At a glance
| Booth | T9060 |
| Country | KR |
| Website | femtoscience.co.kr |
Company profile
Femtoscience Inc. is a plasma-solution provider whose plasma technology is used for industrial surface treatment and material-surface modification. Plasma is described as the fourth state of matter after solid, liquid and gas, formed when energy ionizes gas atoms and molecules into neutral particles, radicals and photons. By using the chemical and physical properties of plasma, Femtoscience Inc. modifies material surfaces for processes that include cleaning, activation, coating-related modification and etching. Plasma cleaning can effectively decompose contaminants on a surface, while accelerated particles in an electrical field can remove surface material during etching. Reactive particles can also be bonded to a material surface to apply coatings, extending plasma treatment from removal processes to surface modification. Femtoscience Inc. uses a chamber design intended to maintain uniform plasma inside the chamber regardless of position. Its atmospheric-plasma approach is characterized by high throughput and convenience compared with other plasma types. Parylene Coating is presented as a CVD process that conformally coats a material surface with a thin layer having thickness in the μm~nm range. The company's plasma technology is applied to industrial fields including semiconductors, displays and medical devices, with applications continuing to be developed.
Exhibits
Femtoscience Inc. provides a full range of surface-treatment tools covering Plasma Cleaning, Plasma Activation, Etching and Parylene Coating. Plasma Cleaning is used to decompose surface contaminants, and Plasma Activation controls material surface energy to change wettability. Plasma Modifications use reactive particles bonded to the surface to apply coatings, while etching uses particles accelerated in an electrical field to remove surface material. The vacuum-plasma product range includes Vacuum Chamber Technology and Vacuum Plasma System solutions for research and business use. Its vacuum-chamber design maintains uniform gas flow inside the chamber regardless of position, distinguishing it from a conventional vacuum chamber design. The vacuum-chamber structures are divided into horizontal and vertical types according to the direction of gas flow. The chamber technology lists Plasma Etching Mode with a single-electrode configuration and PE / RIE (Reactive Ion Etching) Mode with a dual-electrode configuration. Atmospheric Plasma is offered as another system category and is described as combining high throughput with operational convenience. The Parylene Coating System uses a CVD process to place a conformal μm~nm thin layer on a material surface. Application fields explicitly listed for the plasma systems include semiconductors and MEMS, biomedical fields, new energy development, environmental engineering, and farming and food science. The semiconductor relevance of the portfolio therefore includes plasma cleaning, activation, surface modification, etching, vacuum plasma processing and conformal Parylene coating. Across these processes, the tools change surface cleanliness, wettability, deposited surface layers or removed surface material according to the selected plasma treatment. The combination of vacuum chamber technology and atmospheric plasma gives Femtoscience Inc. system approaches for both controlled chamber processing and high-throughput atmospheric treatment. The product portfolio connects fundamental plasma behavior with practical surface-treatment equipment for research, business and industrial applications.
Capabilities and products
- plasma cleaning
- plasma activation
- plasma etching
- plasma surface modification
- vacuum plasma systems
- atmospheric plasma systems
- Parylene CVD conformal coating
- uniform-gas-flow vacuum chambers
- PE/RIE dual-electrode plasma etching