At a glance
| Booth | I2924 |
| Country | TW |
| Website | www.favite.com/?doing_wp_cron=1614320302.9542040824890136718750 |
Company profile
FAVITE Inc. was established in 2000 and was subsequently listed on the Taiwan Stock Exchange in January 2008. The company states that it has continued to emphasize research and development and patent establishment while building sales in the TFT LCD, LTPS and AMOLED display industries. FAVITE Inc. has expanded into semiconductor, PCB, Mini LED and Micro LED fields in addition to its display-industry activities. Its core inspection offering is automatic optical inspection, or AOI, supplied to customers as a complete solution for defect detection and yield monitoring on factory production lines. The company lists AOI for TFT-LCD, OLED, Mini LED and Micro LED, together with Auto Image Capture Machine and CDOL Measurement Equipment. Additional capabilities listed by FAVITE Inc. include FOPLP RDL AOI, customized AOI for PCB, CIS AOI, Post Dicing AOI, Multi Function Auto OM (HORUS-2000) and customized AOI solutions. For semiconductor advanced packaging, the company provides customized inspection solutions for wafer-level packaging FOWLP and panel-level packaging FOPLP processes to support smart manufacturing.
Exhibits
The Horus A Series Wafer AI Auto OM provides AI real-time inspection and defect classification for semiconductor wafer inspection. Horus A is intended especially for defects in irregular and varied patterns and in products with complex backgrounds. The system integrates Z-stacking, field-of-view stitching and 2D metrology functions in the same inspection platform. Related inspection products include Multi Function Auto AI OM, Wallis M Series PCB and IC Substrate AI AOI, and FOPLP RDL fine-line defect inspection or AI Auto Review solutions. The Wallis L Series Glass Wafer Combo AOI provides line-scan high-throughput inspection and high-speed image capture. Wallis L supports front-surface inspection of 12-inch silicon wafers on metal frames as well as double-side surface and edge inspection of 12-inch glass wafers. The Wallis L configuration includes a 12-inch wafer and metal-frame EFEM, AI real-time defect classification and a yield-management system. Related semiconductor metrology products include a wafer-level 2.5D advanced-packaging and chiplet-integration die-shift metrology tool and a panel-level 2.5D advanced-packaging high-precision die-shift metrology tool. Horus A and Wallis L are classified within semiconductor metrology and wafer-AOI product families. Across FOWLP, FOPLP, PCB, CIS, post-dicing and wafer-inspection applications, FAVITE Inc. combines automated imaging, optical inspection, metrology, AI classification and yield management for production-line defect control.
Capabilities and products
- production-line AOI defect detection and yield monitoring
- TFT-LCD/OLED/Mini & Micro LED AOI
- automatic image-capture machines
- CDOL measurement equipment
- FOPLP RDL AOI
- customized AOI for PCB
- CIS AOI
- Post Dicing AOI
- customized inspection for FOWLP/FOPLP
- wafer AI real-time inspection and defect classification
- Z-stacking/FOV stitching/2D Metrology
- 12-inch silicon-wafer front-surface inspection
- 12-inch glass-wafer double-side and edge inspection
- PCB/IC-substrate AI AOI
- 2.5D advanced-packaging die-shift metrology