At a glance
| Booth | R8124 |
| Country | DE |
| Website | www.ficontec.com |
Company profile
ficonTEC supplies automated assembly and test systems for photonic devices, including integrated photonics and silicon photonics. Its systems are intended to support the industrialization of silicon photonics at scale through automated production and testing. The company focuses on device micro-assembly and testing for the photonic-device industry using high-precision production systems and advanced automation. Core technical areas include fiber alignment, active optical assembly and automated testing, with precision, repeatability and scalability emphasized for high-volume manufacturing. ficonTEC's positioning spans photonics, advanced packaging and automated micro-assembly for optical elements, fibers and chips. The automated assembly and test scope is specifically focused on integrated photonic devices, combining production automation with device-level verification for photonics manufacturing.
Exhibits
ficonTEC designs fully automated passive and active photonic-device assembly systems for optical-element, fiber and chip assembly tasks. The listed application areas include sensors and lidar, HPLDs, co-packaging and PIC assembly. Assembly capabilities include passive and active high-precision alignment for optical components and photonic-device integration. The automation range also includes bonding, flip-chip align-and-attach and chip-on-submount processes. Hybrid integration is included alongside fiber alignment and pigtailing for photonic-device assembly. Optical-element assembly and pick-and-place functions are part of the same automated micro-assembly portfolio. Joining processes named for the equipment include welding, soldering and epoxy bonding. Automated testing is integrated with assembly functions, connecting the equipment portfolio to both production and verification of integrated photonic devices. The combination of fiber alignment, active optical assembly and automated testing is intended to provide repeatable automation suitable for scaling photonic-device manufacturing. For silicon-photonics production, the systems connect micro-assembly, precision alignment, bonding and test steps within automated manufacturing workflows. The fully automated platform scope covers both passive and active assembly rather than limiting the equipment to a single alignment mode. By covering optical elements, fibers and chips in the same stated task range, ficonTEC addresses multiple component types used in photonic-device and PIC assembly. These capabilities place the exhibit offering at the intersection of integrated photonics, silicon photonics, co-packaging and automated advanced micro-assembly.
Capabilities and products
- fully automated passive/active photonic-device assembly
- optical-element, fiber and chip assembly
- automated assembly and test systems for integrated photonic devices
- fiber alignment
- active optical assembly
- automated optical testing