tooling range includes contact probes, cantilever probes, vertical probes, tungsten-carbide and other metal ejecting needles and modules, rubber tips, bakelite collets, EFO tools, die-shear tools, wire-pull tools, and metal crucibles. Cantilever and vertical probe needles are used for wafer-level chip probing and testing before the wafer is singulated into dies, and probe needles serve as a key component of a probe card by contacting chip pads for electrical testing. The general cantilever-probe range lists probe diameters of 50 to 500 um, lengths of 38 to 102 mm, Sharp or Flat Tip shapes, and tip diameters of 6 to 10 um. Mechanical Grinding Probe specifications list P7, H3C, and Pd Alloy materials, diameters of 50 to 250 um, lengths of 50 to 102 mm, Flat Tip geometry, 6 to 10 um tip diameter, and a Semi Matte surface. Chemical-etching Probe specifications list Ni-W and Ni-ReW materials, diameters of 60 to 500 um, lengths of 38 to 102 mm including 1.5-inch through 4.0-inch versions, Sharp or Flat Tip forms, and Semi Matte or Polished surfaces. Insulation-coating specifications cover Ni-W, Ni-ReW, and P7 probe materials with 2 to 5 um Polyimide coating thickness. Tungsten-carbide ejecting needles are mainly applied to LED chip-sorting machines and semiconductor IC die bonding in assembly processes, where the needles release dies from tape without damaging the dies. A typical rounding-type tungsten-carbide ejecting needle is listed at 17 mm length, 0.7 mm diameter, 10 degree tapering angle, and 22 um tip radius, while a top-flat type is listed at 17 mm length, 0.7 mm diameter, 10 degree tapering angle, and 50 um Tip SR. The main tungsten-carbide specification range includes 0.7 mm diameter with +/- 0.05 mm tolerance, 12 to 17 mm length with +/- 0.05 mm tolerance and custom design available, 10 degree tapering angle with +/- 1 degree tolerance, and tip radius R from 12 to 300 um with custom design available. The tungsten-carbide material is listed as WC: Co (8.3%) with hardness above 1600.0 HV3 and 91.5 HRA, and all materials are stated to comply with SGS RoHS testing. The ejecting-needle data are measured by G.C Micro with calibrated equipment and are intended to be correlated with customers after qualification, allowing dimensions and tip structure to be selected according to die size, aspect ratio, and the need to avoid die damage. G.C Micro lists extensive rounding-type part-number variants with different lengths, tapering angles, tip radii, Flat options, and color-ring options, providing a catalog for matching ejecting-needle geometry to different die-handling requirements. Alloy-material cantilever probes are in mass production at a stated capacity above 60K/month, while rhenium-tungsten cantilever probes are in mass production at a stated capacity above 150K/month. The broader product and application scope also includes diffuser lenses for ToF 3D imaging and consumable parts for semiconductor IC assembly and LED chip manufacturing and packaging.
Capabilities and products
- contact probe manufacturing
- cantilever probe manufacturing
- vertical probe manufacturing
- semiconductor ejecting needle manufacturing
- rubber tip manufacturing
- Bakelite collet manufacturing
- EFO tool manufacturing
- die-shear tool manufacturing
- wire-pull tool manufacturing
- metal crucible manufacturing
- supply of diffuser lenses for ToF 3D imaging
- Vacuum Collet manufacturing for CoWoS bare-die packaging