At a glance
| Booth | P5324 |
| Country | TW |
| Website | www.festo.tw |
Company profile
Festo Co., Ltd. is part of Festo, an independent family-owned company established in 1925 and based in Esslingen a.N., Germany. Festo entered the Taiwan market in 1979, established Festo Co., Ltd. in New Taipei City, and later set up branch offices in Taichung and Kaohsiung. Festo Co., Ltd. provides pneumatic and electric technology and comprehensive solutions for factory automation and process automation. Its served industries include automotive, electronics and light assembly, food and beverage packaging, water technology, biotechnology and pharmaceuticals. Festo Didactic provides training solutions for industrial companies and educational institutions around the world. Through its Greater China business region, Festo coordinates production, sales and research resources to serve Taiwan customers and support the global expansion of Taiwan manufacturing.
Exhibits
Festo vacuum technology includes vacuum generators, vacuum suction cups, vacuum grippers and corresponding accessories for vacuum-based handling applications. Its vacuum generators operate according to the Venturi principle as purely pneumatic devices and can generate either high volume flow or high vacuum. The vacuum generators are compact and lightweight, can be installed in any position, require little maintenance and are used particularly in handling and automation technology. Vacuum suction cups and vacuum grippers connect the vacuum generator to the workpiece and are intended to make workpiece handling simple, economical and reliable. The listed materials are nitrile rubber, polyurethane, silicone and rubber, while suction-cup shapes include universal, flat, bellows and special types. Vacuum accessories include mounting and connection elements, compensation elements, vacuum indicators, vacuum filters, vacuum suction valves and vacuum-specific accessories. For semiconductor production, Festo offers standard components and customized automation solutions intended to keep processes stable, maintain high precision and minimize installation-space requirements while considering particle-generation and outgassing standards. Its semiconductor automation portfolio is designed for front-end, back-end and advanced-packaging processes such as hybrid bonding, with designs intended to minimize contamination, support long-term yield, reduce energy costs and lower carbon footprint. For high-vacuum applications, Festo provides automation solutions that can be used in cleanrooms for deposition, etching and ion implantation. For atmospheric processes, the company provides precision automation from PR coating through CMP and advanced packaging to support production efficiency and yield. The gate-valve control solution is applied to load-lock chambers, handling systems and process chambers and is designed to reduce door-valve switching impact, control multiple valves in one component, provide repeatability through digital parameter sets and enable traceability for Industrial IoT. In EFEM wafer-transfer equipment, a motion-terminal solution can fill the FOUP carrier with inert gas to reduce contamination particles generated when a valve switches. The N2 Purge system is intended for advanced wafer-manufacturing transportation and storage environments requiring AMC Free micro-contamination prevention, including STOCKER, FOUP, OHT and STB applications. Its N2 Purge functions include humidity control through flow and humidity sensing, piezo-valve flow control up to 200 liters per minute, ready-to-install integrated modules and the integration of multiple MFC units into a motion terminal. Festo's pneumatic N2 Purge solution is intended to reduce wafer oxidation and maintain a dry FOUP environment by combining sensors, flow controllers, proportional piezo-valve control and communication-based data collection and transmission. Digital pneumatic technology in the Festo motion terminal can control air-knife pressure and flow during blowing, while integrated smart sensors can perform control, diagnosis and self-learning tasks for optimized parameter combinations. The Lift Pin control solution targets the corrugated cylinder used for Lift Pin operation in semiconductor equipment and controls operating time, speed and accuracy for smooth, synchronous movement while standardizing adjustment and reducing maintenance time. Lift Pin options include a closed-loop VTEM solution for time, acceleration, deceleration and synchronous operation, and an open-loop customized solution that can upgrade original software and hardware without changes, with piezo-valve control described as shortening Tack Time and increasing productivity. Special-gas supply and chemical-polishing gas control units are used in semiconductor front-end processes and include functions that can shut off cylinder gas without a power source, use a special OR-valve design for uninterrupted system control and allow hot-swappable solenoid-valve replacement without shutting off the air supply. Customized gas-control options include a compact multi-channel manual safety circuit using manual and logic valves, a manual energy-storage cylinder-switch system that can automatically shut off gas cylinders without power, and a cylinder-driven red indicator for space-saving operational safety. Across its semiconductor automation solutions, Festo lists high-precision control of movement, pressure and media flow, clean design for required cleanliness and particle emission, space-saving installation, minimized power consumption and heat generation, AI/IoT readiness and worldwide availability through local manufacturing and delivery. The same portfolio also lists CopyExactly! requirements, personalized expert support, semiconductor-specific greases and seals to reduce unwanted outgassing, and repeat-accurate real-time control using AI. Custom semiconductor applications include temperature control for wafer chucks, process chambers and plasma generators, pin lifting and micropositioning with force detection, ALD valve control, safe purging and regeneration of vacuum chambers, and pilot control of UHP valves for process gases. For nitrogen purging, Festo describes benefits including higher yield, improved product quality, longer equipment life and a safer, more sustainable manufacturing process, and states that a nitrogen-purge system can reduce carbon emissions by up to 4%. The VEMD dynamic mass-flow controller uses proportional valves for quiet operation, while integrated electronics and sensors detect, regulate and proportionally dose the flow of air, oxygen, nitrogen, argon and CO2. Handling and motion products listed for semiconductor applications include the compact ERMO electric rotary unit, CMMT-AS servo drive, EMMT-AS and EMMT-EC servo motors, and the VTEP valve terminal for compact multi-channel pressure control at low flow rates. ERMO can serve as a precise front unit or compact rotary table, CMMT-AS supports point-to-point and interpolating motion across Ethernet-based bus systems, and EMMT-AS emphasizes controllability, path accuracy and reduced installation work through a single-cable solution. Festo states that its semiconductor support includes a global supply chain, a global guideline that takes CopyExactly! standards into account, and Semi F70.1 and ISO-certified automation solutions for cleanrooms. Cleanroom selection can be matched to classes under ISO 14644-1 or Semi F70.1, and cleanroom products can also be double-packaged on request. Festo AX uses AI and real-time data to monitor production processes, reduce downtime, monitor power consumption, avoid waste and provide predictive solutions for semiconductor production. Training solutions are offered so employees can prepare for the requirements of modern semiconductor production. The semiconductor product range is aimed at fab operators, production-system OEMs, front-end and back-end process engineers, advanced-packaging users, and developers and planners of complex electronics and microsystems equipment. Festo solutions can be used in semiconductor systems, wafer fabrication equipment and tools as well as sub-fabs, with components for gas supply, cooling circuits, vacuum technology and cleanroom motion solutions and a choice between widely available catalogue products and customer-specific systems. The company states that it has many years of semiconductor front-end, back-end and advanced-packaging experience, has developed much of its portfolio with the industry, and serves a customer base that includes almost all renowned international fabs and OEMs. Support services include engineering assistance, application advice, customized system solutions, condition monitoring, predictive maintenance, AI-based process optimization, training, worldwide technical support and fast spare-parts delivery. For service continuity, Festo also describes rapid failure analysis using modern techniques, a comprehensive change and phase-out management system and cleanroom-compatible products designed for process reliability and long service life. The Festo Experience Centre combines a technical-expert team with testing, experiments, display and training functions and uses an open-platform concept to focus on innovative applications and front-end technologies for the semiconductor industry.
Capabilities and products
- factory and process automation solutions
- semiconductor high-vacuum automation
- semiconductor atmospheric-process automation
- semiconductor gate-valve control
- FOUP N2 purge flow control
- Lift Pin pneumatic synchronization control
- special-gas and chemical-polishing gas control
- ALD valve control
- temperature control for wafer chucks, process chambers and plasma generators
- pilot control of UHP process-gas valves
- vacuum generators, suction cups and grippers
- AI process monitoring and prediction for semiconductor production
- training solutions for semiconductor production